JPS5237996A - Epoxide resin and its producing process and its photopolymerizing method together with process for producing multilayered printed circuit board from same resin3 - Google Patents
Epoxide resin and its producing process and its photopolymerizing method together with process for producing multilayered printed circuit board from same resin3Info
- Publication number
- JPS5237996A JPS5237996A JP51096885A JP9688576A JPS5237996A JP S5237996 A JPS5237996 A JP S5237996A JP 51096885 A JP51096885 A JP 51096885A JP 9688576 A JP9688576 A JP 9688576A JP S5237996 A JPS5237996 A JP S5237996A
- Authority
- JP
- Japan
- Prior art keywords
- producing
- resin3
- circuit board
- printed circuit
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S522/904—Monomer or polymer contains initiating group
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB33678/75A GB1512814A (en) | 1975-08-13 | 1975-08-13 | Epoxide resins |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5237996A true JPS5237996A (en) | 1977-03-24 |
Family
ID=10356032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51096885A Pending JPS5237996A (en) | 1975-08-13 | 1976-08-13 | Epoxide resin and its producing process and its photopolymerizing method together with process for producing multilayered printed circuit board from same resin3 |
Country Status (9)
Country | Link |
---|---|
US (1) | US4074008A (ja) |
JP (1) | JPS5237996A (ja) |
CA (1) | CA1105193A (ja) |
CH (1) | CH626643A5 (ja) |
DE (1) | DE2635929A1 (ja) |
FR (1) | FR2320961A1 (ja) |
GB (1) | GB1512814A (ja) |
IT (1) | IT1064921B (ja) |
NL (1) | NL7608979A (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
US4171974A (en) * | 1978-02-15 | 1979-10-23 | Polychrome Corporation | Aqueous alkali developable negative working lithographic printing plates |
US4284574A (en) * | 1979-06-15 | 1981-08-18 | Ciba-Geigy Corporation | Diglycidyl ethers of di-secondary alcohols, their preparation, and curable compositions containing them |
US4286047A (en) * | 1979-07-25 | 1981-08-25 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification |
US4390615A (en) | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
US4292396A (en) * | 1980-03-03 | 1981-09-29 | Western Litho Plate & Supply Co. | Method for improving the press life of a lithographic image having an outer layer comprising an epoxy resin and article produced by method |
US4451122A (en) * | 1980-12-29 | 1984-05-29 | Beckman Instruments, Inc. | Multicompartment electro-optic display device |
EP0075537B2 (de) * | 1981-09-17 | 1991-03-20 | Ciba-Geigy Ag | Verfahren zum Beschichten gedruckter Schaltungen |
US4479983A (en) * | 1983-01-07 | 1984-10-30 | International Business Machines Corporation | Method and composition for applying coatings on printed circuit boards |
US4546067A (en) * | 1983-01-26 | 1985-10-08 | Ciba Geigy Corporation | Image production utilizing multifunctional light sensitive compounds |
GB8307220D0 (en) * | 1983-03-16 | 1983-04-20 | Ciba Geigy Ag | Production of images |
GB8418038D0 (en) * | 1984-07-16 | 1984-08-22 | Edgealpha Ltd | Lining of pipelines/passageways |
DE3679453D1 (de) * | 1985-06-05 | 1991-07-04 | Siemens Ag | Verfahren zum herstellen von gedruckten schaltungen unter verwendung eines durch strahlung vernetzenden fotopolymersystems. |
GB2213487B (en) * | 1987-12-08 | 1992-01-08 | Kansai Paint Co Ltd | Method of forming a cured coating film |
US5070002A (en) * | 1988-09-13 | 1991-12-03 | Amp-Akzo Corporation | Photoimageable permanent resist |
US5178988A (en) * | 1988-09-13 | 1993-01-12 | Amp-Akzo Corporation | Photoimageable permanent resist |
US5218061A (en) * | 1990-09-17 | 1993-06-08 | Nippon Kayaku Kabushiki Kaisha | Partially post-glycidylated epoxy resin, epoxy resin composition and cured product thereof |
JPH06258823A (ja) * | 1993-03-05 | 1994-09-16 | Sanyo Chem Ind Ltd | 感光性樹脂 |
TW270123B (ja) | 1993-07-02 | 1996-02-11 | Ciba Geigy | |
TW268011B (ja) * | 1993-07-02 | 1996-01-11 | Ciba Geigy | |
TW290583B (ja) * | 1993-10-14 | 1996-11-11 | Alpha Metals Ltd | |
EP0917547B1 (en) * | 1996-08-06 | 2001-11-21 | Vantico AG | Polyglycidyl ethers of secondary alcohols |
KR100337594B1 (ko) * | 1999-12-28 | 2002-05-23 | 조정원 | 광기능성 에폭시 화합물 함유 액정 디스플레이패널 봉지제 |
JP4637221B2 (ja) * | 2007-09-28 | 2011-02-23 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法 |
TWI461848B (zh) * | 2008-03-28 | 2014-11-21 | Fujifilm Corp | 正型感光性樹脂組成物及使用它的硬化膜形成方法 |
NL1039737C2 (en) | 2012-07-17 | 2014-01-20 | Hovis Internat B V | Mehod for the manufacture of a sorbic acid-based polymer network. |
US20200045425A1 (en) * | 2018-03-07 | 2020-02-06 | USound GmbH | Method of manufacturing a mems printed circuit board module and/or sound transducer assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3885060A (en) * | 1968-08-23 | 1975-05-20 | Hitachi Ltd | Production of insolubilized organic polymers |
CH576739A5 (ja) * | 1972-08-25 | 1976-06-15 | Ciba Geigy Ag | |
GB1464287A (en) * | 1974-02-22 | 1977-02-09 | Ciba Geigy Ag | Polymerisable esters |
-
1975
- 1975-08-13 GB GB33678/75A patent/GB1512814A/en not_active Expired
-
1976
- 1976-08-03 US US05/711,325 patent/US4074008A/en not_active Expired - Lifetime
- 1976-08-10 DE DE19762635929 patent/DE2635929A1/de not_active Ceased
- 1976-08-10 CH CH1017276A patent/CH626643A5/de not_active IP Right Cessation
- 1976-08-11 CA CA258,875A patent/CA1105193A/en not_active Expired
- 1976-08-12 FR FR7624610A patent/FR2320961A1/fr active Granted
- 1976-08-12 NL NL7608979A patent/NL7608979A/xx not_active Application Discontinuation
- 1976-08-12 IT IT7626251A patent/IT1064921B/it active
- 1976-08-13 JP JP51096885A patent/JPS5237996A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
GB1512814A (en) | 1978-06-01 |
IT1064921B (it) | 1985-02-25 |
CH626643A5 (ja) | 1981-11-30 |
NL7608979A (nl) | 1977-02-15 |
US4074008A (en) | 1978-02-14 |
CA1105193A (en) | 1981-07-14 |
FR2320961A1 (fr) | 1977-03-11 |
FR2320961B1 (ja) | 1978-05-05 |
DE2635929A1 (de) | 1977-03-03 |
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