IT1048271B - Processo per la preparazione di una composizione induribile utilizzabile per formare un rivestimento resistente al calore ed alla saldatura su un pannello per circuiti stampati - Google Patents

Processo per la preparazione di una composizione induribile utilizzabile per formare un rivestimento resistente al calore ed alla saldatura su un pannello per circuiti stampati

Info

Publication number
IT1048271B
IT1048271B IT49241/74A IT4924174A IT1048271B IT 1048271 B IT1048271 B IT 1048271B IT 49241/74 A IT49241/74 A IT 49241/74A IT 4924174 A IT4924174 A IT 4924174A IT 1048271 B IT1048271 B IT 1048271B
Authority
IT
Italy
Prior art keywords
panel
preparation
heat
resistant coating
printed circuits
Prior art date
Application number
IT49241/74A
Other languages
English (en)
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Application granted granted Critical
Publication of IT1048271B publication Critical patent/IT1048271B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
IT49241/74A 1973-03-13 1974-03-08 Processo per la preparazione di una composizione induribile utilizzabile per formare un rivestimento resistente al calore ed alla saldatura su un pannello per circuiti stampati IT1048271B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00340870A US3847767A (en) 1973-03-13 1973-03-13 Method of producing a screen printable photocurable solder resist

Publications (1)

Publication Number Publication Date
IT1048271B true IT1048271B (it) 1980-11-20

Family

ID=23335288

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49241/74A IT1048271B (it) 1973-03-13 1974-03-08 Processo per la preparazione di una composizione induribile utilizzabile per formare un rivestimento resistente al calore ed alla saldatura su un pannello per circuiti stampati

Country Status (8)

Country Link
US (1) US3847767A (it)
JP (1) JPS5026602A (it)
AR (1) AR197635A1 (it)
DE (1) DE2411398A1 (it)
FR (1) FR2221480A2 (it)
GB (1) GB1400988A (it)
IT (1) IT1048271B (it)
NL (1) NL7403278A (it)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
AT341792B (de) * 1974-08-02 1978-02-27 Siemens Ag Verfahren zur herstellung von schichtstrukturen
AT352406B (de) * 1974-08-02 1979-09-25 Siemens Ag Verfahren zur herstellung von reliefstrukturen
USRE30186E (en) * 1974-08-02 1980-01-08 Siemens Aktiengesellschaft Method for the preparation of relief structures
DE2437348B2 (de) * 1974-08-02 1976-10-07 Ausscheidung in: 24 62 105 Verfahren zur herstellung von reliefstrukturen
US4128430A (en) * 1975-11-13 1978-12-05 Columbia Ribbon And Carbon Manufacturing Co., Inc. Master sheets and process for printing same
JPS53103195A (en) * 1977-02-21 1978-09-08 Hitachi Ltd Preparing thick film resistor unit and thick film resistor unit paste
GB2030584B (en) * 1978-10-03 1983-03-23 Lankro Chem Ltd Photopolymerisable solder resist compositions
US4197173A (en) * 1978-10-19 1980-04-08 General Electric Company Photocurable polyene-polythiol-siloxane-polyester composition for coating
DE3000940C2 (de) * 1979-01-12 1984-02-02 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Abmischung für im Siebdruck aufzubringende Abdeckmasken und Schichtbildner
JPS6049437B2 (ja) * 1979-02-01 1985-11-01 住友化学工業株式会社 蝕刻による図柄作成方法
US4230740A (en) * 1979-04-23 1980-10-28 W. R. Grace & Co. Heat stable, non-yellowing photopolymer compositions
US4246147A (en) * 1979-06-04 1981-01-20 International Business Machines Corporation Screenable and strippable solder mask and use thereof
JPS56157408A (en) * 1980-05-09 1981-12-04 Ube Ind Ltd Photocurable composition
EP0044803A3 (de) * 1980-07-17 1984-08-15 Siemens Aktiengesellschaft Verfahren zum Herstellen einer mit elektrischen Bauelementen bestückten Leiterplatte
US4752553A (en) * 1982-04-01 1988-06-21 M&T Chemicals Inc. High resolution solder mask photopolymers for screen coating over circuit traces
JPS59224840A (ja) * 1984-04-12 1984-12-17 ダブリュー・アール・グレイス・アンド・カンパニー―コネチカット 印刷版の製造方法
US4740532A (en) * 1985-04-30 1988-04-26 Amp Incorporated Photocurable dielectric composition of acrylated urethane prepolymer
US4933376A (en) * 1987-05-06 1990-06-12 Mitsubishi Rayon Company Limited Photopolymerizable dental composition
JPH024891A (ja) * 1988-06-21 1990-01-09 Mitsubishi Rayon Co Ltd 歯科用接着剤組成物
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US5288526A (en) * 1993-02-11 1994-02-22 Nordson Corporation Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards
EP1796446B1 (en) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE793732A (fr) * 1972-01-10 1973-05-02 Grace W R & Co Composition contenant un polyene et un polythiol
US3770433A (en) * 1972-03-22 1973-11-06 Bell Telephone Labor Inc High sensitivity negative electron resist

Also Published As

Publication number Publication date
US3847767A (en) 1974-11-12
DE2411398A1 (de) 1974-09-26
NL7403278A (it) 1974-09-17
GB1400988A (en) 1975-07-16
FR2221480A2 (it) 1974-10-11
AR197635A1 (es) 1974-04-23
JPS5026602A (it) 1975-03-19

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