BR7506104A - Conjunto de pacote eletronico e processo para montar um tal pacote - Google Patents

Conjunto de pacote eletronico e processo para montar um tal pacote

Info

Publication number
BR7506104A
BR7506104A BR7506104*A BR7506104A BR7506104A BR 7506104 A BR7506104 A BR 7506104A BR 7506104 A BR7506104 A BR 7506104A BR 7506104 A BR7506104 A BR 7506104A
Authority
BR
Brazil
Prior art keywords
package
assemble
electronic
electronic package
package set
Prior art date
Application number
BR7506104*A
Other languages
English (en)
Inventor
R Morse
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of BR7506104A publication Critical patent/BR7506104A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
BR7506104*A 1975-01-13 1975-09-22 Conjunto de pacote eletronico e processo para montar um tal pacote BR7506104A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/540,579 US3934336A (en) 1975-01-13 1975-01-13 Electronic package assembly with capillary bridging connection

Publications (1)

Publication Number Publication Date
BR7506104A true BR7506104A (pt) 1976-08-17

Family

ID=24156052

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7506104*A BR7506104A (pt) 1975-01-13 1975-09-22 Conjunto de pacote eletronico e processo para montar um tal pacote

Country Status (5)

Country Link
US (1) US3934336A (pt)
JP (1) JPS5811099B2 (pt)
BR (1) BR7506104A (pt)
FR (1) FR2297539A1 (pt)
GB (1) GB1478102A (pt)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1485569A (en) * 1974-09-10 1977-09-14 Siemens Ag Multi-layer wired substrates for multi-chip circuits
JPS5814071B2 (ja) * 1977-12-24 1983-03-17 富士通株式会社 半導体装置の電極引出し構造
DE2858153C2 (de) * 1978-05-10 1984-10-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Ankleben eines elektrischen Bauteils mit einer flächenförmigen Elektrode an eine Trägerplatte
US4268891A (en) * 1978-09-13 1981-05-19 Gte Products Corporation Multilamp photoflash unit having grounded reflector
US4378902A (en) * 1981-02-17 1983-04-05 The Jade Corporation Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
US4477970A (en) * 1982-04-01 1984-10-23 Motorola, Inc. P.C. Board mounting method for surface mounted components
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
US4604678A (en) * 1983-07-18 1986-08-05 Frederick Parker Circuit board with high density electrical tracers
JPS61108953A (ja) * 1984-11-01 1986-05-27 Ngk Insulators Ltd セラミツクスを用いたセンサ素子の電気的接続端子
JPH0450400Y2 (pt) * 1985-02-15 1992-11-27
JPH0353007Y2 (pt) * 1985-02-20 1991-11-19
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US4690833A (en) * 1986-03-28 1987-09-01 International Business Machines Corporation Providing circuit lines on a substrate
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
JPS6423598U (pt) * 1987-08-04 1989-02-08
US4893216A (en) * 1988-08-09 1990-01-09 Northern Telecom Limited Circuit board and method of soldering
US4889962A (en) * 1988-08-19 1989-12-26 Northern Telecom Limited Circuit board with coaxial circuit and method therefor
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
US5055637A (en) * 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces
US5192622A (en) * 1991-08-09 1993-03-09 International Business Machines Corporation Low-cost ternary composite for use in vias in glass-ceramic structures
JP3724592B2 (ja) * 1993-07-26 2005-12-07 ハイニックス セミコンダクター アメリカ インコーポレイテッド 半導体基板の平坦化方法
US6091332A (en) * 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
FR2823011B1 (fr) * 2001-03-30 2004-11-19 Gemplus Card Int Connexion par depot de cordon conductrice sur zone de raccordement delimitee par masque isolant
US6674506B2 (en) 2001-11-29 2004-01-06 Eastman Kodak Company Apparatus for introducing a fluid into vias formed in a liquid crystal display element
US6924866B2 (en) * 2001-11-29 2005-08-02 Eastman Kodak Company Method of constructing a liquid crystal display element that includes dispensing an optical grade adhesive to fill vias in a transparent substrate
US6619334B2 (en) 2001-11-29 2003-09-16 Eastman Kodak Company Method of delivering fluid into constricted openings free of voids
US6476902B1 (en) 2001-11-29 2002-11-05 Eastman Kodak Company Liquid crystal display and method of making same
US7525240B2 (en) * 2004-04-26 2009-04-28 Tdk Corporation Electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3316458A (en) * 1965-01-29 1967-04-25 Hughes Aircraft Co Electronic circuit assembly with recessed substrate mounting means
US3706915A (en) * 1970-03-09 1972-12-19 Gen Electric Semiconductor device with low impedance bond
US3728469A (en) * 1971-03-11 1973-04-17 Owens Illinois Inc Cavity structure
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
JPS4943872U (pt) * 1972-07-20 1974-04-17

Also Published As

Publication number Publication date
JPS5811099B2 (ja) 1983-03-01
GB1478102A (en) 1977-06-29
JPS5181573A (pt) 1976-07-16
US3934336A (en) 1976-01-27
FR2297539A1 (fr) 1976-08-06
FR2297539B1 (pt) 1978-09-22

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