IT1008452B - Metodo per ottenere componenti elettrici montati su circuiti stam pati - Google Patents

Metodo per ottenere componenti elettrici montati su circuiti stam pati

Info

Publication number
IT1008452B
IT1008452B IT49419/74A IT4941974A IT1008452B IT 1008452 B IT1008452 B IT 1008452B IT 49419/74 A IT49419/74 A IT 49419/74A IT 4941974 A IT4941974 A IT 4941974A IT 1008452 B IT1008452 B IT 1008452B
Authority
IT
Italy
Prior art keywords
electrical components
components mounted
printed circuits
obtaining electrical
obtaining
Prior art date
Application number
IT49419/74A
Other languages
English (en)
Italian (it)
Original Assignee
Lucas Aerospace Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Aerospace Ltd filed Critical Lucas Aerospace Ltd
Application granted granted Critical
Publication of IT1008452B publication Critical patent/IT1008452B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IT49419/74A 1973-03-13 1974-03-21 Metodo per ottenere componenti elettrici montati su circuiti stam pati IT1008452B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1204173A GB1461768A (en) 1973-03-13 1973-03-13 Mounting electrical components on thick film printed circuit elements

Publications (1)

Publication Number Publication Date
IT1008452B true IT1008452B (it) 1976-11-10

Family

ID=9997369

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49419/74A IT1008452B (it) 1973-03-13 1974-03-21 Metodo per ottenere componenti elettrici montati su circuiti stam pati

Country Status (6)

Country Link
US (1) US3881245A (cg-RX-API-DMAC10.html)
JP (1) JPS5346267B2 (cg-RX-API-DMAC10.html)
DE (1) DE2411303C3 (cg-RX-API-DMAC10.html)
FR (1) FR2221897B1 (cg-RX-API-DMAC10.html)
GB (1) GB1461768A (cg-RX-API-DMAC10.html)
IT (1) IT1008452B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5412166A (en) * 1993-06-25 1995-05-02 United Technologies Automotive, Inc. Power window switch control apparatus
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
DE102009033650A1 (de) * 2009-07-17 2011-01-20 Automotive Lighting Reutlingen Gmbh Verfahren und Verbindung eines elektronischen Bauteils mit einer Leiterplatte

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2898519A (en) * 1955-11-14 1959-08-04 Erie Resistor Corp Printed circuit assembly
US3141998A (en) * 1960-02-24 1964-07-21 Harry G Silkman Cooled modular electronic package
US3290557A (en) * 1962-02-23 1966-12-06 Sippican Corp Wiring device with selectively severable conductor for forming predetermined circuit pattern
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3437882A (en) * 1966-01-14 1969-04-08 Texas Instruments Inc Circuit board structure with interconnecting means
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3546539A (en) * 1968-05-28 1970-12-08 Texas Instruments Inc Integrated circuit mounting panel
US3693252A (en) * 1969-08-21 1972-09-26 Globe Union Inc A method of providing environmental protection for electrical circuit assemblies
US3704515A (en) * 1969-12-10 1972-12-05 Burroughs Corp Method for mounting connectors on printed circuit boards

Also Published As

Publication number Publication date
JPS5026068A (cg-RX-API-DMAC10.html) 1975-03-18
US3881245A (en) 1975-05-06
FR2221897B1 (cg-RX-API-DMAC10.html) 1979-07-27
DE2411303B2 (cg-RX-API-DMAC10.html) 1978-07-06
JPS5346267B2 (cg-RX-API-DMAC10.html) 1978-12-12
DE2411303C3 (de) 1979-03-15
FR2221897A1 (cg-RX-API-DMAC10.html) 1974-10-11
DE2411303A1 (de) 1974-09-19
GB1461768A (en) 1977-01-19

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