IT1017830B - Dispositivo di connessione per circuiti elettrici - Google Patents

Dispositivo di connessione per circuiti elettrici

Info

Publication number
IT1017830B
IT1017830B IT25882/74A IT2588274A IT1017830B IT 1017830 B IT1017830 B IT 1017830B IT 25882/74 A IT25882/74 A IT 25882/74A IT 2588274 A IT2588274 A IT 2588274A IT 1017830 B IT1017830 B IT 1017830B
Authority
IT
Italy
Prior art keywords
connection device
electrical circuits
circuits
electrical
connection
Prior art date
Application number
IT25882/74A
Other languages
English (en)
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Application granted granted Critical
Publication of IT1017830B publication Critical patent/IT1017830B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT25882/74A 1973-08-24 1974-08-02 Dispositivo di connessione per circuiti elettrici IT1017830B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7330787A FR2241946B1 (it) 1973-08-24 1973-08-24

Publications (1)

Publication Number Publication Date
IT1017830B true IT1017830B (it) 1977-08-10

Family

ID=9124297

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25882/74A IT1017830B (it) 1973-08-24 1974-08-02 Dispositivo di connessione per circuiti elettrici

Country Status (3)

Country Link
US (1) US3898370A (it)
FR (1) FR2241946B1 (it)
IT (1) IT1017830B (it)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159508A (en) * 1975-12-22 1979-06-26 Fujitsu Limited Multilayer printed wiring board
JPS53129863A (en) * 1977-04-19 1978-11-13 Fujitsu Ltd Multilayer printed board
US4095866A (en) * 1977-05-19 1978-06-20 Ncr Corporation High density printed circuit board and edge connector assembly
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
US4157785A (en) * 1977-10-31 1979-06-12 Carrier Corporation Safety connection for a retrofit flue damper
US4369479A (en) * 1980-01-07 1983-01-18 General Electric Company Safety power cutoff for appliances
US4504821A (en) * 1982-01-15 1985-03-12 General Electric Company Integrated circuit board system and an integrated circuit board assembly for application thereto
US4535388A (en) * 1984-06-29 1985-08-13 International Business Machines Corporation High density wired module
EP0183936A1 (de) * 1984-11-28 1986-06-11 Contraves Ag Multisubstrat-Schaltungsanordnung und Verfahren zur Herstellung der elektrischer Verbindungen
JPS61131498A (ja) * 1984-11-29 1986-06-19 富士通株式会社 終端回路配線構造
JPS6288346A (ja) * 1985-10-15 1987-04-22 Hitachi Ltd 多層配線基板
US4868634A (en) * 1987-03-13 1989-09-19 Citizen Watch Co., Ltd. IC-packaged device
US6274824B1 (en) 1997-03-31 2001-08-14 Visteon Global Technologies, Inc. Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
DE10205450A1 (de) * 2002-02-08 2003-08-28 Infineon Technologies Ag Schaltungsträger und Herstellung desselben

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3193731A (en) * 1961-08-21 1965-07-06 Automatic Elect Lab Printed matrix board assembly
US3564114A (en) * 1967-09-28 1971-02-16 Loral Corp Universal multilayer printed circuit board
US3796848A (en) * 1972-10-06 1974-03-12 Bell Telephone Labor Inc Pin connector switch

Also Published As

Publication number Publication date
US3898370A (en) 1975-08-05
FR2241946B1 (it) 1976-11-19
FR2241946A1 (it) 1975-03-21

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