DE2411303C3 - Verfahren zum Verbinden eines plättchenförmigen elektrischen Bauelements mit einer Dickschicht-Schaltungsträgerplatte - Google Patents

Verfahren zum Verbinden eines plättchenförmigen elektrischen Bauelements mit einer Dickschicht-Schaltungsträgerplatte

Info

Publication number
DE2411303C3
DE2411303C3 DE2411303A DE2411303A DE2411303C3 DE 2411303 C3 DE2411303 C3 DE 2411303C3 DE 2411303 A DE2411303 A DE 2411303A DE 2411303 A DE2411303 A DE 2411303A DE 2411303 C3 DE2411303 C3 DE 2411303C3
Authority
DE
Germany
Prior art keywords
component
circuit board
thick
conductor tracks
metal strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2411303A
Other languages
German (de)
English (en)
Other versions
DE2411303B2 (cg-RX-API-DMAC10.html
DE2411303A1 (de
Inventor
Jeffrey Leoman Olton Solihull Dudley
John Christopher Lindley Park Nuneaton Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Publication of DE2411303A1 publication Critical patent/DE2411303A1/de
Publication of DE2411303B2 publication Critical patent/DE2411303B2/de
Application granted granted Critical
Publication of DE2411303C3 publication Critical patent/DE2411303C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE2411303A 1973-03-13 1974-03-09 Verfahren zum Verbinden eines plättchenförmigen elektrischen Bauelements mit einer Dickschicht-Schaltungsträgerplatte Expired DE2411303C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1204173A GB1461768A (en) 1973-03-13 1973-03-13 Mounting electrical components on thick film printed circuit elements

Publications (3)

Publication Number Publication Date
DE2411303A1 DE2411303A1 (de) 1974-09-19
DE2411303B2 DE2411303B2 (cg-RX-API-DMAC10.html) 1978-07-06
DE2411303C3 true DE2411303C3 (de) 1979-03-15

Family

ID=9997369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2411303A Expired DE2411303C3 (de) 1973-03-13 1974-03-09 Verfahren zum Verbinden eines plättchenförmigen elektrischen Bauelements mit einer Dickschicht-Schaltungsträgerplatte

Country Status (6)

Country Link
US (1) US3881245A (cg-RX-API-DMAC10.html)
JP (1) JPS5346267B2 (cg-RX-API-DMAC10.html)
DE (1) DE2411303C3 (cg-RX-API-DMAC10.html)
FR (1) FR2221897B1 (cg-RX-API-DMAC10.html)
GB (1) GB1461768A (cg-RX-API-DMAC10.html)
IT (1) IT1008452B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5412166A (en) * 1993-06-25 1995-05-02 United Technologies Automotive, Inc. Power window switch control apparatus
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
DE102009033650A1 (de) * 2009-07-17 2011-01-20 Automotive Lighting Reutlingen Gmbh Verfahren und Verbindung eines elektronischen Bauteils mit einer Leiterplatte

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2898519A (en) * 1955-11-14 1959-08-04 Erie Resistor Corp Printed circuit assembly
US3141998A (en) * 1960-02-24 1964-07-21 Harry G Silkman Cooled modular electronic package
US3290557A (en) * 1962-02-23 1966-12-06 Sippican Corp Wiring device with selectively severable conductor for forming predetermined circuit pattern
US3200020A (en) * 1963-12-23 1965-08-10 Gen Precision Inc Method of making a weldable printed circuit
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
US3437882A (en) * 1966-01-14 1969-04-08 Texas Instruments Inc Circuit board structure with interconnecting means
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3546539A (en) * 1968-05-28 1970-12-08 Texas Instruments Inc Integrated circuit mounting panel
US3693252A (en) * 1969-08-21 1972-09-26 Globe Union Inc A method of providing environmental protection for electrical circuit assemblies
US3704515A (en) * 1969-12-10 1972-12-05 Burroughs Corp Method for mounting connectors on printed circuit boards

Also Published As

Publication number Publication date
JPS5026068A (cg-RX-API-DMAC10.html) 1975-03-18
IT1008452B (it) 1976-11-10
US3881245A (en) 1975-05-06
FR2221897B1 (cg-RX-API-DMAC10.html) 1979-07-27
DE2411303B2 (cg-RX-API-DMAC10.html) 1978-07-06
JPS5346267B2 (cg-RX-API-DMAC10.html) 1978-12-12
FR2221897A1 (cg-RX-API-DMAC10.html) 1974-10-11
DE2411303A1 (de) 1974-09-19
GB1461768A (en) 1977-01-19

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee