IN2015DN02693A - - Google Patents
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- Publication number
- IN2015DN02693A IN2015DN02693A IN2693DEN2015A IN2015DN02693A IN 2015DN02693 A IN2015DN02693 A IN 2015DN02693A IN 2693DEN2015 A IN2693DEN2015 A IN 2693DEN2015A IN 2015DN02693 A IN2015DN02693 A IN 2015DN02693A
- Authority
- IN
- India
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013035506A JP6163782B2 (en) | 2013-02-26 | 2013-02-26 | Wiring structure, method for manufacturing wiring structure, droplet discharge head, and droplet discharge apparatus |
PCT/JP2014/000962 WO2014132617A1 (en) | 2013-02-26 | 2014-02-24 | Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2015DN02693A true IN2015DN02693A (en) | 2015-09-04 |
Family
ID=50382522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN2693DEN2015 IN2015DN02693A (en) | 2013-02-26 | 2015-04-01 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9579892B2 (en) |
JP (1) | JP6163782B2 (en) |
CN (1) | CN104981352B (en) |
IN (1) | IN2015DN02693A (en) |
WO (1) | WO2014132617A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016083861A (en) * | 2014-10-27 | 2016-05-19 | セイコーエプソン株式会社 | Liquid jet head, and liquid jet device |
JP6443146B2 (en) * | 2015-03-16 | 2018-12-26 | セイコーエプソン株式会社 | Electronic devices |
JP6623474B2 (en) * | 2016-03-28 | 2019-12-25 | 北川工業株式会社 | Heat conductive member, method for manufacturing heat conductive member, and heat conductive structure |
JP6869675B2 (en) * | 2016-09-23 | 2021-05-12 | 東芝テック株式会社 | Inkjet head and manufacturing method of inkjet head |
US11372177B2 (en) * | 2020-04-21 | 2022-06-28 | Ii-Vi Delaware, Inc. | Pluggable transceiver retainer |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0574989A (en) | 1991-09-13 | 1993-03-26 | Matsushita Electric Ind Co Ltd | Multichip module mounting structure |
JP3178490B2 (en) * | 1993-06-23 | 2001-06-18 | セイコーエプソン株式会社 | Inkjet head |
JPH07235621A (en) * | 1994-02-22 | 1995-09-05 | Ibiden Co Ltd | Leadless chip carrier and manufacture thereof |
JP3111374B2 (en) * | 1995-03-08 | 2000-11-20 | 横河電機株式会社 | Tire pressure monitoring system |
JPH10229144A (en) | 1997-02-18 | 1998-08-25 | Mitsubishi Electric Corp | Semiconductor device |
DE19917034C1 (en) * | 1999-04-15 | 2000-11-23 | Continental Ag | Method for monitoring the air pressure in the tires of a motor vehicle |
JP3858545B2 (en) * | 1999-12-27 | 2006-12-13 | セイコーエプソン株式会社 | Semiconductor module and electronic device |
JP4577980B2 (en) | 2000-12-13 | 2010-11-10 | 京セラ株式会社 | Mounting board |
US6911733B2 (en) * | 2002-02-28 | 2005-06-28 | Hitachi, Ltd. | Semiconductor device and electronic device |
JP2003318317A (en) | 2002-04-25 | 2003-11-07 | Kyocera Corp | Electronic device and its manufacturing method |
JP4165478B2 (en) * | 2003-11-07 | 2008-10-15 | セイコーエプソン株式会社 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
JP3956955B2 (en) | 2004-04-22 | 2007-08-08 | セイコーエプソン株式会社 | Semiconductor substrate manufacturing method, electro-optical device manufacturing method |
JP4737502B2 (en) | 2004-11-11 | 2011-08-03 | ソニー株式会社 | Wiring connection method and display device manufacturing method |
JP2006159492A (en) | 2004-12-03 | 2006-06-22 | Seiko Epson Corp | Light exposure head, and image forming device |
JP4581664B2 (en) | 2004-12-08 | 2010-11-17 | セイコーエプソン株式会社 | Semiconductor substrate manufacturing method, semiconductor element manufacturing method, and electro-optical device manufacturing method |
JP4356683B2 (en) | 2005-01-25 | 2009-11-04 | セイコーエプソン株式会社 | Device mounting structure and device mounting method, droplet discharge head and connector, and semiconductor device |
JP4492520B2 (en) | 2005-01-26 | 2010-06-30 | セイコーエプソン株式会社 | Droplet discharge head and droplet discharge device. |
JP5023488B2 (en) | 2005-03-09 | 2012-09-12 | セイコーエプソン株式会社 | Device mounting structure and device mounting method, droplet discharge head, drive unit, and semiconductor device |
JP4483738B2 (en) | 2005-08-19 | 2010-06-16 | セイコーエプソン株式会社 | Device mounting structure, device mounting method, electronic apparatus, droplet discharge head, and droplet discharge apparatus |
JP2007050639A (en) | 2005-08-19 | 2007-03-01 | Seiko Epson Corp | Device mounting structure, device mounting method, electronic device, droplet ejecting head, and droplet ejector |
JP5082285B2 (en) * | 2006-04-25 | 2012-11-28 | セイコーエプソン株式会社 | Wiring structure, device, device manufacturing method, droplet discharge head, droplet discharge head manufacturing method, and droplet discharge apparatus |
US7677701B2 (en) * | 2006-09-28 | 2010-03-16 | Lexmark International, Inc. | Micro-fluid ejection head with embedded chip on non-conventional substrate |
JP2009269314A (en) | 2008-05-08 | 2009-11-19 | Seiko Epson Corp | Liquid droplet delivering head and liquid droplet delivering apparatus |
JP2011071417A (en) * | 2009-09-28 | 2011-04-07 | Murata Mfg Co Ltd | Manufacturing method of wiring substrate |
JP2011249481A (en) | 2010-05-25 | 2011-12-08 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring substrate, and method of manufacturing semiconductor package |
JP2012051253A (en) * | 2010-09-01 | 2012-03-15 | Toshiba Tec Corp | Inkjet head and method of manufacturing the inkjet head |
-
2013
- 2013-02-26 JP JP2013035506A patent/JP6163782B2/en active Active
-
2014
- 2014-02-24 US US14/442,061 patent/US9579892B2/en active Active
- 2014-02-24 WO PCT/JP2014/000962 patent/WO2014132617A1/en active Application Filing
- 2014-02-24 CN CN201480008068.2A patent/CN104981352B/en active Active
-
2015
- 2015-04-01 IN IN2693DEN2015 patent/IN2015DN02693A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6163782B2 (en) | 2017-07-19 |
JP2014162120A (en) | 2014-09-08 |
US20150343769A1 (en) | 2015-12-03 |
US9579892B2 (en) | 2017-02-28 |
CN104981352A (en) | 2015-10-14 |
WO2014132617A1 (en) | 2014-09-04 |
CN104981352B (en) | 2017-03-08 |