JP2009269314A - Liquid droplet delivering head and liquid droplet delivering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid droplet delivering head which attains miniaturization and is excellent in reliability by preventing erroneous operation, and to provide a liquid droplet delivering apparatus. <P>SOLUTION: The liquid droplet delivering head 1 includes a first flexible substrate 27 and a second flexible substrate 28 which connect lead electrodes 47 of driving elements 23 exposed to an opening part of a reservoir forming substrate 25 with driver ICs 26. The first flexible substrate 27 and the second flexible substrate 28 have a connecting part 27b connected to the lead electrode 47, and wiring parts 27c and 28c where a plurality of first wiring patterns 72 for supplying a signal to the driver IC 26 are formed, respectively. The wiring part 28c of the second flexible substrate 28 overlaps on the driver IC 26 mounted on the first flexible substrate 27. A shield part 27d with a conductive film pattern is arranged between the first flexible substrate 27 and the second flexible substrate 28. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a droplet discharge head and a droplet discharge device.

  A droplet discharge method (inkjet method) has been proposed as one method for manufacturing a microdevice. This droplet discharge method is a method in which a functional liquid containing a material for forming a device is formed into droplets and discharged from a droplet discharge head. Patent Document 1 below discloses an example of a technique related to a droplet discharge head (inkjet recording head). The droplet discharge head disclosed in Patent Document 1 has a structure in which a driving element (piezoelectric element) is connected to a driving device (driver IC) by wire bonding (for example, Patent Document 1).

By the way, when manufacturing a microdevice based on the droplet discharge method, in order to meet the demand for further miniaturization of the microdevice, the distance between nozzle openings provided in the droplet discharge head (nozzle pitch) Is desired to be as small (narrow) as possible. Since a plurality of drive elements are provided corresponding to the nozzle openings, if the nozzle pitch is reduced, the distance between the drive elements needs to be reduced (shortened) corresponding to the nozzle pitch.
JP 2006-330843 A JP 2006-68989 A

  However, if the interval between the drive elements is narrowed, when connecting each of the plurality of drive elements and the driver IC by wire bonding, the number of wires is large, so that a short circuit is caused between adjacent wires (wirings). Wiring (mounting) is very difficult to perform wire bonding to suppress, workability is significantly reduced, and a long time is required for wire bonding mounting.

Therefore, in order to solve the problem caused by the connection by such wire bonding, an outer lead bonding (OLB) is used by using a flexible substrate (flexible substrate) in which a wiring pattern functioning as an outer lead is formed in advance. ) It has been considered to make electrical connection between the drive element (piezoelectric element) and the drive device (driver IC) without causing inconvenience such as short-circuiting of the wires by connecting (for example, Patent Document 2).
By using the OLB connection, a large amount of wiring can be connected at once, so that the working time is greatly reduced.

  As a structure of such a droplet discharge head, flexible substrates having OLB connection portions are respectively connected in a total of four cavities (openings) in 2 columns × 2 rows formed in a silicon substrate, With this flexible substrate, the signal lines of the drive circuit section and the terminal sections of the drive elements existing in the openings are electrically connected. However, the plurality of flexible substrates are drawn out from the respective openings in a plurality of directions of the silicon substrate, and it is difficult to reduce the size of the head.

  The present invention has been made in view of the above-described problems of the prior art, and provides a droplet discharge head and a droplet discharge device that are excellent in reliability by reducing the size and preventing malfunction. It is aimed.

  In order to solve the above problems, a droplet discharge head according to the present invention is provided on the first substrate, a plurality of drive elements provided on the first substrate, and the plurality of drive elements on the first substrate. A second substrate formed on the second substrate; a plurality of drive circuit portions provided on the second substrate; and a terminal portion of the drive element exposed at the opening of the second substrate and the drive circuit portion. A first flexible substrate and a second flexible substrate, wherein the first flexible substrate and the second flexible substrate are connected to the terminal portion, and a plurality of wiring patterns for supplying signals to the drive circuit portion And the wiring portion of the second flexible substrate overlaps the driving circuit portion mounted on the first flexible substrate, and the wiring portion on the driving circuit portion is overlaid on the driving circuit portion. 1st flexi And Le substrate between the second flexible substrate, wherein the shield part having a conductive film pattern is disposed.

In the case of a structure in which the wiring portion of the second flexible substrate overlaps the drive circuit portion mounted on the first flexible substrate, the drive circuit portion may be affected by the noise of the second flexible substrate. In the invention, since the shield part in which the conductive film pattern is formed is disposed between the first flexible board and the second flexible board that overlap each other on the drive circuit part, the drive circuit part is provided with the shield from the second flexible board. It is possible to prevent the influence of noise. As a result, it is possible to obtain a liquid droplet ejection head excellent in reliability by preventing malfunction of the drive circuit section.
In addition, the above configuration eliminates the restriction on the pulling direction of the first and second flexible substrates, so that the entire head can be reduced in size.

Moreover, it is preferable that the said electrically conductive film pattern of the said shield part is connected to the said wiring pattern of a said 2nd flexible substrate.
According to the present invention, since the conductive film pattern of the shield part of the first flexible substrate is connected to the wiring pattern of the second flexible substrate, they can be made to have the same electric potential and have a high noise shielding effect. .

Further, it is preferable that an insulating film having an opening is provided on the conductive film pattern of the shield part, and the conductive film pattern and the plurality of wiring patterns are connected through the opening.
According to the present invention, it is possible to avoid connection between a wiring pattern other than the wiring pattern connected to the conductive film pattern and the conductive film pattern.

Moreover, it is preferable that the said shield part is formed integrally with the said 1st flexible substrate, and overlaps with the said 2nd flexible substrate by planar view by folding.
According to the present invention, since the shield part is formed integrally with the first flexible substrate, the number of parts is reduced, the manufacturing becomes simple, and the handling becomes easy.

Moreover, it is preferable that the said electrically conductive film pattern is formed in the surface on the opposite side to the surface in which the said some wiring pattern of the said 1st flexible substrate was formed.
According to the present invention, since it has a double-sided wiring structure, it can be used without changing the shape of the first flexible substrate. Therefore, it is possible to manufacture without reducing the yield, and it is possible to prevent an increase in manufacturing cost.

Moreover, it is preferable that the said electrically conductive film pattern is formed in the magnitude | size which covers the circuit element part and terminal of the said drive circuit part of a said 1st flexible substrate.
According to the present invention, noise can be shielded without affecting the drive circuit unit, so that a highly reliable head can be obtained.

Moreover, it is preferable that the said wiring part of the said 1st flexible substrate and the said wiring part of the said 2nd flexible substrate are pulled out to the same edge part of the said 2nd board | substrate.
According to the present invention, since the wiring portions of the first and second flexible boards extend in the same direction (drawn in the same direction from the respective openings), the entire head can be reduced in size. .

Moreover, it is preferable that the said shield part is arrange | positioned at the active surface side of the said drive circuit part of a said 1st flexible substrate.
According to the present invention, since the shield portion is disposed on the active surface side of the drive circuit portion that is susceptible to noise, a highly reliable droplet discharge head that prevents malfunction of the drive circuit portion in OLB mounting is provided. Obtainable.

A droplet discharge apparatus according to the present invention includes the droplet discharge head described above.
According to the present invention, since the liquid droplet ejection head configured to prevent the malfunction of the drive circuit unit is provided, the liquid droplet ejection apparatus itself is also highly reliable with the malfunction of the drive circuit unit prevented. Become. Further, the size of the entire apparatus can be reduced by the downsized head.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. Then, the short side direction (nozzle arrangement direction) of the droplet discharge head is the X axis direction, the long direction (direction perpendicular to the X axis direction) of the droplet discharge head is the Y axis direction, and the thickness direction of the droplet discharge head. A direction (that is, a direction orthogonal to the X-axis direction and the Y-axis direction) is defined as a Z-axis direction.

<First Embodiment of Droplet Discharge Head>
A first embodiment of a droplet discharge head of the present invention will be described with reference to FIGS. 1 is an external perspective view showing a first embodiment of a droplet discharge head, FIG. 2 is a partially cutaway perspective view of the droplet discharge head viewed from the nozzle opening side, and FIG. 3 is a line AA in FIG. 4 is a cross-sectional view taken along the line BB in FIG. 1, FIG. 5 is an enlarged cross-sectional view showing the main part of FIG. 3, FIG. 6 is a plan view of the first flexible substrate, and FIG. FIG. 8 is a cross-sectional view showing an enlarged main part of FIG. 4, and FIG. 8 is a plan view of the second flexible substrate.
The droplet discharge head 1 includes a driver IC 26 (driving circuit unit) and a substrate formed with a piezoelectric element 23 (driving element) driven by the driver IC 26 as shown in FIGS. It is configured to eject liquid droplets.

  The droplet discharge head 1 includes a nozzle substrate 21, a flow path forming substrate 22 (first substrate) provided on the upper surface of the nozzle substrate 21, and a piezoelectric element 23 provided on the upper surface of the flow path forming substrate 22. Displaceable diaphragm 24, reservoir forming substrate 25 (second substrate) provided on the upper surface of diaphragm 24, and piezoelectric element 23 and driver IC 26 provided on the upper surface side of reservoir forming substrate 25 are electrically connected. The first flexible board 27 and the second flexible board 28 are provided.

  The nozzle substrate 21 is made of, for example, stainless steel or glass ceramic, and is formed with a plurality of nozzle openings 31 that are through-holes penetrating the nozzle substrate 21 and eject functional liquid droplets. A plurality of nozzle openings 31 formed side by side in the Y-axis direction constitute first to fourth nozzle opening groups 31A to 31D. Here, the first nozzle opening group 31A and the second nozzle opening group 31B are arranged to face each other in the X-axis direction, and the third nozzle opening group 31C and the fourth nozzle opening group 31D are arranged to face each other in the X-axis direction. . The third nozzle opening group 31C is formed adjacent to the first nozzle opening group 31A in the Y-axis direction, and the fourth nozzle opening group 31D is adjacent to the second nozzle opening group 31B in the Y-axis direction. It is formed to fit.

  In FIG. 2, the first to fourth nozzle opening groups 31 </ b> A to 31 </ b> D are shown to be configured by six nozzle openings 31, but actually, for example, about 720 nozzle openings. 31 is formed.

The flow path forming substrate 22 is formed of, for example, a rigid silicon single crystal, and the plurality of partition walls 35 are formed by anisotropically etching the silicon single crystal substrate that is the base material of the flow path forming substrate 22. ing.
Further, the nozzle substrate 21 is fixed to the lower surface of the flow path forming substrate 22 via, for example, an adhesive or a heat welding film, and the vibration plate 24 is provided on the upper surface of the flow path forming substrate 22.

  A pressure generating chamber 36 in which the functional liquid discharged from the nozzle opening 31 is disposed is formed by a space surrounded by the flow path forming substrate 22 having the plurality of partition walls 35, the nozzle substrate 21, and the vibration plate 24. Has been. A plurality of the pressure generating chambers 36 are formed side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 31 constituting each of the first to fourth nozzle opening groups 31A to 31D.

  The first pressure generation chamber group 36A is constituted by a plurality of pressure generation chambers 36 formed corresponding to the first nozzle opening group 31A. Similarly, the second pressure generation chamber group 36B is configured by the plurality of pressure generation chambers 36 corresponding to the second nozzle opening group 31B, and the third pressure generation chamber 36B is configured by the plurality of pressure generation chambers 36 corresponding to the third nozzle opening group 31C. The chamber group 36C is configured, and the fourth pressure generating chamber group 36D is configured by the plurality of pressure generating chambers 36 corresponding to the fourth nozzle opening group 31D. The first pressure generation chamber group 36A and the second pressure generation chamber group 36B are arranged to face each other in the X-axis direction, and the third pressure generation chamber group 36C and the fourth pressure generation chamber group 36D are related to the X-axis direction. It arrange | positions so that it may mutually oppose.

One end portions of the plurality of pressure generation chambers 36 constituting the first pressure generation chamber group 36 </ b> A are communicated with each other by a communication portion 39 via a supply path 38 constituting a part of the reservoir 37. The communication portion 39 is a through hole formed in the flow path forming substrate 22 and is connected to a reservoir portion 51 described later.
Similarly, the end portions of the pressure generation chambers 36 constituting the second pressure generation chamber group 36B to the fourth pressure generation chamber group 36D are also connected to each other by the communication portion 39 via the supply path 38.

  The vibration plate 24 disposed between the flow path forming substrate 22 and the reservoir forming substrate 25 is provided on the elastic film 41 so as to cover the upper surface of the flow path forming substrate 22 and on the upper surface of the elastic film 41. And a lower electrode film 42. The elastic film 41 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm, and the lower electrode film 42 is made of, for example, platinum having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 42 is an electrode common to the plurality of piezoelectric elements 23.

  The piezoelectric element 23 for displacing the diaphragm 24, that is, the driving element includes a piezoelectric film 45 provided on the upper surface of the lower electrode film 42, an upper electrode film 46 provided on the upper surface of the piezoelectric film 45, and an upper A lead electrode 47 (terminal portion) that is a lead-out wiring of the electrode film 46 is provided.

  The piezoelectric film 45 is made of, for example, a metal oxide having a thickness of about 1 μm. The upper electrode film 46 is made of, for example, platinum having a thickness of about 0.1 μm, and the lead electrode 47 is made of, for example, gold having a thickness of about 0.1 μm. An insulating film (not shown) is provided between the lead electrode 47 and the lower electrode film 42.

  A plurality of piezoelectric elements 23 are provided so as to correspond to each of the plurality of nozzle openings 31 and the pressure generation chamber 36. That is, the piezoelectric element 23 is provided for each nozzle opening 31 (for each pressure generation chamber 36). As described above, the lower electrode film 42 functions as a common electrode for the plurality of piezoelectric elements 23, and the upper electrode film 46 and the lead electrode 47 function as individual electrodes for the plurality of piezoelectric elements 23.

  Further, a first piezoelectric element group 23A is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the respective nozzle openings 31 constituting the first nozzle opening group 31A. Similarly, a second piezoelectric element group 23B corresponding to the second nozzle opening group 31B is formed, a third piezoelectric element group 23C corresponding to the third nozzle opening group 31C is formed, and corresponds to the fourth nozzle opening group 31D. A fourth piezoelectric element group 23D is formed. The first piezoelectric element group 23A and the second piezoelectric element group 23B are arranged to face each other in the X-axis direction. The third piezoelectric element group 23C and the fourth piezoelectric element group 23D are arranged so as to face each other in the X-axis direction.

  The piezoelectric element 23 may include a lower electrode film 42 in addition to the piezoelectric film 45, the upper electrode film 46, and the lead electrode 47. That is, the lower electrode film 42 in the present embodiment may be configured to have both the function as the piezoelectric element 23 and the function as the diaphragm 24. In the present embodiment, the diaphragm 24 is constituted by the elastic film 41 and the lower electrode film 42, but the elastic film 41 may be omitted and the lower electrode film 42 may have the function of the elastic film 41.

  The reservoir forming substrate 25 is formed of, for example, a silicon single crystal that is the same material as the flow path forming substrate 22. The reservoir forming substrate 25 is preferably formed of a material having a thermal expansion coefficient substantially the same as the thermal expansion coefficient of the flow path forming substrate 22. For example, glass or a ceramic material may be used.

The reservoir forming substrate 25 is formed with a reservoir portion 51 corresponding to each of the communication portions 39 so as to extend in the Y-axis direction. The reservoir portion 51 and the communication portion 39 described above constitute a reservoir 37.
In addition, the reservoir forming substrate 25 is formed with an introduction path 52 that is connected to the side wall of each communication portion 39 and introduces the functional liquid into each communication portion 39.

A compliance substrate 53 is bonded to the upper surface of the reservoir forming substrate 25. The compliance substrate 53 includes a sealing film 54 and a fixing plate 55.
The sealing film 54 is formed of a material having low rigidity and flexibility such as a polyphenylene sulfide film having a thickness of about 6 μm. The upper portion of the reservoir 51 is sealed with the sealing film 54.

  The fixing plate 55 is made of a hard material such as a metal such as stainless steel having a thickness of about 30 μm. A region of the fixing plate 55 corresponding to the reservoir 51 is an opening 56 that is completely removed in the thickness direction. Therefore, the upper portion of the reservoir 51 is sealed only by the flexible sealing film 54 and is a flexible portion 57 that can be deformed by a change in internal pressure.

  On the compliance substrate 53 outside the reservoir unit 51, a functional liquid introduction port 58 is formed which communicates with the introduction path 52 and supplies the functional liquid to the reservoir unit 51. Normally, when the functional liquid is supplied from the functional liquid introduction port 58 to the reservoir section 51, a pressure change occurs in the reservoir section 51 due to, for example, the flow of the functional liquid when the piezoelectric element 23 is driven or the surrounding heat. However, as described above, since the upper portion of the reservoir portion 51 is the flexible portion 57 sealed only by the sealing film 54, the flexible portion 57 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 51 is maintained at a constant pressure. The other portions are held at a sufficient strength by the fixing plate 55.

In addition, four groove-shaped openings 60 extending in the Y-axis direction are formed in the central portion of the reservoir forming substrate 25 in the X-axis direction. Each of the openings 60 is partitioned by two wall portions 25A extending in the Y-axis direction, each of the two openings 60 aligned in the X-axis direction. The first sealing portion 61A, the second sealing portion 61B, the third sealing portion 61C, and the fourth sealing portion 61D that seal the first to fourth piezoelectric element groups 23A to 23D with the vibration plate 24 are provided. It is formed (see FIGS. 3 and 4).
More specifically, the first sealing portion 61A seals the first piezoelectric element group 23A corresponding to the first pressure generating chamber group 36A with the vibration plate 24, and the second sealing portion 61B is the second piezoelectric portion. The element group 23B is sealed. The third sealing portion 61C seals the third piezoelectric element group 23C corresponding to the third pressure generating chamber group 36C with the vibration plate 24, and the fourth sealing portion 61D includes the fourth piezoelectric element group. 23D is sealed.

  In the reservoir forming substrate 25, a space that does not hinder the movement of the piezoelectric element 23 is secured in a region facing the piezoelectric element 23, and a piezoelectric element holding portion 62 that can seal this space is formed. . The piezoelectric element holding part 62 is formed in each of the sealing parts 61A to 61D, and is sized to cover the first to fourth piezoelectric element groups 23A to 23D. Of the piezoelectric elements 23, at least the piezoelectric film 45 is sealed in the piezoelectric element holding portion 62.

  As described above, the reservoir forming substrate 25 has a function as a sealing member for blocking the piezoelectric element 23 from the external environment and sealing the piezoelectric element 23. By sealing the piezoelectric element 23 with the reservoir forming substrate 25, it is possible to prevent the piezoelectric element 23 from being damaged by an external environment such as moisture. In the present embodiment, the inside of the piezoelectric element holding part 62 is simply sealed. However, for example, the space inside the piezoelectric element holding part 62 is maintained in a vacuum, nitrogen or argon atmosphere, etc. The inside of the part 62 can be kept at low humidity, and the destruction of the piezoelectric element 23 can be prevented more reliably.

In addition, among the piezoelectric elements 23 sealed by the piezoelectric element holding portion 62 of the first sealing portion 61A, one end portion of the lead electrode 47 extends to the outside of the first sealing portion 61A and has an opening. The portion 60 is disposed on the flow path forming substrate 22 exposed.
Similarly, among the piezoelectric elements 23 sealed by the piezoelectric element holding portion 62 of the second sealing portion 61B, the other end portion of the lead electrode 47 extends to the outside of the second sealing portion 61B, and is opened. The portion 60 is disposed on the flow path forming substrate 22 exposed. In addition, among the piezoelectric elements 23 sealed by the piezoelectric element holding portions 62 of the third and fourth sealing portions, a part of the lead electrode 47 extends to the outside of the third and fourth sealing portions, It arrange | positions on the flow-path formation board | substrate 22 exposed in the opening part 60 provided between 3rd and 4th sealing part.

  The driver IC 26 is a driver IC having, for example, a semiconductor integrated circuit (IC) including a circuit board and a drive circuit, and four driver ICs 26 are provided according to the first to fourth nozzle opening groups 31A to 31D. Each driver IC 26 is flip-chip mounted on a predetermined region (mounting region) on one surface of the two first flexible substrates 27 and the two second flexible substrates 28. Then, it is molded with a resin 65 provided on the reservoir forming substrate 25.

(First flexible substrate)
As shown in FIGS. 1 and 3, the first flexible board 27 is made of a flexible flexible circuit board, and the first flexible board 27A has an opening 60 corresponding to the first pressure generating chamber group 36A. The first flexible substrate 27B is provided in the opening 60 corresponding to the second pressure generation chamber group 36B.

  As shown in FIGS. 5 and 6, the first flexible boards 27 </ b> A and 27 </ b> B have a film base 70 as a base, and the first wiring pattern 72, the second wiring pattern 74, and the ground wiring are formed on the film base 70. A terminal portion 73 connected in contact with the pattern 76, the conductive film pattern 75, and the piezoelectric element 23 is provided. The film substrate 70 is an insulating film made of polyimide having a thickness of about 25 μm, for example, and has a first wiring pattern 72 made of a conductive material such as copper, a terminal portion 73, and a second wiring pattern on its lower surface 27a. 74, the ground wiring pattern 76, and the conductive film pattern 75 are formed by a technique such as electrolytic plating or etching by a printing method.

  The first flexible boards 27A and 27B in the present embodiment include a connection part 27b having a terminal part 73 and a first wiring pattern 72, a wiring part 27c having a second wiring pattern 74 and a ground wiring pattern 76, and a conductive film pattern 75. It is comprised from the shield part 27d which has.

  The connection part 27b has a terminal part 73 connected to the lead electrode 47 of the piezoelectric element 23 and a first wiring pattern 72 having one end connected to the terminal part 73, and functions as an OLB mounting part.

Driver ICs 26A and 26B (drive circuit units) for driving the piezoelectric element 23 are provided in predetermined regions of the lower surfaces 27a of the first flexible substrates 27A and 27B, that is, the wiring units 27c and 27c, respectively. The first wiring patterns 72 are connected to the other ends of the corresponding first wiring patterns 72 by flip-chip mounting on the wiring portions 27c and 27c of the flexible boards 27A and 27B.
The connection structure between the terminal 26g of the driver IC 26 and various wiring patterns shown in FIG. 6 is schematic and does not make an electrical meaning.

  A resin 65 (FIG. 5) is disposed between the first flexible substrate 27 and the reservoir forming substrate 25, whereby the driver IC 26 (26A) provided on the first flexible substrate 27 (27A) forms the reservoir. Bonded on the substrate 25. In the present embodiment, the end face 26 a of the driver IC 26 is aligned with the opening end 60 </ b> A of the opening 60 formed in the reservoir forming substrate 25 in plan view. In this state, the first flexible substrate 27 and the reservoir forming substrate 25 are fixed by the resin 65. The resin 65 may also be disposed in the opening 60 and molded between the terminal portion 73 of the connection portion 27b and the lead electrode 47 of the piezoelectric element 23.

  The wiring portion 27c is formed with an external signal input portion 77 that is electrically connected to the external controller CT, and includes a second wiring pattern 74 and a ground wiring pattern 76 that are connected to the driver IC 26. An external signal input from the external signal input unit 77 is input to the driver IC 26 via the second wiring pattern 74.

  The wiring portion 27c has a length in the longitudinal direction that is about twice as long as the length in the longitudinal direction of the connection portion 27b and the shield portion 27d.

  In the shield part 27d, a conductive film pattern 75 having a rectangular shape in plan view is formed in a solid shape on substantially the entire area (excluding the peripheral part) of the lower surface 27a side area. The conductive film pattern 75 is large enough to cover at least the terminal 26g of the driver IC 26 and the circuit element portion (not shown), and is formed so that the end portion thereof partially protrudes toward the wiring portion 27c. .

  An insulating film 81 having an opening 81 a is provided on the conductive film pattern 75. The insulating portions 81A and 81B constituting the insulating film 81 are both made of a resist, and are formed at a predetermined interval from each other so as to form a slit-shaped opening 81a in the approximate center. The opening 81 a extends along the extending direction of the above-described various wiring patterns, and the opening width is set to be approximately equal to the line width of the ground wiring pattern 76.

  Then, the first flexible substrate 27 is bent between the mounting region of the driver IC 26 and the terminal portion 73, and the end portion on the terminal portion 73 side, that is, the connection portion 27b is inserted into the opening 60 (FIG. 5). Thus, the lead electrode 47 disposed in the opening 60 and the terminal portion 73 are connected.

  Here, the terminal portion 73 and the lead electrode 47 are connected by an anisotropic conductive material 79 such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP), for example. Has been. Instead of the anisotropic conductive material 79, a non-conductive film (NCF), a non-conductive paste (NCP), or a brazing material may be used.

  Such a first flexible substrate 27 is folded back with the folded portion (line Q) as a base point so that the shield portion 27d faces the lower surface 27a outward, and is superimposed on the wiring portion 27c in plan view. With this configuration, since the insulating film 81 provided on the shield part 27d is exposed to the outside, the second flexible substrate 28 described later can be placed on the shield part 27d.

(Second flexible substrate)
As shown in FIGS. 1 and 4, the second flexible board 28 is made of a flexible circuit board having flexibility, and the second flexible board 28A has an opening 60 corresponding to the third pressure generating chamber group 36C. The second flexible substrate 28B is provided in the opening 60 corresponding to the fourth pressure generation chamber group 36D.

  As shown in FIGS. 7 and 8, the second flexible boards 28A and 28B are in contact with the film base 71, the first wiring pattern 72, the second wiring pattern 74, the ground wiring pattern 76, and the piezoelectric element 23. A terminal portion 73 to be connected is provided. The film base 71 is an insulating film made of polyimide having a thickness of about 25 μm, for example, and has a first wiring pattern 72 made of a conductive material such as copper, a terminal portion 73, and a second wiring pattern on its lower surface 28a. 74 and the ground wiring pattern 76 are formed by a method such as electrolytic plating or etching by a printing method.

  The second flexible boards 28A and 28B in the present embodiment are constituted by a connection portion 28b having a terminal portion 73 and a first wiring pattern 72, and a wiring portion 28c having a second wiring pattern 74 and a ground wiring pattern 76. .

  The connection portion 28b has a terminal portion 73 connected to the lead electrode 47 of the piezoelectric element 23 and a first wiring pattern 72 having one end connected to the terminal portion 73, and functions as an OLB mounting portion.

  Driver ICs 26A and 26B (drive circuit units) for driving the piezoelectric element 23 are provided in predetermined regions on the lower surfaces 28a of the second flexible boards 28A and 28B, that is, the wiring units 28c and 28c, respectively. 2 Flip-chip mounting is performed on the wiring portions 28c and 28c of the flexible boards 28A and 28B, so that they are connected to the other ends of the corresponding first wiring patterns 72, respectively.

  A resin 65 (FIG. 7) is disposed between the second flexible substrate 28 (28A) and the reservoir forming substrate 25, whereby the driver IC 26 (26C) provided on the second flexible substrate 28 (28A). Is adhered on the reservoir forming substrate 25. In the present embodiment, it is preferable that the end face 26a of the driver IC 26 (26C) is aligned with the opening end 60A of the opening 60 formed in the reservoir forming substrate 25 in plan view. In this state, the second flexible substrate 28 (28A) and the reservoir forming substrate 25 are fixed by the resin 65. The resin 65 may also be disposed in the opening 60 and molded between the terminal portion 73 of the connection portion 28b and the lead electrode 47 of the piezoelectric element 23.

  In addition, an external signal input portion 77 that is electrically connected to the external controller CT is formed in the wiring portion 28c, and is configured by a second wiring pattern 74 and a ground wiring pattern 76 that are connected to the driver IC 26. An external signal input from the external signal input unit 77 is input to the driver IC 26 via the second wiring pattern 74.

  Such a wiring portion 28c has a length in the longitudinal direction that is about three times the length in the longitudinal direction of the connection portion 28b.

  Then, the second flexible substrate 28 is bent between the mounting region of the driver IC 26 and the terminal portion 73, and the end portion on the terminal portion 73 side, that is, the connection portion 28b is inserted into the opening 60 (FIG. 6). Thus, the lead electrode 47 disposed in the opening 60 and the terminal portion 73 are connected.

  As described above, the connection portions 27b and 28b of the first flexible substrate 27 and the second flexible substrate 28 are bent downward, whereby the terminal portions 73 provided on the lower surface side of the connection portions 27b and 28b, The lead electrode 47 of the piezoelectric element 23 disposed on the bottom surface of the opening 60 corresponding to each is electrically connected via an anisotropic conductive material 79. At this time, the first flexible substrate 27 and the second flexible substrate 28 are bent with a bent portion (FIGS. 6 and 8: line O) as a base point, and the flexible substrate 27 is bent at the bent portion (line O) as necessary. It may be bent.

  Further, the first flexible substrate 27 and the second flexible substrate 28 are provided so that the respective wiring portions 27c and 28c extend in the same direction, and in detail, as shown in FIG. 1, the wiring portion 27c. , 28c are drawn out from the corresponding openings 60 so as to be aligned on the side 1a side in the short direction of the droplet discharge head 1. In addition, the wiring portions 27c and 28c of the first flexible substrate 27 and the second flexible substrate 28 that are adjacent in the longitudinal direction of the droplet discharge head 1 overlap each other in the vertical direction, and the first flexible substrate 27 is folded back. A part of the wiring part 28c of the second flexible substrate 28 is placed and fixed on the shield part 27d.

  Then, the conductive film pattern 75 provided in the lower layer of the insulating film 81 and the ground wiring pattern 76 of the wiring portion 28c of the second flexible substrate 28 are connected through the opening 81a of the shield portion 27d of the first flexible substrate 27. Has been. In the opening 81 a, a connection material 82 is provided on the conductive film pattern 75 exposed at the bottom thereof, and electrical connection between the ground wiring pattern 76 of the second flexible substrate 28 and the conductive film pattern 75 is established via the connection material 82. It has come to be obtained. The connecting material 82 fills the step with the insulating film 81 and secures the connection state between the conductive film pattern 75 and the ground wiring pattern 76 of the second flexible substrate 28. On the other hand, another wiring pattern (second wiring pattern 74) provided in the wiring portion 28 c of the second flexible substrate 28 is insulated from the conductive film pattern 75 by the insulating film 81.

  The connecting material 82 is made of a conductive adhesive and is formed with substantially the same film thickness as the insulating portions 81A and 81B. The entire opening 81a may be filled with the connecting material 82, or the connecting material 82 may be configured using an anisotropic conductive adhesive.

  In the present embodiment, OLB mounting of the first flexible substrate 27 inevitably causes the active surface 26e side of the mounted driver IC 26 to face away from the reservoir forming substrate 25 side. Therefore, the second flexible substrate 28 disposed on the shield portion 27d faces the active surface 26e side of the driver IC 26 provided on the first flexible substrate 27.

  Therefore, in the present embodiment, the shield portion 27d provided on the first flexible substrate 27 is folded back onto the wiring portion 27c, and the shield portion 27d is interposed between the first flexible substrate and the second flexible substrate 28 that overlap on the driver IC 26. Is interposed. Then, the conductive film pattern 75 of the shield part 27d and the ground wiring pattern 76 of the second flexible board 28 are connected to have the same electric potential, so that the influence of noise on the wiring part 28c of the second flexible board 28 is affected. Can be prevented from reaching the driver IC 26 of the first flexible substrate. That is, if the conductive film pattern 75 is connected to the ground wiring pattern 76, the conductive film pattern 75 can be easily maintained at the ground potential. Accordingly, the electromagnetic wave, static electricity, etc. of the wiring portion 28c of the second flexible substrate 28 can be thereby obtained. Shielding against noise can be obtained.

(Method for manufacturing droplet discharge head)
Next, a method for manufacturing the droplet discharge head 1 having the above-described configuration will be described. 9 and 10 are cross-sectional views showing a part of the manufacturing process of the droplet discharge head (OLB mounting process), and FIGS. 9A and 9B are perspective views showing the mounting process of the first flexible substrate. 10 and 10 are perspective views showing the mounting process of the second flexible substrate. In the following description, the manufacturing process of the first flexible substrate 27 and the second flexible substrate 28 and the procedure for OLB mounting them will be mainly described. In the droplet discharge head 1, the nozzle substrate 21 and the flow path formation are described. It is assumed that the manufacture, connection, and placement of the substrate 22, the reservoir forming substrate 25, the piezoelectric element 23, and the like have already been completed. Note that FIGS. 6 and 8 are appropriately referred to for the method of forming the flexible substrates 27 and 28.

(First flexible substrate)
Hereinafter, a method for forming the first flexible substrate will be described with reference to FIG.
In order to form the first flexible substrate 27, first, various wiring patterns such as the first wiring pattern 72 including the terminal portion 73, the second wiring pattern 74, and the ground wiring pattern 76 are formed on the lower surface 27a of the film base 70. . Simultaneously with the formation of these various wiring patterns, a conductive film pattern 75 is also formed. These are formed on the film base 71 using a technique such as electrolytic plating or etching using a printing method. Here, the first wiring pattern 72 including the terminal portion 73 is accurately formed according to the interval between the nozzle openings 31 (nozzle pitch), that is, the interval between the piezoelectric elements 23.

Next, an insulating film 81 is formed in a predetermined region on the conductive film pattern 75.
The insulating film 81 is formed using a printing method such as screen printing or transfer printing, a spin coating method, an ink jet method, or the like. Hereinafter, an insulating film forming method using the spin coating method will be described. First, a resist film having a substantially flat surface is formed by spin coating, and the resulting resist film is exposed and developed to form openings 81a and insulating portions 81A and 81B on both sides thereof. . In the present embodiment, the insulating film 81 is not formed on the end portion of the conductive film pattern 75 corresponding to the folded portion (line Q). By doing so, the shield part 27d can be easily bent, and extreme lifting from the wiring part 27c is prevented.

(Second flexible substrate)
Hereinafter, a method for forming the first flexible substrate will be described with reference to FIG.
In order to form the second flexible substrate 28, first, various wiring patterns such as the first wiring pattern 72 including the terminal portion 73, the second wiring pattern 74, and the ground wiring pattern 76 are formed on the lower surface 28a of the film base 71. . Similar to the various wiring patterns of the first flexible substrate 27, these are formed using a technique such as electrolytic plating or etching using a printing method. Also here, the wiring pattern 72 including the terminal portion 73 is accurately formed according to the interval between the nozzle openings 31 (nozzle pitch), that is, the interval between the piezoelectric elements 23.

  The driver ICs 26A and 26B are mounted on the first flexible boards 27A and 27B, respectively, and the driver ICs 26C and 26D are mounted on the second flexible boards 28A and 28B, respectively. In this case, each of the driver ICs 26A to 26D is flip-chip mounted on a mounting region (predetermined region) on one surface (the lower surfaces 27a and 28a of the flexible substrate 27) of the corresponding flexible substrates 27 and 28, respectively. . Thereafter, the flexible boards 27 and 28 and the driver ICs 26 </ b> A to 26 </ b> D are fixed by the resin 78.

(1st flexible board mounting)
Next, the first flexible substrate 27 is connected to the corresponding opening 60. In FIGS. 9A and 9B, the first flexible substrate 27A is shown as an example, but the same applies to the first flexible substrate 27B.
First, the connecting portion 27b of the first flexible substrate 27A is opposed to the corresponding opening 60, and the wiring portion 27c is disposed toward the side 25a of the reservoir forming substrate 25 (side 1a of the droplet discharge head 1). Thereafter, the connecting portion 27b is bent downward to be inserted into the opening 60, and the terminal portion 73 provided in the connecting portion 27b is brought into contact with the lead electrode 47 of the piezoelectric element 23 existing in the opening 60, respectively. Let them join. At this time, the first flexible substrate 27A is bent with the bent portion (line O) as a base point. An anisotropic conductive material 79 is previously provided on the lower surface of the terminal portion 73 or the upper surface of the lead electrode 47. Thereby, the electrical connection between the terminal portion 73 and the lead electrode 47 is performed.

  In the present embodiment, the first driver IC 26A provided on the first flexible substrate 27A is mounted simultaneously with the electrical connection between the terminal portion 73 of the first flexible substrate 27A and the lead electrode 47 of the piezoelectric element 23. . Similar to the anisotropic conductive material 79, a resin 65 is coated on the upper surface of the reservoir forming substrate 25 in advance, and the first driver IC 26 </ b> A is mounted on the resin 65 and fixed. At this time, the end face 26a of the driver IC 26A is arranged so as to coincide with the opening end 60A of the opening 60 in plan view. This makes it difficult for the rising portion 27f of the first flexible substrate 27A and the side wall 60b of the opening 60 to come into contact with each other, thereby preventing electrical leakage between them (FIG. 5).

  The resin 65 is not cured until the terminal portion 73 of the flexible substrate 27A is grounded to the lead electrode 47 of the piezoelectric element 23. Thereby, the terminal part 73 and the lead electrode 47 can be connected favorably.

Subsequently, the shield portion 27d of the first flexible substrate 27A is folded back at the folded portion (line Q) so that the lower surface 27a side is on the outside, and is superimposed on the wiring portion 27c. By folding back the shield part 27d, the insulating film 81 side is exposed to the outside.
In this way, the terminal portion 73 of the first flexible substrate 27A and the lead electrode 47 of the piezoelectric element 23 are joined (OLB mounting) and the driver IC 26A is mounted.

Similarly, OLB mounting of the first flexible substrate 27B is performed, and the driver IC 26B is mounted.
The shield part 27d may be folded in advance.

(Second flexible board mounting)
Next, the second flexible substrate 28 is connected into the corresponding opening 60. In FIG. 10, the second flexible board 28A is shown as an example, but the same applies to the second flexible board 28B.
First, as shown in FIG. 10, the connection portion 28 b of the second flexible substrate 28 </ b> A is opposed to the corresponding opening portion 60 and the wiring portion 27 c is extended in the same direction as the wiring portion 27 c of the first flexible substrate 27. The part 28c is arranged toward the side 25a of the reservoir forming substrate 25 (side 1a of the droplet discharge head 1). Thereafter, the connecting portion 28 b is bent downward to be inserted into the opening 60, and the terminal portion 73 provided in the connecting portion 28 b is brought into contact with the lead electrode 47 of the piezoelectric element 23 existing in the opening 60. Let them join. At this time, the second flexible substrate 28A is bent with the bent portion (line O) as a base point, and the terminal portion 73 and the lead electrode 47 are electrically connected via the anisotropic conductive material 79.

  Thereafter, the terminal portion 73 of the second flexible board 28A and the lead electrode 47 of the piezoelectric element 23 are electrically connected, and at the same time, the third driver IC 26C provided on the second flexible board 28A is bonded. As with the anisotropic conductive material 79, the resin 65 is applied in advance to the upper surface of the reservoir forming substrate 25, and the driver IC 26C is mounted on the resin 65 and fixed. At this time, as shown in FIG. 7, the end face 26a of the driver IC 26C is arranged so as to coincide with the opening end 60A of the opening 60 in plan view, and the rising portion 28f of the second flexible substrate 28A and the opening 60 are Contact with the side wall 60b is prevented, and electrical leakage between them is prevented.

In this manner, the terminal portion 73 of the second flexible substrate 28A and the lead electrode 47 of the piezoelectric element 23 are joined (OLB mounting) and the driver IC 26C is mounted.
Similarly, OLB mounting of the second flexible board 28B is performed, and the driver IC 26D is mounted.

  In the state where the mounting of the second flexible boards 28A and 28B is finished, the wiring portions 28c and 28c are overlapped with the wiring portions 27c and the shield portions 27d of the first flexible boards 27A and 27B. .

  When joining a part of the wiring portion 28c of the second flexible substrate 28 to the shield portion 27d of the first flexible substrate 27 that overlaps each other in plan view, first, as shown in FIG. A connecting member 82 is disposed in the opening 81a in the insulating film 81 of the shield part 27d. The connecting material 82 may be arranged in advance. Then, the ground wiring pattern 76 in the wiring portion 28 c of the second flexible substrate 28 is aligned with the connecting material 82 and then bonded.

As described above, the conductive film pattern 75 of the first flexible substrate 27 and the ground wiring pattern 76 of the second flexible substrate 28 are electrically connected to each other through the connecting material 82, so that the conductive film pattern 75 is connected to the second flexible substrate. The same potential as that of the 28 ground wiring patterns 76 is set. By the way, the other wiring pattern provided in the wiring portion 28 c, that is, the second wiring pattern 74 is disposed on the insulating film 81, so that the insulating film 81 can completely insulate the conductive film pattern 75.
The droplet discharge head 1 is manufactured as described above.

  In the case of this embodiment, the wiring portions 27c and 28c of the flexible substrates 27 and 28 are drawn out from the opening 60 side in the same direction (side 1a side of the droplet discharge head 1) in order to realize the miniaturization of the entire head. It is said that. In this case, the wiring portions 27c and 28c of the first flexible substrate 27 and the second flexible substrate 28 overlap in the vertical direction. As described above, simply pulling the flexible boards 27 and 28 in the same direction (side 1 a side of the droplet discharge head 1) simply causes the second flexible board 27 to be mounted on the driver IC 26 mounted on the first flexible board 27. When the wiring part 28c of the board | substrate 28 overlaps, there exists a possibility that the noise from the wiring part 28c may induce the malfunctioning of driver IC26.

  Therefore, in the present embodiment, the first flexible substrate 27 is provided with the shield part 27d, and the shield part 27d is folded back on the wiring part 27c so that the side having the conductive film pattern 75 and the insulating film 81 is on the outside, and the driver IC 26 and the planar surface. It overlaps visually and can shield the noise from the 2nd flexible substrate 28 now.

  In addition, the conductive film pattern 75 provided in the shield part 27d is connected to the ground wiring pattern 76 of the second flexible substrate 28 facing through the opening 81a (connecting material 82) of the insulating film 81 laminated thereon. With the configuration described above, the conductive film pattern 75 can be always at the ground potential. Thereby, the noise from the wiring part 28c of the second flexible substrate 28 can be effectively shielded. Therefore, the malfunction of each driver IC 26 can be prevented, and the highly reliable droplet discharge head 1 can be obtained.

  Moreover, in the manufacturing method of the droplet discharge head described above, the first flexible substrate 27 is obtained by simultaneously forming the various wiring patterns 74 and 75 and the conductive film pattern 75 on one surface of one film base material 70. Yes. Therefore, a high production yield can be expected.

The folded shield part 27d may be fixed on the wiring part 27c.
Further, the shield portion 27d may be folded (folded) at the folded portion (FIG. 6: line Q).

<Second Embodiment of Droplet Discharge Head>
FIG. 11A is an enlarged cross-sectional view illustrating a main part of the droplet discharge head according to the second embodiment.
As shown in FIG. 11A, the liquid droplet ejection head 90 of this embodiment is different from the first embodiment in that it includes a shield substrate 91 that is a separate body from the first flexible substrate 93. Is different. The shield substrate 91 corresponds to the first flexible substrate 27A, 27B shown in FIG. Further, the first flexible substrate 93 of this embodiment corresponds to the one in which the shield portion 27d is separated from the first flexible substrate 27 in FIG. 6 and only the connection portion 27b and the wiring portion 27c are provided, and the second flexible substrate in FIG. 28 and substantially the same shape.
In the present embodiment, the shield substrate 91 is provided on the wiring portion 27 c of the first flexible substrate 93 via the adhesive layer 92. The shield substrate 91 has a solid conductive film pattern 75 and an insulating film 81 having an opening 81 a, and the second flexible substrate 28 is laminated on the shield substrate 91. The conductive film pattern 75 and the ground wiring pattern 76 of the second flexible substrate 28 are electrically connected through the opening 81a, and the conductive film pattern 75 overlapping the driver IC 26 in plan view is set to the ground potential.

  According to this embodiment, since the shield substrate 91 is separate from the first flexible substrate 93, it can be used without changing the shape of the first flexible substrate 93. Further, since the shield substrate 91 can be fixed on the wiring portion 27c of the first flexible substrate 93, the connection state with the second flexible substrate 28 can be ensured.

<Third Embodiment of Droplet Discharge Head>
FIG. 11B is an enlarged cross-sectional view illustrating a main part of the droplet discharge head according to the third embodiment.
As shown in FIG. 11B, the droplet discharge head 94 of this embodiment is different from the previous embodiment in that the first flexible substrate 95 has a double-sided wiring structure.
The first flexible substrate 95 of the present embodiment is substantially the same shape as the second flexible substrates 28A and 28B shown in FIG. 8 in the planar shape, and the upper surface (lower surface 27a) of the wiring portion 27c on which various wiring patterns are formed. A conductive film pattern 75 and an insulating film 81 are formed on the side opposite the surface. The second flexible substrate 28 is laminated on the first flexible substrate 95.

  According to this embodiment, since it is not necessary to fold a part of the first flexible board 95 or to provide a separate board, the number of parts and the number of manufacturing processes can be reduced, and the first flexible board 95 can be easily manufactured at low cost. . In addition, since the number of stacked substrates is reduced, the thickness can be reduced, and the overall size of the device can be further reduced.

<Droplet ejection device>
Next, an example of the droplet discharge apparatus IJ of the present invention provided with the above-described droplet discharge head 1 will be described with reference to FIG. FIG. 12 is a perspective view showing a schematic configuration of the droplet discharge device IJ.

  In FIG. 12, the droplet discharge device IJ includes a droplet discharge head 1, a drive shaft 4, a guide shaft 5, an external controller CT, a stage 7, a cleaning mechanism 8, a base 9, and a heater 6. I have. The stage 7 supports the substrate P from which the functional liquid is discharged by the droplet discharge head 1, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position. From the nozzle opening of the droplet discharge head 1, the functional liquid is discharged onto the substrate P supported by the stage 7.

  A drive motor 2 is connected to the drive shaft 4. The drive motor 2 is composed of a stepping motor or the like. When a drive signal in the Y-axis direction is supplied from the external controller CT, the drive shaft 4 is rotated. When the drive shaft 4 rotates, the droplet discharge head 1 moves in the Y-axis direction. The guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a drive motor 3. The drive motor 3 is composed of a stepping motor or the like. When a drive signal in the X-axis direction is supplied from the external controller CT, the stage 7 is moved in the X-axis direction.

  The external controller CT supplies a voltage for controlling droplet ejection to the droplet ejection head 1. Further, the external controller CT supplies a drive pulse signal for controlling the movement of the droplet discharge head 1 in the Y-axis direction to the drive motor 2 and also supplies the drive motor 3 to the X-axis direction of the stage 7. A drive pulse signal for controlling movement is supplied.

The cleaning mechanism 8 cleans the droplet discharge head 1 and includes a drive motor (not shown). By driving the drive motor, the cleaning mechanism 8 moves in the X-axis direction along the guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the external controller CT. Here, the heater 6 is means for heat-treating the substrate P by lamp annealing, and evaporates and dries the solvent contained in the functional liquid applied on the substrate P. The power on and off of the heater 6 is also controlled by the external controller CT.
The droplet discharge device IJ discharges droplets onto the substrate P while relatively scanning the droplet discharge head 1 and the stage 7 supporting the substrate P.

  In such a droplet discharge device IJ, as described above, the malfunction of the driver IC 26 is prevented, and the droplet discharge head 1 having excellent reliability is provided. Therefore, long-term reliability is ensured. Will be.

  In the above-described embodiment, the functional liquid discharged from the droplet discharge head 1 includes a liquid crystal display device forming material for forming a liquid crystal display device, and an organic EL forming device for forming an organic EL display device. It includes materials, wiring pattern forming materials for forming wiring patterns of electronic circuits, and the like. Thereby, the droplet discharge apparatus IJ can manufacture each of the devices with the functional liquid discharged based on the droplet discharge method.

  The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to such examples, and the above embodiments may be combined. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, the position of the opening 81 a of the insulating film 81 is not limited to the above-described position, and the design can be appropriately changed according to the position of the ground wiring pattern 76 on the second flexible substrate 28.

FIG. 3 is an external perspective view of a droplet discharge head according to the first embodiment. The partially broken view of the perspective view which looked at the droplet discharge head from the nozzle opening side. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a cross-sectional view taken along line BB in FIG. 1. Sectional drawing which expands and shows the principal part of FIG. Sectional drawing which expands and shows the principal part of FIG. The top view of a 1st flexible substrate. The top view of a 2nd flexible substrate. Sectional drawing which shows schematic structure of the droplet discharge head of 2nd Embodiment. Sectional drawing which shows schematic structure of the droplet discharge head of 2nd Embodiment. Sectional drawing which shows schematic structure of the droplet discharge head of 3rd Embodiment. FIG. 3 is an external perspective view showing an example of a droplet discharge device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 22 ... Flow path formation board | substrate (1st board | substrate), 23 ... Piezoelectric element (drive element), 25 ... Reservoir formation board | substrate (2nd board | substrate), 26 ... Driver IC (drive circuit part), 26e ... active surface, 27 ... first flexible substrate, 27b ... connection portion, 27c ... wiring portion, 27d ... shield portion, 27f ... rising portion, 28 ... second flexible substrate, 28b ... connection portion, 28c ... wiring portion, 28f ... Rising portion, 47: lead electrode (terminal portion), 60: opening, 60A ... opening end, 72 ... first wiring pattern, 74 ... second wiring pattern, 76 ... ground wiring pattern, 81a ... opening, IJ ... droplet Discharge device

Claims (9)

A first substrate;
A plurality of driving elements provided on the first substrate;
A second substrate provided on the plurality of drive element sides of the first substrate;
A plurality of drive circuit portions provided on the second substrate;
A first flexible substrate and a second flexible substrate that connect the terminal portion of the driving element exposed to the opening of the second substrate and the driving circuit portion;
The first flexible substrate and the second flexible substrate each have a connection portion connected to the terminal portion and a wiring portion on which a plurality of wiring patterns for supplying signals to the driving circuit portion are formed,
The wiring portion of the second flexible substrate overlaps the drive circuit portion mounted on the first flexible substrate,
A droplet discharge head, wherein a shield portion having a conductive film pattern is disposed between the first flexible substrate and the second flexible substrate on the drive circuit portion.   The droplet discharge head according to claim 1, wherein the conductive film pattern of the shield portion is connected to the wiring pattern of the second flexible substrate. An insulating film having an opening is provided on the conductive film pattern of the shield portion;
3. The droplet discharge head according to claim 1, wherein any one of the conductive film pattern and the plurality of wiring patterns is connected through the opening.   3. The droplet discharge head according to claim 1, wherein the shield portion is formed integrally with the first flexible substrate and folded to overlap the second flexible substrate in plan view.   The said conductive film pattern is formed in the surface on the opposite side to the surface in which the said some wiring pattern of the said 1st flexible substrate was formed, The Claim 1 thru | or 3 characterized by the above-mentioned. Droplet discharge head.   6. The liquid according to claim 1, wherein the conductive film pattern is formed to have a size covering a circuit element portion and a terminal of the drive circuit portion of the first flexible substrate. Drop ejection head.   The wiring portion of the first flexible substrate and the wiring portion of the second flexible substrate are drawn out to the same side edge portion of the second substrate. The droplet discharge head according to one item.   8. The liquid droplet ejection head according to claim 1, wherein the shield part is disposed on an active surface side of the drive circuit part of the first flexible substrate. 9.   A droplet discharge apparatus comprising the droplet discharge head according to claim 1.

Images