JP2011071417A - Manufacturing method of wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring substrate capable of improving the integration of a via by forming a via function without performing laser processing and the like on a resin layer and without increasing the physical size of the substrate or a module. <P>SOLUTION: First conductor planes 2 are formed on a substrate 1, and a trapezoidal shape resin block 4 is bonded and fixed to the substrate 1. Conductor wires are formed on the slope surface 4a of the resin block 4, and interlayer connection conductors 5 are formed so as to be conducted to the first conductor planes 2. A resin layer 3 is formed on the substrate 1 so as to surround the circumference of the resin block 4, and second conductor planes 6 are formed on the top surface of the resin layer 3 so as to be conducted to the upper end of the interlayer connection conductors 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring board. The wiring board in the present invention is a board having at least one resin layer, in which a first in-plane conductor on the lower surface and a second in-plane conductor on the upper surface are connected by an interlayer connection conductor. Components may be embedded in this resin layer. Further, it includes a substrate in which the present wiring substrate is laminated in multiple layers, and a substrate in which a thin layer (no resin block is embedded) is built up on the upper or lower surface of the present wiring substrate.

  In recent years, with the miniaturization of electronic devices, miniaturization of circuit boards for mounting circuit components such as ICs and chip components is required. In response to this, a module product in which a circuit component is embedded in a circuit board, that is, a module with a built-in component is manufactured to reduce the size of the module product. Among them, the component built-in module in which the circuit component is embedded in the insulating resin layer is light in weight and does not involve high-temperature firing unlike the ceramic substrate, and thus has an advantage that the circuit component to be built is less restricted.

  When such a component built-in module is manufactured, via conductors are formed in the component built-in layer in order to electrically connect electrodes above and below the component built-in layer. There are the following two methods for forming the via.

-Bottomed via formation method-
After a wiring pattern (including lands) is formed on the substrate, the components are mounted on the lands, and the uncured resin is thermocompression bonded from above the components to embed the components in the resin. Thereafter, the resin is completely cured by heating to form a resin layer, and then a via is formed in the resin layer with a laser, and plating or a conductive paste is filled to form a via conductor.

  As described above, the via is a bottomed via having a land as a bottom surface. When such a bottomed via is formed by a laser, a hole is formed while the resin irradiated with the laser is melted by heat. When it reaches the land on the bottom, the laser is reflected. However, if the laser intensity is too strong, the bottom land will be broken. Conversely, if the laser intensity is too low, there will be no vias. For this reason, it is necessary to strictly adjust the laser intensity in order to reliably form the via. The laser energy has a distribution, and the energy in the center is high. Due to this influence, there is a problem that the via shape becomes tapered. In the case of a tapered via, the diameter of the bottom surface of the via is reduced, so that the diameter D of the opening of the via needs to be increased in order to prevent poor connection at the bottom surface of the via. As a result, there is a problem that the pitch between vias cannot be narrowed, which hinders product size reduction.

-Via formation method using perforated resin-
Unlike the above method, as in Patent Document 1, a resin sheet in which a via is formed in advance at a predetermined position is prepared, and the via is formed in the resin layer by thermocompression bonding from above the substrate on which the component is mounted. Is possible. In this case, unlike the case of bottomed via formation, there is no need to adjust the laser intensity, and holes can be made with a strong laser intensity. For this reason, the via has a straight shape. However, in order to fill this perforated resin sheet with a conductive paste, laminate it on a substrate on which components are mounted by thermocompression bonding, and embed the components in the resin, it is necessary to flow the uncured resin. As a result, there is a problem that the via shape is deformed or oozes out from the via filled with the conductive paste.

  Japanese Patent Application Laid-Open No. H10-228688 discloses a method in which the upper and lower wiring layers of the component built-in layer are connected to each other using a connecting member instead of the method of forming a via in the resin layer. That is, an insulating base having an upper surface and a lower surface and side surfaces connecting them, at least part of the side surfaces, a side wiring portion and an upper surface wiring portion interconnected with the side wiring portion, a lower side wiring The connection member is formed with at least one wiring having a portion. This connecting member is mounted on the land of the board.

  In this case, there is an advantage that a large number of wirings can be formed on one connection member. However, it is necessary to manufacture connection members according to the number of connections required for each product, and unless various types of connections are prepared. In other words, cost increases. In addition, it is necessary to electrically connect the wiring formed on the lower surface of the connection member and the land of the board on which the connection member is mounted. As the number of connections increases, the connection becomes difficult and the land conductor wiring It is difficult to miniaturize the pattern. For this reason, there is a problem that it is difficult to increase the density of so-called via functions for connecting the upper and lower wiring layers.

  Patent Document 3 discloses a connecting member that also serves as an electronic component for incorporating a substrate. In other words, an electrode conductor portion for circuit connection is provided on the surface of the end surface portion of the package body made of insulating resin, and an inter-layer conduction conductor portion is provided on the peripheral surface of the package body to electrically connect both end surface portions, thereby reducing the number of vias. And what is aiming at high-density mounting of electronic components is disclosed.

  However, since the electrode conductor portion and the conductive conductor portion must be formed in advance on the surface of the package body, it is necessary to manufacture a package body according to the number of connections as in Patent Document 2, The package body must be prepared, resulting in an increase in cost. Further, it is necessary to electrically connect the conductor portion formed on the lower surface of the package body and the land of the substrate on which the package body is mounted. As the number of connections increases, connection becomes difficult and it is difficult to miniaturize the land conductor wiring pattern. Furthermore, since the package body also has a function as an electronic component for incorporating a substrate, there are disadvantages that the component size is increased and it is difficult to increase the density of the via function.

Japanese Patent Laid-Open No. 11-220262 JP 2006-40870 A JP-A-2005-353727

  The objective of this invention is providing the manufacturing method of the wiring board which can eliminate the above subjects.

  To achieve the above object, the present invention includes a first step of forming a first in-plane conductor on a substrate, a second step of fixing a resin block on the substrate, and a substrate fixed to the substrate. A third step of forming an upper and lower interlayer connection conductor connected to the first in-plane conductor on a side surface of the resin block; and the resin block so that an upper end portion of the interlayer connection conductor is exposed. And a fifth step of forming a second in-plane conductor connected to the upper end portion of the interlayer connection conductor on the resin layer, and a fourth step of forming a resin layer around the substrate. A manufacturing method is provided.

  In the present invention, the resin block is fixed on the substrate on which the first in-plane conductor is formed. As the substrate, a printed wiring board in which the first in-plane conductor is patterned may be used, or a transfer board in which the first in-plane conductor is patterned on the upper surface may be used. As a method for fixing the resin block, any method may be employed, such as adhesive bonding using an adhesive or an adhesive sheet, or thermocompression bonding of an uncured resin block. In fixing, it is preferable to fix the resin block so that the peripheral edge of the lower end portion is as close as possible to the first in-plane conductor. Since the interlayer connection conductor is not yet formed on the surface of the resin block, it is not necessary to manufacture a resin block corresponding to the number of connections, and it is not necessary to prepare various types of resin blocks. After the resin block is fixed to the substrate, an interlayer connection conductor continuous in the vertical direction connected to the first in-plane conductor is formed on the side surface of the resin block. Since the interlayer connection conductor is formed after fixing the resin block, it is not necessary to align the resin block so that the interlayer connection conductor and the first in-plane conductor correspond exactly, and the resin block fixing work is simple become. In addition, since the connection with the first in-plane conductor is performed simultaneously with the formation of the interlayer connection conductor, the work process is simplified.

  After the interlayer connection conductor is formed, a resin layer is formed around the resin block so that the upper end portion of the interlayer connection conductor is exposed. As a method for forming the resin layer, for example, an uncured resin layer thicker than the resin block is prepared, and this resin layer is thermocompression-bonded on the substrate to embed the resin block in the resin layer. The upper end portion of the interlayer connection conductor may be exposed by grinding or polishing the surface of the resin layer after the layer is cured. Further, the resin layer may be fixed by crimping around the resin block by controlling the thickness so that the upper end portion of the interlayer connection conductor is exposed in the crimping stage. After the formation of the resin layer, a second in-plane conductor connected to the upper end portion of the interlayer connection conductor is formed on the resin layer. As a method for forming the second in-plane conductor, a plating method, a screen printing method, or an ink jet method may be used. Furthermore, another resin layer having a second in-plane conductor on the bottom surface may be pressure-bonded on the resin layer. By forming the second in-plane conductor, the in-plane conductors on both main surfaces of the resin layer are connected to each other by the interlayer connection conductor of the resin block.

  When the interlayer connection conductor is formed on the side surface of the resin block, it is preferable to use an ink jet method. Since the inkjet method is a non-contact printing method, the interlayer connection conductor can be easily drawn on the side surface of the three-dimensional resin block. Moreover, according to the wiring drawing by ink jet printing, the wiring pattern of the interlayer connection conductor connecting the upper and lower in-plane conductors can be made fine. For this reason, the degree of integration of via functions is improved. Moreover, if it is within the specification range of inkjet printing, the wiring pattern of an interlayer connection conductor can be drawn freely (for example, diagonal wiring). As a result, the degree of freedom of three-dimensional wiring is increased and the wiring board can be reduced in size. Furthermore, since the wiring width and wiring thickness can be changed by ink jet printing, a wiring pattern that matches the current capacity can be designed. Therefore, it is not necessary to increase the number of resin blocks, and the wiring board can be reduced in size. Further, the connection reliability between the first in-plane conductor and the second in-plane conductor is improved.

  As the resin layer, for example, a resin sheet made of only a thermosetting resin may be used, or a resin sheet containing an inorganic filler and a thermosetting resin may be used. The resin block is preferably formed of the same material as the resin layer. In this case, the linear expansion coefficients of the resin block and the resin layer can be made equal, stress and distortion due to temperature change are less likely to occur, and the connection reliability between the in-plane conductor and the interlayer connection conductor is improved. The substrate may be a printed board such as a ceramic board or a resin board, or a transfer board such as a SUS board. When the transfer plate is used, it may be peeled off from the resin layer after the resin layer is cured or after the entire substrate or the module is completed.

  According to a preferred embodiment, the resin block is preferably such that the surface fixed on the substrate has a larger area than the opposing surface, and has an inclined side surface. It is preferable to form an interlayer connection conductor. If there is an inclined side surface, conductor drawing by the ink jet method can be easily performed from the upper surface facing the substrate. However, by changing the angle of the substrate and the direction of the ink jet nozzle from an oblique direction, or by adopting a method that enables conductor drawing on the vertical surface by a method other than the ink jet method, the vertical side A rectangular parallelepiped-shaped or cylindrical resin block can also be used.

  According to a preferred embodiment, in the third step, the interlayer connection conductor is preferably formed so as to overlap the first in-plane conductor. When a resin block in which interlayer connection conductors are formed in advance is mounted on a substrate as in the prior art, it is necessary to mount so that each interlayer connection conductor and the first in-plane conductor of the substrate are accurately connected. In addition, high accuracy is required for the mounting work, and wiring miniaturization is difficult. On the other hand, in the case of a resin block having no interlayer connection conductor, it is not necessary to mount it in exact alignment with the position of the first in-plane conductor. Since the conductor is formed later by the ink jet method in accordance with the first in-plane conductor, the connection between the two can be reliably performed. Further, since the conductor is drawn later, the conductor wiring can be miniaturized in accordance with the drawing accuracy of the ink jet device, and the via function can be densified. Furthermore, the connection reliability between the first in-plane conductor and the interlayer connection conductor can be improved by forming the interlayer connection conductor so as to overlap the first in-plane conductor.

  According to a preferred embodiment, in the third step, the interlayer connection conductor is preferably formed so as to continue to the upper surface of the resin block. In this case, since the interlayer connection conductor is exposed on the upper surface of the resin block when the resin layer is formed, the connection area between the second in-plane conductor and the interlayer connection conductor formed on the upper surface of the resin layer is increased. Connection reliability is improved.

  According to a preferred embodiment, a plurality of interlayer connection conductors may be formed on the side surface of a single resin block. In the conventional via forming method in which a hole is formed in the resin layer and the interlayer connection conductor is filled therein, only one conductor can be formed for one hole. In contrast, in the present invention, fine interlayer connection conductors can be formed by the ink jet method using the side surface of the resin block, so that a plurality of interlayer connection conductors can be easily formed in one resin block, and high-density vias are formed. Can be realized.

  According to a preferred embodiment, in the fourth step, the resin layer may be formed by an inkjet method. In order to form the resin layer, a method is generally used in which an uncured resin, that is, a softened or semi-cured (for example, B stage) resin is stacked on a substrate and thermocompression bonded. There is a possibility that the components mounted on the top may move or be disconnected. On the other hand, in the method of forming a resin layer by the ink jet method, resin in the form of fine droplets is laminated on the substrate to form the resin layer, so that there is no resin flow and the component is mounted on the substrate. No load is applied.

  According to a preferred embodiment, in the fourth step, after forming a resin layer thicker than the resin block, a method of exposing the interlayer connection conductor by grinding or polishing the upper surface of the resin layer may be used. Good. When the resin layer is ground or polished after the resin layer is cured, the upper end portion of the interlayer connection conductor is exposed from the resin layer. When the second in-plane conductor is formed on the ground or polished upper surface of the resin layer, the interlayer connection conductor and the second in-plane conductor can be reliably connected. Since the surface of the resin layer and the upper surface of the resin block are flush with each other, various methods such as plating, screen printing, and ink jet can be employed as the second in-plane conductor formation method, and connection reliability is also high. .

  According to a preferred embodiment, a resin layer that is thinner than the resin block may be formed in the fourth step. This structure can be realized by forming a resin layer by an ink jet method. In this case, the surface of the resin layer is at a position lower than the upper surface of the resin block, but if the ink jet method is used, the interlayer connection conductor and the second in-plane conductor can be easily connected even on an uneven surface. Can do. Thus, even if the resin layer is formed lower than the resin block, the second in-plane conductor can be formed on the upper surface of the resin layer so as to be connected to the interlayer connection conductor on the side surface of the resin block. As a result, waste of the resin layer can be eliminated, and the height of the substrate or module can be reduced. The upper surface of the resin block protruding from the surface of the resin layer may be polished to be flush.

  In the fourth step, the original resin block may be thinned by forming a resin layer that is the same as or thicker than the resin block and then grinding or polishing the entire resin layer. In this case, the interlayer connection conductor formed on the upper surface of the resin block disappears, and the ground or ground cross section of the interlayer connection conductor formed on the side surface of the resin block is exposed. An electrical connection can be easily obtained by drawing the second in-plane conductor by an ink jet method in accordance with the exposed interlayer connection conductor. By doing in this way, a board | substrate or a module can be heightened more.

  According to a preferred embodiment, after the first step, the circuit component is mounted on the first in-plane conductor, and in the fourth step, the circuit component is embedded together with the resin block in the resin layer. You may do it. In this case, the component built-in substrate can be easily formed. Since the embedding of the resin block and the embedding of the circuit parts are performed simultaneously, the manufacturing process can be simplified. In this case, it is preferable to make the thickness of the resin block thicker than the thickness of the circuit component.

  As described above, according to the present invention, since the interlayer connection conductor is formed on the side surface of the resin block by the ink jet method after the resin block is fixed to the substrate, the first in-plane conductor of the substrate is a fine wiring. However, the connection with the interlayer connection conductor is simple and reliable, and the density of the via function can be increased. In addition, it is not necessary to prepare many types of resin blocks having different interlayer connection conductor patterns, and high-precision mounting work is not necessary, so that the manufacturing cost can be reduced. Further, after forming the interlayer connection conductor, a resin layer is formed around the resin block so that the upper end portion of the interlayer connection conductor is exposed, and a second layer connected to the upper end portion of the interlayer connection conductor is formed on the resin layer. By forming the in-plane conductors, the upper and lower in-plane conductors can be reliably connected by the interlayer connection conductor.

It is sectional drawing of the wiring board which is 1st Embodiment of this invention. It is a perspective view of the resin block part in the wiring board shown in FIG. FIG. 2 is a manufacturing process diagram of the wiring board shown in FIG. 1. It is a figure which shows the first half of the manufacturing process of the wiring board (component built-in module) which is 2nd Embodiment of this invention. It is a figure which shows the second half of the manufacturing process in FIG. It is a figure which shows a part of manufacturing process of the wiring board (component built-in module) which is 3rd Embodiment of this invention. It is a perspective view which shows the other example of a resin block.

[Embodiment 1]
A first embodiment of a wiring board according to the present invention will be described with reference to FIGS.

  In FIG. 1, the wiring board A includes a substrate 1, a resin layer 3 made of a thermosetting resin such as an epoxy resin laminated on the substrate 1, and a resin block 4 embedded in the resin layer 3. I have. A plurality of first in-plane conductors 2 are patterned on the upper surface of the substrate 1. As a method for forming the first in-plane conductor 2, a copper foil attached on the substrate 1 may be etched to form a pattern, or a pattern may be formed using a plating method, a screen printing method, an inkjet method, or the like. May be. The substrate 1 may be a resin substrate such as a printed circuit board, a ceramic substrate, or a transfer plate. In the case of a transfer plate, after the resin layer 3 is formed on the substrate 1, the transfer plate 1 is peeled off from the resin layer 3 to transfer the first in-plane conductor 2 to the resin layer 3.

  As shown in FIG. 2, the bottom surface of the resin block 4 is bonded and fixed to the substrate 1. The surface of the resin block 4 fixed to the substrate 1 has a larger area than the opposing surface, and the side surface is inclined. FIG. 2 shows a pyramid shape as an example. The resin block 4 is integrally formed of an insulating resin, and is preferably formed of the same material as the resin layer 3. The resin block 4 is not limited to the truncated pyramid shape having four inclined surfaces 4a as shown in FIG. 2, but the upper surface has a smaller area than the lower surface, such as a truncated cone shape, and has at least one inclined surface on the side surface. Anything can be used. On the side surface of the resin block 4, that is, the inclined surface 4a, a plurality of interlayer connection conductors 5 that are continuous in the vertical direction are formed by an inkjet method. The interlayer connection conductor 5 is obtained by firing a conductive paste after spraying the conductive paste with an ink jet printer and drawing the wiring. A lower end portion 5 a of the interlayer connection conductor 5 is formed so as to overlap the first in-plane conductor 2 and is electrically connected to the first in-plane conductor 2. The upper end portion 5 b of the interlayer connection conductor 5 is formed so as to continue to the upper surface 4 b of the resin block 4. The upper surface 4 b of the resin block 4 is formed substantially flush with the upper surface of the resin layer 3, and a second in-plane conductor 6 connected to the upper end portion 5 b of the interlayer connection conductor 5 is formed on the upper surface of the resin layer 3. A pattern is formed. Thus, the first in-plane conductor 2 and the second in-plane conductor 6 can be connected via the interlayer connection conductor 5 without forming a via in the resin layer 3 by laser processing or the like.

  Here, an example of a method of manufacturing the wiring board A will be described with reference to FIG. In FIG. 3, a method for manufacturing a single wiring board A will be described. In an actual manufacturing process, a wiring board in a parent board state is manufactured and then cut into a child board state.

  FIG. 3A shows the first step, in which the first in-plane conductor 2 is patterned on the upper surface of the substrate 1. The substrate 1 may be a printed substrate made of resin or a ceramic substrate, but a transfer plate made of a metal plate such as SUS may be used. FIG. 3B shows a second step, in which the resin block 4 is fixed on the substrate 1 in the vicinity of the first in-plane conductor 2. As a fixing method, you may fix using an adhesive agent or an adhesive sheet, and when the resin block 4 is uncured resin, you may carry out thermocompression bonding. The resin block 4 may be mounted so as to cover a part of the first in-plane conductor 2.

  FIG. 3C shows a third step, in which a conductive paste is sprayed from above the resin block 4 fixed to the substrate 1 by using an ink jet printer 7, and the upper surface 4 b of the resin block 4 is passed through the slope 4 a. The first in-plane conductor 2 is continuously applied. After applying the conductive paste, the interlayer connection conductor 5 is formed by firing. The lower end portion 5 a of the interlayer connection conductor 5 is formed on the first in-plane conductor 2, and the upper end portion 5 b is formed on the upper surface 4 b of the resin block 4.

  FIG. 3D shows a fourth step, in which the uncured resin layer 3 is stacked on the substrate 1 on which the interlayer connection conductor 5 is formed, and thermocompression bonded. When the resin layer 3 is thermocompression bonded, the softened resin adheres to the surface of the substrate 1 or the surface of the resin block 4, and the resin layer 3 is formed around the resin block 4. Thereafter, the resin layer 3 is completely thermoset. As the resin layer 3, for example, an uncured sheet containing an inorganic filler and a thermosetting resin, an uncured sheet made of a thermosetting resin not containing an inorganic filler, or a prepreg can be used. The uncured state refers to a semi-cured (for example, B stage) state or a softer state.

  In FIG. 3D, the upper surface of the resin layer 3 and the upper surface of the resin block 4 are flush with each other, and the upper end portion 5 b of the interlayer connection conductor 5 is exposed on the surface of the resin layer 3. In the formation step of the resin layer 3, the resin block 4 is completely buried in the resin layer 3, and then the surface of the resin layer 3 is polished so that the upper end portion of the interlayer connection conductor 5 is the resin layer 3. You may expose from the surface of. Further, when the resin layer 3 is ground or polished, the upper portion of the resin block 4 may be simultaneously polished so that the interlayer connection conductor 5 is exposed on the slope of the resin block 4. Polishing of the resin layer 3 can be easily performed by a known grinding or polishing apparatus such as a grinder or a lapping machine. In addition, you may form by thickness control so that the upper surface of the resin layer 3 and the upper surface of the resin block 4 may become the same shape at the time of crimping | bonding of the resin layer 3. FIG.

  FIG. 3E shows a fifth step, in which the second in-plane conductor 6 is patterned on the surface of the resin layer 3 where the upper end portion 5b of the interlayer connection conductor 5 is exposed. As a method for forming the second in-plane conductor 6, any method such as a plating method, a screen printing method, and an ink jet method can be used as long as it can be reliably connected to the interlayer connection conductor 5. In this way, the present wiring board A is completed.

[Embodiment 2]
Next, a method for manufacturing a component built-in module using the present invention will be described with reference to FIGS. 4 shows the first half of the manufacturing process, and FIG. 5 shows the second half of the manufacturing process.

  FIG. 4A shows a state where a transfer plate 10 which is an example of a substrate on which the first in-plane conductor 11 is patterned is prepared. The first in-plane conductor 11 can be formed by Cu plating, Cu foil etching, ink jet printing, or the like.

  FIG. 4B shows a state in which the circuit component 12 is mounted on the first in-plane conductor 11 and the resin block 14 is bonded and fixed. The circuit component 12 is mounted using a bump 13 or a solder printing method. The resin block 14 is a resin part having a trapezoidal cross section, and its bottom surface is fixed to the transfer plate 10 using an adhesive 15, an adhesive sheet, an adhesive sheet, or the like. The mounting method and the fixing method can be arbitrarily selected as long as the mounting state of the circuit component 12 and the resin block 14 is maintained even in a heating / pressurizing state when the resin layer described later is pressed.

  FIG. 4C shows a state in which the interlayer connection conductor 16 is drawn on the inclined surface of the resin block 14 or on both the upper surface and the inclined surface by ink jet printing. At this time, drawing is also continuously performed on the first in-plane conductor 11 on the transfer plate 10 to establish electrical connection.

  In FIG. 4D, uncured insulating resin is thermocompression bonded onto the transfer plate 10 to embed the circuit component 12 and the resin block 14 in the resin layer 17. Here, the thickness of the resin layer 17 is made larger than the thickness of the circuit component 12 or the resin block 14, but the thickness of the resin layer 17 is so exposed that the upper end portion of the interlayer connection conductor 16 formed on the upper surface of the resin block 14 is exposed. May be controlled.

  FIG. 4E shows a state in which the upper surface of the resin layer 17 is polished by a grinding / polishing method such as a grinder until the upper end portion of the interlayer connection conductor 16 formed on the upper surface of the resin block 14 is exposed. As a result, the interlayer connection conductor 16 is exposed on the surface. Since the height of the circuit component 12 is lower than that of the resin block 14, the circuit component 12 is not exposed from the resin layer 17.

  FIG. 5A shows a state where the transfer plate 10 is peeled after the resin layer 17 is cured. In this state, the first in-plane conductor 11 is exposed on the bottom surface of the resin layer 17.

  FIG. 5B shows a state in which the second in-plane conductor 18 is patterned on the upper surface of the resin layer 17. As a method for forming the second in-plane conductor 18, a plating method, a screen printing method, an ink jet printing method, or the like can be used. At this time, the second in-plane conductor 18 is formed so that the second in-plane conductor 18 and the upper end portion of the interlayer connection conductor 16 are connected.

  (C) of FIG. 5 mounts circuit components 19, 20, and 21 on the second in-plane conductor 18, and forms a resin layer 22 on the resin layer 17 so as to embed these circuit components. A plurality of wiring layers 23 and 24 are built up and laminated under the resin layer 17 to form a component built-in module B. The formation method of the resin layer 22 and the wiring layers 23 and 24 may be the same as that of the resin layer 17. An interlayer electrode 25 and a lower electrode 26 are formed between the wiring layers 23 and 24 and on the lower surface of the wiring layer 24, respectively, for connecting the first in-plane conductor 11, the interlayer electrode 25, and the lower electrode 26 to each other. Vias 27 and 28 are formed in the wiring layers 23 and 24, respectively.

[Embodiment 3]
FIG. 6 shows another manufacturing method of the component built-in module using the present invention, in which the manufacturing process in the second embodiment is partially changed. The same parts as those of the second embodiment are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 6A shows the resin block 14 and a part of the circuit component 12 that are simultaneously polished when the resin layer 17 in FIG. 5A is ground or polished. The circuit component 12 is not necessarily ground or polished. Therefore, the upper end portion of the interlayer connection conductor 16 formed on the upper surface of the resin block 14 is removed, and the cross section of the interlayer connection conductor 16 formed on the side surface is exposed.

  FIG. 6B shows a state where the second in-plane conductor 18 is patterned on the ground or polished resin layer 17. The second in-plane conductor 18 is connected to the cross section of the interlayer connection conductor 16 exposed by grinding or polishing.

  6C, as in FIG. 5C, the component built-in layer 22 is formed on the resin layer 17 and the wiring layers 23 and 24 are built-up laminated to form the component built-in module C. It is a thing.

  In the case of this embodiment, not only the resin layer 17 but also the resin block 14 and the circuit component 12 can be thinned by grinding / polishing to a thickness that does not affect the component characteristics. Further, since the ground / polished cross section of the interlayer connection conductor 16 formed by ink jet printing is necessarily exposed on the side surface of the resin block 14, the polished cross section and the second in-plane conductor 18 formed on the upper surface of the resin layer 17 are connected. Thus, reliable electrical connection becomes possible. In the case of the second embodiment, if there is variation in the height of the upper end portion of the interlayer connection conductor 16, it becomes difficult to set the grinding amount or the polishing amount. However, in the third embodiment, the height of the upper end portion of the interlayer connection conductor 16 is difficult. Therefore, it is easy to set the grinding amount or polishing amount.

  The shape of the resin block is not limited to the truncated pyramid shape as shown in FIG. 2, and various shapes as shown in FIG. 7 can be adopted. 7A is an example of a truncated cone-shaped resin block 30, FIG. 7B is an example of an L-shaped resin block 31 in plan view, and FIG. 7C is an example of a frame-shaped (ro-shaped) resin block 32. In addition, it may be a part having any shape such as a U-shape in plan view. In any case, since it has at least one inclined surface 30a, 31a, 32a, it is desirable that the interlayer connection conductors can be easily formed on these inclined surfaces by the ink jet method and a large number of interlayer connection conductors can be formed.

A wiring board B, C component built-in module 1 substrate 2 first in-plane conductor 3 resin layer 4 resin block 5 interlayer connection conductor 5a lower end portion 5b upper end portion 6 second in-plane conductor 7 inkjet device 10 substrate (transfer plate)
11 First in-plane conductor 12 Circuit component 14 Resin block 15 Adhesive 16 Interlayer connection conductor 17 Resin layer 18 Second in-plane conductor

Claims (11)

A first step of forming a first in-plane conductor on the substrate;
A second step of fixing a resin block on the substrate;
A third step of forming, on the side surface of the resin block fixed to the substrate, an interlayer connection conductor continuous in the vertical direction connected to the first in-plane conductor;
A fourth step of forming a resin layer around the resin block such that an upper end portion of the interlayer connection conductor is exposed;
A fifth step of forming a second in-plane conductor connected to the upper end of the interlayer connection conductor on the resin layer.   The method for manufacturing a wiring board according to claim 1, wherein in the third step, the interlayer connection conductor is formed by an inkjet method.  The resin block has a larger area than a surface facing a surface fixed on the substrate, and in the third step, the interlayer connection conductor is formed on an inclined side surface of the resin block. The manufacturing method of the wiring board of Claim 1 or 2.   The method for manufacturing a wiring board according to claim 1, wherein the resin block is formed of the same material as the resin layer.   5. The method of manufacturing a wiring substrate according to claim 1, wherein in the third step, the interlayer connection conductor is formed so as to overlap the first in-plane conductor. 6.   6. The method for manufacturing a wiring board according to claim 1, wherein, in the third step, the interlayer connection conductor is formed so as to continue to the upper surface of the resin block.   The method for manufacturing a wiring board according to claim 1, wherein a plurality of interlayer connection conductors are formed on a side surface of the single resin block.   8. The method for manufacturing a wiring board according to claim 1, wherein in the fourth step, the resin layer is formed by an inkjet method.   9. In the fourth step, after forming a resin layer thicker than the resin block, the interlayer connection conductor is exposed by grinding or polishing the upper surface of the resin layer. The manufacturing method of the wiring board in any one of.   9. The method for manufacturing a wiring board according to claim 1, wherein a resin layer having a thickness smaller than that of the resin block is formed in the fourth step. After the first step, including a step of mounting a circuit component on the first in-plane conductor,
The method for manufacturing a wiring board according to any one of claims 1 to 10, wherein in the fourth step, the circuit component is embedded together with the resin block in the resin layer.

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