IN2015DN02047A - - Google Patents
Info
- Publication number
- IN2015DN02047A IN2015DN02047A IN2047DEN2015A IN2015DN02047A IN 2015DN02047 A IN2015DN02047 A IN 2015DN02047A IN 2047DEN2015 A IN2047DEN2015 A IN 2047DEN2015A IN 2015DN02047 A IN2015DN02047 A IN 2015DN02047A
- Authority
- IN
- India
- Prior art keywords
- dielectric material
- conductive
- layer
- discontinuous layer
- conductive particles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/834,948 US20150282312A1 (en) | 2013-03-15 | 2013-03-15 | Systems and methods for providing surface connectivity of oriented conductive channels |
| US14/209,213 US9775235B2 (en) | 2013-03-15 | 2014-03-13 | Systems and methods for providing surface connectivity of oriented conductive channels |
| PCT/US2014/027622 WO2014152689A2 (en) | 2013-03-15 | 2014-03-14 | Systems and methods for providing surface connectivity of oriented conductive channels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2015DN02047A true IN2015DN02047A (ru) | 2015-08-14 |
Family
ID=51522410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2047DEN2015 IN2015DN02047A (ru) | 2013-03-15 | 2014-03-14 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US9775235B2 (ru) |
| EP (1) | EP2973607B1 (ru) |
| JP (2) | JP2016519390A (ru) |
| KR (1) | KR101849150B1 (ru) |
| CN (1) | CN104813413B (ru) |
| AU (1) | AU2014239280B2 (ru) |
| CA (1) | CA2891945A1 (ru) |
| IN (1) | IN2015DN02047A (ru) |
| WO (1) | WO2014152689A2 (ru) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
| GB2526268A (en) * | 2014-05-15 | 2015-11-25 | Richard Stone | Arc discharge assembly of dielectrophoretically aligned conductive particulates |
| JP2017057256A (ja) * | 2015-09-15 | 2017-03-23 | リンテック株式会社 | 導電性粘着シート |
| WO2020040726A1 (en) * | 2018-08-20 | 2020-02-27 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
| CA3118719A1 (en) * | 2018-11-05 | 2020-05-14 | Halion Displays Inc. | Optical activation of chemical entities in electrophoretic dispersions for display devices |
| AU2021241676B2 (en) | 2020-03-25 | 2024-03-07 | Flexcon Company, Inc. | Isotropic non-aqueous electrode sensing material |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US5082595A (en) | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
| JPH0788971A (ja) | 1993-09-21 | 1995-04-04 | Tokai Rubber Ind Ltd | 半導電性シート |
| JPH08315883A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | コネクタおよびコネクタ付基板とそれらの製造方法 |
| JPH08315946A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | 基板の接続方法および接続装置 |
| US6121508A (en) | 1995-12-29 | 2000-09-19 | 3M Innovative Properties Company | Polar, lipophilic pressure-sensitive adhesive compositions and medical devices using same |
| US5800685A (en) | 1996-10-28 | 1998-09-01 | Cardiotronics Systems, Inc. | Electrically conductive adhesive hydrogels |
| JP3257433B2 (ja) | 1997-03-05 | 2002-02-18 | ジェイエスアール株式会社 | 異方導電性シートの製造方法および異方導電性シート |
| JP3873503B2 (ja) | 1999-02-15 | 2007-01-24 | Ｊｓｒ株式会社 | 異方導電性シートおよびその製造方法 |
| AU2003226060A1 (en) | 2002-04-10 | 2003-10-27 | Flexcon Company, Inc. | Hydro-insensitive alternating current responsive composites |
| TWI220931B (en) * | 2003-04-23 | 2004-09-11 | Toppoly Optoelectronics Corp | Method of testing FPC bonding yield and FPC having testing pads thereon |
| US7620439B2 (en) * | 2005-08-04 | 2009-11-17 | 3M Innovative Properties Company | Conductive adhesives and biomedical articles including same |
| US7518376B2 (en) | 2007-02-16 | 2009-04-14 | Xerox Corporation | Electric field probe |
| JP5151902B2 (ja) * | 2008-10-21 | 2013-02-27 | 住友電気工業株式会社 | 異方導電性フィルム |
| JP4998520B2 (ja) * | 2009-06-15 | 2012-08-15 | 住友電気工業株式会社 | 電極の接続方法、電極の接続構造及び電子機器 |
| NO333507B1 (no) | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9818499B2 (en) * | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
| CN107889344A (zh) * | 2012-08-15 | 2018-04-06 | 深圳迈辽技术转移中心有限公司 | 软性电路板装置 |
| US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
-
2014
- 2014-03-13 US US14/209,213 patent/US9775235B2/en active Active
- 2014-03-14 CA CA2891945A patent/CA2891945A1/en not_active Abandoned
- 2014-03-14 EP EP14721637.8A patent/EP2973607B1/en active Active
- 2014-03-14 CN CN201480003209.1A patent/CN104813413B/zh active Active
- 2014-03-14 KR KR1020157013154A patent/KR101849150B1/ko active IP Right Grant
- 2014-03-14 AU AU2014239280A patent/AU2014239280B2/en active Active
- 2014-03-14 JP JP2016502496A patent/JP2016519390A/ja active Pending
- 2014-03-14 IN IN2047DEN2015 patent/IN2015DN02047A/en unknown
- 2014-03-14 WO PCT/US2014/027622 patent/WO2014152689A2/en active Application Filing
-
2017
- 2017-09-25 US US15/714,664 patent/US10499498B2/en active Active - Reinstated
-
2018
- 2018-01-12 JP JP2018003015A patent/JP2018092940A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN104813413A (zh) | 2015-07-29 |
| JP2016519390A (ja) | 2016-06-30 |
| US10499498B2 (en) | 2019-12-03 |
| EP2973607A2 (en) | 2016-01-20 |
| US20140262446A1 (en) | 2014-09-18 |
| JP2018092940A (ja) | 2018-06-14 |
| US9775235B2 (en) | 2017-09-26 |
| KR20150126341A (ko) | 2015-11-11 |
| AU2014239280B2 (en) | 2017-08-31 |
| AU2014239280A1 (en) | 2015-04-02 |
| WO2014152689A2 (en) | 2014-09-25 |
| KR101849150B1 (ko) | 2018-04-16 |
| US20180042108A1 (en) | 2018-02-08 |
| EP2973607B1 (en) | 2018-06-27 |
| CA2891945A1 (en) | 2014-09-25 |
| CN104813413B (zh) | 2019-04-30 |
| WO2014152689A3 (en) | 2014-12-18 |
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