IN2015DN02047A - - Google Patents
Info
- Publication number
- IN2015DN02047A IN2015DN02047A IN2047DEN2015A IN2015DN02047A IN 2015DN02047 A IN2015DN02047 A IN 2015DN02047A IN 2047DEN2015 A IN2047DEN2015 A IN 2047DEN2015A IN 2015DN02047 A IN2015DN02047 A IN 2015DN02047A
- Authority
- IN
- India
- Prior art keywords
- dielectric material
- conductive
- layer
- discontinuous layer
- conductive particles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/834,948 US20150282312A1 (en) | 2013-03-15 | 2013-03-15 | Systems and methods for providing surface connectivity of oriented conductive channels |
| US14/209,213 US9775235B2 (en) | 2013-03-15 | 2014-03-13 | Systems and methods for providing surface connectivity of oriented conductive channels |
| PCT/US2014/027622 WO2014152689A2 (en) | 2013-03-15 | 2014-03-14 | Systems and methods for providing surface connectivity of oriented conductive channels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2015DN02047A true IN2015DN02047A (ja) | 2015-08-14 |
Family
ID=51522410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2047DEN2015 IN2015DN02047A (ja) | 2013-03-15 | 2014-03-14 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US9775235B2 (ja) |
| EP (1) | EP2973607B1 (ja) |
| JP (2) | JP2016519390A (ja) |
| KR (1) | KR101849150B1 (ja) |
| CN (1) | CN104813413B (ja) |
| AU (1) | AU2014239280B2 (ja) |
| CA (1) | CA2891945A1 (ja) |
| IN (1) | IN2015DN02047A (ja) |
| WO (1) | WO2014152689A2 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9775235B2 (en) * | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
| GB2526268A (en) * | 2014-05-15 | 2015-11-25 | Richard Stone | Arc discharge assembly of dielectrophoretically aligned conductive particulates |
| JP2017057256A (ja) * | 2015-09-15 | 2017-03-23 | リンテック株式会社 | 導電性粘着シート |
| WO2020040726A1 (en) * | 2018-08-20 | 2020-02-27 | Avery Dennison Retail Information Services, Llc | Use of rf driven coherence between conductive particles for rfid antennas |
| JP2022506729A (ja) * | 2018-11-05 | 2022-01-17 | ハリオン ディスプレイズ インク | ディスプレイ装置用電気泳動分散液中における化学物質の光学活性化 |
| KR20220153628A (ko) | 2020-03-25 | 2022-11-18 | 플렉스콘 컴퍼니 인코포레이티드 | 등방성 비수성 전극 감지 물질 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170677A (en) * | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
| US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
| US5082595A (en) | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
| JPH0788971A (ja) | 1993-09-21 | 1995-04-04 | Tokai Rubber Ind Ltd | 半導電性シート |
| JPH08315883A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | コネクタおよびコネクタ付基板とそれらの製造方法 |
| JPH08315946A (ja) | 1995-03-14 | 1996-11-29 | Fujikura Rubber Ltd | 基板の接続方法および接続装置 |
| US6121508A (en) | 1995-12-29 | 2000-09-19 | 3M Innovative Properties Company | Polar, lipophilic pressure-sensitive adhesive compositions and medical devices using same |
| US5800685A (en) | 1996-10-28 | 1998-09-01 | Cardiotronics Systems, Inc. | Electrically conductive adhesive hydrogels |
| JP3257433B2 (ja) | 1997-03-05 | 2002-02-18 | ジェイエスアール株式会社 | 異方導電性シートの製造方法および異方導電性シート |
| JP3873503B2 (ja) | 1999-02-15 | 2007-01-24 | Ｊｓｒ株式会社 | 異方導電性シートおよびその製造方法 |
| US7651638B2 (en) | 2002-04-10 | 2010-01-26 | Flexcon Company, Inc. | Hydro-insensitive alternating current responsive composites |
| TWI220931B (en) * | 2003-04-23 | 2004-09-11 | Toppoly Optoelectronics Corp | Method of testing FPC bonding yield and FPC having testing pads thereon |
| US7620439B2 (en) | 2005-08-04 | 2009-11-17 | 3M Innovative Properties Company | Conductive adhesives and biomedical articles including same |
| US7518376B2 (en) | 2007-02-16 | 2009-04-14 | Xerox Corporation | Electric field probe |
| JP5151902B2 (ja) | 2008-10-21 | 2013-02-27 | 住友電気工業株式会社 | 異方導電性フィルム |
| JP4998520B2 (ja) * | 2009-06-15 | 2012-08-15 | 住友電気工業株式会社 | 電極の接続方法、電極の接続構造及び電子機器 |
| NO333507B1 (no) | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
| US9818499B2 (en) * | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
| CN107889344A (zh) * | 2012-08-15 | 2018-04-06 | 深圳迈辽技术转移中心有限公司 | 软性电路板装置 |
| US9775235B2 (en) | 2013-03-15 | 2017-09-26 | Flexcon Company, Inc. | Systems and methods for providing surface connectivity of oriented conductive channels |
-
2014
- 2014-03-13 US US14/209,213 patent/US9775235B2/en active Active
- 2014-03-14 CN CN201480003209.1A patent/CN104813413B/zh active Active
- 2014-03-14 JP JP2016502496A patent/JP2016519390A/ja active Pending
- 2014-03-14 WO PCT/US2014/027622 patent/WO2014152689A2/en active Application Filing
- 2014-03-14 IN IN2047DEN2015 patent/IN2015DN02047A/en unknown
- 2014-03-14 AU AU2014239280A patent/AU2014239280B2/en active Active
- 2014-03-14 EP EP14721637.8A patent/EP2973607B1/en active Active
- 2014-03-14 CA CA2891945A patent/CA2891945A1/en not_active Abandoned
- 2014-03-14 KR KR1020157013154A patent/KR101849150B1/ko active IP Right Grant
-
2017
- 2017-09-25 US US15/714,664 patent/US10499498B2/en active Active - Reinstated
-
2018
- 2018-01-12 JP JP2018003015A patent/JP2018092940A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2891945A1 (en) | 2014-09-25 |
| CN104813413B (zh) | 2019-04-30 |
| EP2973607B1 (en) | 2018-06-27 |
| EP2973607A2 (en) | 2016-01-20 |
| CN104813413A (zh) | 2015-07-29 |
| US9775235B2 (en) | 2017-09-26 |
| KR101849150B1 (ko) | 2018-04-16 |
| JP2018092940A (ja) | 2018-06-14 |
| US20140262446A1 (en) | 2014-09-18 |
| AU2014239280B2 (en) | 2017-08-31 |
| US10499498B2 (en) | 2019-12-03 |
| WO2014152689A3 (en) | 2014-12-18 |
| AU2014239280A1 (en) | 2015-04-02 |
| JP2016519390A (ja) | 2016-06-30 |
| WO2014152689A2 (en) | 2014-09-25 |
| US20180042108A1 (en) | 2018-02-08 |
| KR20150126341A (ko) | 2015-11-11 |
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