IN2014DN03101A - - Google Patents
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- Publication number
- IN2014DN03101A IN2014DN03101A IN3101DEN2014A IN2014DN03101A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A IN 3101DEN2014 A IN3101DEN2014 A IN 3101DEN2014A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A
- Authority
- IN
- India
- Prior art keywords
- piece
- sacrificial substrate
- wafers
- mpa
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11182589 | 2011-09-23 | ||
EP11190570A EP2572850A1 (de) | 2011-09-23 | 2011-11-24 | Opfersubstrat zur Verwendung beim Schneiden von Wafern |
PCT/IB2012/054972 WO2013042055A1 (en) | 2011-09-23 | 2012-09-19 | Wafer cutting sacrificial substrate for use in wafer cutting |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN03101A true IN2014DN03101A (de) | 2015-05-15 |
Family
ID=45421834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN3101DEN2014 IN2014DN03101A (de) | 2011-09-23 | 2012-09-19 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2572850A1 (de) |
CN (1) | CN103958140B (de) |
IN (1) | IN2014DN03101A (de) |
WO (1) | WO2013042055A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103522428A (zh) * | 2013-10-16 | 2014-01-22 | 内蒙古中环光伏材料有限公司 | 一种太阳能硅片加工方法及装置 |
CN107984024B (zh) * | 2016-10-26 | 2022-01-28 | 精密表面处理解决方案公司 | 线锯 |
CN108927908B (zh) * | 2018-07-12 | 2021-01-05 | 阜宁协鑫光伏科技有限公司 | 线切割机用的切割方法 |
CN109808271A (zh) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | 一种硅片切割用塑料支撑板及其制备方法 |
CN110076919A (zh) * | 2019-05-31 | 2019-08-02 | 江苏吉星新材料有限公司 | 一种蓝宝石晶棒浸没式多线切割装置及方法 |
CN114932636B (zh) * | 2022-04-28 | 2023-10-24 | 广东先导微电子科技有限公司 | 一种自动取片机 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2044482C3 (de) * | 1970-09-08 | 1979-04-12 | Cremer, Gottfried, Dr., 5000 Koeln | Verfahren zum Schneiden von keramischen Platten, insbesondere solchen großen Formats |
JPH1052816A (ja) * | 1996-08-13 | 1998-02-24 | M Ii M C Kk | ワイヤ式切断方法 |
DE102007045455A1 (de) * | 2007-09-24 | 2009-04-09 | Schott Ag | Verfahren zur Herstellung von Wafern aus Ingots |
KR20100120685A (ko) * | 2008-02-11 | 2010-11-16 | 엠이엠씨 일렉트로닉 머티리얼즈, 인크. | 잉곳을 웨이퍼로 와이어소우 슬라이싱하는데 사용되는 탄소 나노튜브 강화 와이어소우 빔 |
EP2111960B1 (de) | 2008-04-23 | 2011-03-09 | Applied Materials Switzerland SA | Montierscheibe für eine Drahtsägevorrichtung, Drahtsägevorrichtung damit, und Drahtsägeverfahren, das mit der Vorrichtung durchgeführt wird |
CN102413981A (zh) | 2009-05-04 | 2012-04-11 | 梅耶博格公司 | 线锯 |
MY155758A (en) * | 2010-01-06 | 2015-11-30 | Shinetsu Chemical Co | Rare earth magnet holding jig and cutting machine |
-
2011
- 2011-11-24 EP EP11190570A patent/EP2572850A1/de not_active Withdrawn
-
2012
- 2012-09-19 WO PCT/IB2012/054972 patent/WO2013042055A1/en active Application Filing
- 2012-09-19 IN IN3101DEN2014 patent/IN2014DN03101A/en unknown
- 2012-09-19 CN CN201280057521.XA patent/CN103958140B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2572850A1 (de) | 2013-03-27 |
CN103958140B (zh) | 2020-06-09 |
WO2013042055A1 (en) | 2013-03-28 |
CN103958140A (zh) | 2014-07-30 |
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