IN2013MU01206A - - Google Patents

Info

Publication number
IN2013MU01206A
IN2013MU01206A IN1206MU2013A IN2013MU01206A IN 2013MU01206 A IN2013MU01206 A IN 2013MU01206A IN 1206MU2013 A IN1206MU2013 A IN 1206MU2013A IN 2013MU01206 A IN2013MU01206 A IN 2013MU01206A
Authority
IN
India
Prior art keywords
circuit board
conductive pad
electrically
fixing means
couple
Prior art date
Application number
Other languages
English (en)
Inventor
Dnyaneshwar Prabhakarrao Bujade
Sarang Sharad Ghodke
Dilesh Arvind Raut
Original Assignee
Control Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Control Tech Ltd filed Critical Control Tech Ltd
Priority to IN1206MU2013 priority Critical patent/IN2013MU01206A/en
Priority to GB1308444.7A priority patent/GB2514333A/en
Priority to CN201410122356.2A priority patent/CN104080271B/zh
Priority to CN201420148333.4U priority patent/CN204031589U/zh
Priority to US14/228,964 priority patent/US20140290052A1/en
Publication of IN2013MU01206A publication Critical patent/IN2013MU01206A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IN1206MU2013 2013-03-28 2013-03-28 IN2013MU01206A (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IN1206MU2013 IN2013MU01206A (de) 2013-03-28 2013-03-28
GB1308444.7A GB2514333A (en) 2013-03-28 2013-05-10 Apparatus for coupling circuit boards
CN201410122356.2A CN104080271B (zh) 2013-03-28 2014-03-28 用于耦接电路板的装置
CN201420148333.4U CN204031589U (zh) 2013-03-28 2014-03-28 用于连接两个或更多个电路板的装置
US14/228,964 US20140290052A1 (en) 2013-03-28 2014-03-28 Apparatus For Coupling Circuit Boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN1206MU2013 IN2013MU01206A (de) 2013-03-28 2013-03-28

Publications (1)

Publication Number Publication Date
IN2013MU01206A true IN2013MU01206A (de) 2015-04-10

Family

ID=48672130

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1206MU2013 IN2013MU01206A (de) 2013-03-28 2013-03-28

Country Status (4)

Country Link
US (1) US20140290052A1 (de)
CN (2) CN104080271B (de)
GB (1) GB2514333A (de)
IN (1) IN2013MU01206A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6255947B2 (ja) * 2013-11-28 2018-01-10 富士通株式会社 電子装置および間隔管
GB2544419B (en) 2015-07-27 2017-09-06 Sevcon Ltd Power electronics assembly
US10111368B2 (en) * 2015-12-17 2018-10-23 Intel Corporation Flexible substrate retention on a reusable carrier
TWI556707B (zh) * 2015-12-17 2016-11-01 技嘉科技股份有限公司 電子組件
SG10201702885PA (en) 2016-04-20 2017-11-29 Lam Res Corp Apparatus for measuring condition of electroplating cell components and associated methods
JP6627683B2 (ja) * 2016-07-29 2020-01-08 住友電装株式会社 電気機器
US11107962B2 (en) 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960424A (en) * 1974-10-02 1976-06-01 Amp Incorporated Multi-contact spring connector for board to board connections
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
JPH06314580A (ja) * 1992-08-05 1994-11-08 Amp Japan Ltd 二基板接続用同軸コネクタ
US6027345A (en) * 1998-03-06 2000-02-22 Hon Hai Precision Ind. Co., Ltd. Matrix-type electrical connector
US6520789B2 (en) * 2001-05-22 2003-02-18 Delphi Technologies, Inc. Connecting system for printed circuit boards
US6869291B2 (en) * 2002-09-19 2005-03-22 Delphi Technologies, Inc. Electrical connector having improved elastomeric contact pressure pad
US7104805B2 (en) * 2004-08-31 2006-09-12 American Power Conversion Corporation Board to board current connection
JP5017827B2 (ja) * 2005-09-20 2012-09-05 株式会社日立製作所 電磁波発生源探査方法及びそれに用いる電流プローブ
WO2007138843A1 (ja) * 2006-05-31 2007-12-06 Nec Corporation 回路基板装置、配線基板間接続方法及び回路基板モジュール装置
US8351216B2 (en) * 2007-07-09 2013-01-08 Power Concepts Nz Limited Layered structure connection and assembly
CN102238806A (zh) * 2010-04-28 2011-11-09 富葵精密组件(深圳)有限公司 电路板模组

Also Published As

Publication number Publication date
CN104080271A (zh) 2014-10-01
GB201308444D0 (en) 2013-06-19
US20140290052A1 (en) 2014-10-02
CN104080271B (zh) 2017-10-03
GB2514333A (en) 2014-11-26
CN204031589U (zh) 2014-12-17

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