SG10201702885PA - Apparatus for measuring condition of electroplating cell components and associated methods - Google Patents

Apparatus for measuring condition of electroplating cell components and associated methods

Info

Publication number
SG10201702885PA
SG10201702885PA SG10201702885PA SG10201702885PA SG10201702885PA SG 10201702885P A SG10201702885P A SG 10201702885PA SG 10201702885P A SG10201702885P A SG 10201702885PA SG 10201702885P A SG10201702885P A SG 10201702885PA SG 10201702885P A SG10201702885P A SG 10201702885PA
Authority
SG
Singapore
Prior art keywords
associated methods
cell components
measuring condition
electroplating cell
electroplating
Prior art date
Application number
SG10201702885PA
Inventor
e emerson Mark
T Mayer Steven
Ossowski Lawrence
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201702885PA publication Critical patent/SG10201702885PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/44—Testing lamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
SG10201702885PA 2016-04-20 2017-04-07 Apparatus for measuring condition of electroplating cell components and associated methods SG10201702885PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201662325237P 2016-04-20 2016-04-20

Publications (1)

Publication Number Publication Date
SG10201702885PA true SG10201702885PA (en) 2017-11-29

Family

ID=60089012

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201702885PA SG10201702885PA (en) 2016-04-20 2017-04-07 Apparatus for measuring condition of electroplating cell components and associated methods

Country Status (5)

Country Link
US (2) US10436829B2 (en)
KR (2) KR102432626B1 (en)
CN (2) CN111624455B (en)
SG (1) SG10201702885PA (en)
TW (1) TWI735566B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201702885PA (en) * 2016-04-20 2017-11-29 Lam Res Corp Apparatus for measuring condition of electroplating cell components and associated methods
US11169192B2 (en) * 2018-04-23 2021-11-09 The Government Of The United States, As Represented By The Secretary Of The Army Trigonometry dependent plot creation
CN112068022B (en) * 2020-09-10 2023-01-24 浪潮商用机器有限公司 Current characteristic detection method and system of direct current power supply and related components

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197494A (en) * 1997-09-18 1999-04-09 Hitachi Ltd Semiconductor device and its manufacture
US6563299B1 (en) * 2000-08-30 2003-05-13 Micron Technology, Inc. Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
US6828647B2 (en) 2001-04-05 2004-12-07 Infineon Technologies Ag Structure for determining edges of regions in a semiconductor wafer
US7344899B2 (en) 2002-01-22 2008-03-18 Micron Technology, Inc. Die assembly and method for forming a die on a wafer
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7135852B2 (en) * 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7256055B2 (en) * 2003-08-25 2007-08-14 Tau-Metrix, Inc. System and apparatus for using test structures inside of a chip during the fabrication of the chip
CN101329663B (en) * 2008-07-31 2010-04-21 炬力集成电路设计有限公司 Apparatus and method for implementing pin time-sharing multiplexing
US8013333B2 (en) 2008-11-07 2011-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor test pad structures
TWI473223B (en) 2009-08-19 2015-02-11 Xintec Inc Chip package and fabrication method thereof
TWI619218B (en) 2010-05-11 2018-03-21 精材科技股份有限公司 Chip package and method for forming the same
US20110278054A1 (en) * 2010-05-14 2011-11-17 I-Tseng Lee Circuit board with notched conductor pads
CN102034683B (en) 2010-10-14 2013-03-20 友达光电股份有限公司 Laser repairing stand
IN2013MU01206A (en) 2013-03-28 2015-04-10 Control Tech Ltd
US9822460B2 (en) * 2014-01-21 2017-11-21 Lam Research Corporation Methods and apparatuses for electroplating and seed layer detection
SG10201702885PA (en) * 2016-04-20 2017-11-29 Lam Res Corp Apparatus for measuring condition of electroplating cell components and associated methods

Also Published As

Publication number Publication date
CN107329069A (en) 2017-11-07
KR20170120034A (en) 2017-10-30
KR102432626B1 (en) 2022-08-12
US10436829B2 (en) 2019-10-08
TW201802468A (en) 2018-01-16
TWI735566B (en) 2021-08-11
KR102598276B1 (en) 2023-11-06
KR20220118367A (en) 2022-08-25
US20200011914A1 (en) 2020-01-09
CN111624455A (en) 2020-09-04
CN107329069B (en) 2020-03-10
CN111624455B (en) 2023-04-04
US20170307554A1 (en) 2017-10-26
US10989747B2 (en) 2021-04-27

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