IN2012DN03051A - - Google Patents

Download PDF

Info

Publication number
IN2012DN03051A
IN2012DN03051A IN3051DEN2012A IN2012DN03051A IN 2012DN03051 A IN2012DN03051 A IN 2012DN03051A IN 3051DEN2012 A IN3051DEN2012 A IN 3051DEN2012A IN 2012DN03051 A IN2012DN03051 A IN 2012DN03051A
Authority
IN
India
Prior art keywords
devices
growth substrate
methods
flexible
reuse
Prior art date
Application number
Other languages
English (en)
Inventor
R Forrest Stephen
Zimmerman Jeramy
Lee Kyusang
Shiu Kuen-Ting
Original Assignee
Univ Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Michigan filed Critical Univ Michigan
Publication of IN2012DN03051A publication Critical patent/IN2012DN03051A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0735Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising only AIIIBV compound semiconductors, e.g. GaAs/AlGaAs or InP/GaInAs solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • H01L31/1852Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP comprising a growth substrate not being an AIIIBV compound
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
    • H01L31/1896Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Weting (AREA)
IN3051DEN2012 2009-09-10 2010-09-09 IN2012DN03051A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US24137309P 2009-09-10 2009-09-10
US24137409P 2009-09-10 2009-09-10
US35829810P 2010-06-24 2010-06-24
PCT/US2010/048213 WO2011066029A2 (en) 2009-09-10 2010-09-09 Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth

Publications (1)

Publication Number Publication Date
IN2012DN03051A true IN2012DN03051A (ko) 2015-07-31

Family

ID=44067165

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3051DEN2012 IN2012DN03051A (ko) 2009-09-10 2010-09-09

Country Status (10)

Country Link
US (2) US8378385B2 (ko)
EP (1) EP2462631B1 (ko)
JP (1) JP5619901B2 (ko)
KR (1) KR101714812B1 (ko)
CN (1) CN102804408B (ko)
AU (1) AU2010325106B2 (ko)
CA (1) CA2789391A1 (ko)
IN (1) IN2012DN03051A (ko)
TW (1) TWI550895B (ko)
WO (1) WO2011066029A2 (ko)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9040392B2 (en) 2011-06-15 2015-05-26 International Business Machines Corporation Method for controlled removal of a semiconductor device layer from a base substrate
CN103946973A (zh) * 2011-06-29 2014-07-23 密歇根大学董事会 用于外延层剥离后晶片重新利用的牺牲性蚀刻保护层
AU2012280933A1 (en) * 2011-07-06 2014-01-23 The Regents Of The University Of Michigan Integrated solar collectors using epitaxial lift off and cold weld bonded semiconductor solar cells
CN102244134B (zh) * 2011-08-02 2013-05-15 厦门市三安光电科技有限公司 一种高效四结太阳能电池及其制作方法
US8541315B2 (en) * 2011-09-19 2013-09-24 International Business Machines Corporation High throughput epitaxial lift off for flexible electronics
US8916954B2 (en) * 2012-02-05 2014-12-23 Gtat Corporation Multi-layer metal support
US8841161B2 (en) * 2012-02-05 2014-09-23 GTAT.Corporation Method for forming flexible solar cells
KR20140128393A (ko) 2012-02-07 2014-11-05 더 리젠츠 오브 더 유니버시티 오브 미시간 에피택셜 리프트 오프 후 웨이퍼 재사용을 위한 열 표면 처리
KR20130104974A (ko) 2012-03-16 2013-09-25 삼성전자주식회사 반도체 발광소자 제조방법
US8785294B2 (en) 2012-07-26 2014-07-22 Gtat Corporation Silicon carbide lamina
US20140137930A1 (en) * 2012-11-16 2014-05-22 Solar Junction Corporation Multijunction solar cells
BR112015023736A2 (pt) * 2013-03-15 2017-07-18 First Solar Inc método para manufaturar dispositivo fotovoltaico
CN103346079A (zh) * 2013-06-07 2013-10-09 刘凤全 一种重复使用的半导体基底及其纯化重复使用方法
US10658998B2 (en) 2013-07-31 2020-05-19 Oepic Semiconductors, Inc. Piezoelectric film transfer for acoustic resonators and filters
US10186629B2 (en) 2013-08-26 2019-01-22 The Regents Of The University Of Michigan Thin film lift-off via combination of epitaxial lift-off and spalling
CN103489958B (zh) * 2013-08-27 2015-09-02 湖南红太阳光电科技有限公司 一种柔性硅基砷化镓电池的制备方法
AU2014381597A1 (en) * 2013-11-11 2016-05-26 The Regents Of The University Of Michigan Thermally-assisted cold-weld bonding for epitaxial lift-off process
TW201539971A (zh) 2013-11-29 2015-10-16 Univ Michigan 利用剪紙工藝啟發之微結構於平板光伏打面板之自主太陽能追蹤
US10535685B2 (en) 2013-12-02 2020-01-14 The Regents Of The University Of Michigan Fabrication of thin-film electronic devices with non-destructive wafer reuse
WO2015156874A2 (en) 2014-01-15 2015-10-15 The Regents Of The Univerity Of Michigan Integration of epitaxial lift-off solar cells with mini-parabolic concentrator arrays via printing method
US10680132B2 (en) * 2014-01-15 2020-06-09 The Regents Of The University Of Michigan Non-destructive wafer recycling for epitaxial lift-off thin-film device using a superlattice epitaxial layer
US10141465B2 (en) * 2014-04-04 2018-11-27 The Regents Of The University Of Michigan Epitaxial lift-off processed GaAs thin-film solar cells integrated with non-tracking mini-compound parabolic concentrators
KR20160143719A (ko) 2014-04-04 2016-12-14 더 리젠츠 오브 더 유니버시티 오브 미시간 비추적식 소형 복합 파라볼라 집광기와 통합된 에피텍셜 리프트 오프 처리된 GaAs 박막 태양 전지
WO2015168272A1 (en) 2014-04-29 2015-11-05 The Regents Of The University Of Michigan Flexible antenna integrated with an array of solar cells
US9786643B2 (en) 2014-07-08 2017-10-10 Micron Technology, Inc. Semiconductor devices comprising protected side surfaces and related methods
CN104241205B (zh) * 2014-09-18 2017-04-26 厦门乾照光电股份有限公司 一种衬底可剥离的外延结构及其应用
US9263626B1 (en) 2015-01-29 2016-02-16 International Business Machines Corporation Crystalline thin film photovoltaic cell
CN107624197A (zh) 2015-03-18 2018-01-23 密歇根大学董事会 通过预图案化台面进行的减轻应变的外延剥离
KR101743017B1 (ko) 2015-05-19 2017-06-05 한국과학기술연구원 고속 에피택셜 리프트오프와 iii-v족 직접 성장용 템플릿을 이용한 반도체 소자의 제조 방법 및 이에 의해 제조된 반도체 소자
CN105140318B (zh) * 2015-06-30 2017-05-17 苏州强明光电有限公司 太阳能电池外延片及其制作方法
CN104993003B (zh) * 2015-07-16 2017-03-08 苏州强明光电有限公司 一种太阳能电池外延片及其制作方法
US20180337082A1 (en) * 2015-08-31 2018-11-22 Stc.Unm Mixed group-v sacrificial layers for release and transfer of membranes
CN105428215A (zh) * 2015-11-19 2016-03-23 中山德华芯片技术有限公司 一种基于金属应力层及亲水剂处理的外延片整面剥离方法
CN105428427B (zh) * 2015-12-11 2017-06-27 中国电子科技集团公司第十八研究所 薄膜砷化镓太阳电池衬底复用的衬底保护结构及加工工艺
WO2017196431A2 (en) 2016-02-24 2017-11-16 The Regents Of The University Of Michigan Effective compound substrate for non-destructive epitaxial lift-off
US9941168B1 (en) 2016-09-21 2018-04-10 Korea Institute Of Science And Technology Method for manufacturing semiconductor device by epitaxial lift-off using plane dependency of III-V compound
KR101824523B1 (ko) * 2017-01-11 2018-02-01 엘지전자 주식회사 태양 전지 모듈 및 이를 구비하는 휴대용 충전기
CN107634121A (zh) * 2017-08-15 2018-01-26 苏州苏纳光电有限公司 基于InP衬底剥离的红外光电探测器及其预制件的制备方法
US10553743B2 (en) 2017-11-20 2020-02-04 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Flexible crystalline ultra-thin Si solar cells
CN108040435B (zh) * 2017-12-12 2020-06-19 北京科技大学 一种氮化铝陶瓷基板线路刻蚀方法
EP3743948A4 (en) * 2018-01-25 2021-11-03 Saint-Gobain ADFORS Canada, Ltd. PHOTOVOLTAIC TEXTILE
KR20200108485A (ko) * 2018-02-02 2020-09-18 미합중국 (관리부서 : 미합중국 해군성) 초박형 가요성 후방 접촉 실리콘 태양 전지들 및 이를 제조하기 위한 방법들
CN108520901A (zh) * 2018-04-16 2018-09-11 江苏宜兴德融科技有限公司 薄膜太阳能电池及其制造方法
US12046471B1 (en) 2018-06-06 2024-07-23 United States Of America As Represented By The Secretary Of The Air Force Optimized thick heteroepitaxial growth of semiconductors with in-situ substrate pretreatment
KR102131619B1 (ko) * 2018-06-12 2020-07-08 한국과학기술연구원 인화계 기판의 결정결함을 방지하기 위해 박막층을 형성하는 방법
KR20200021775A (ko) * 2018-08-21 2020-03-02 엘지전자 주식회사 지지 핸들 및 이를 이용한 화합물 반도체 태양전지의 제조 방법
US11087974B2 (en) * 2018-10-08 2021-08-10 The Regents Of The University Of Michigan Preparation of compound semiconductor substrate for epitaxial growth via non-destructive epitaxial lift-off
CN109321253A (zh) * 2018-11-28 2019-02-12 湖北兴福电子材料有限公司 一种硅晶圆的蚀刻液
CN110224045B (zh) * 2019-07-16 2021-06-15 中国科学院上海技术物理研究所 一种柔性InGaAs探测器的制备方法
RU196935U1 (ru) * 2019-10-09 2020-03-23 федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет "МИФИ" (НИЯУ МИФИ) КАЛИБРОВОЧНАЯ ДВУХПЕРИОДНАЯ СВЕРХРЕШЕТКА InAlAs/InGaAs НА ПОДЛОЖКЕ InP
JP2022013255A (ja) * 2020-07-03 2022-01-18 信越半導体株式会社 接合型半導体ウェーハの製造方法及び接合型半導体素子の製造方法
CN111785794B (zh) * 2020-07-20 2023-09-08 西安电子科技大学 基于ScAlN与InAlN极化插入层增强电场的N极性InGaN基太阳能电池
US20230275173A1 (en) * 2020-09-23 2023-08-31 Antora Energy, Inc. Structures and methods for producing an optoelectronic device
CN112701176B (zh) * 2021-03-23 2021-06-08 南昌凯迅光电有限公司 一种砷化镓薄膜太阳电池及制作方法
KR102625586B1 (ko) * 2021-07-14 2024-01-16 한국광기술원 기판의 재활용이 가능한 ⅲ-ⅴ족 나노로드 태양전지 제조방법
WO2024189753A1 (ja) * 2023-03-13 2024-09-19 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288297A (ja) * 1995-04-13 1996-11-01 Nippon Telegr & Teleph Corp <Ntt> ヘテロ接合バイポーラトランジスタおよびその製造方法
JP2002284600A (ja) 2001-03-26 2002-10-03 Hitachi Cable Ltd 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板
US6895667B2 (en) * 2001-04-13 2005-05-24 The Trustees Of Princeton University Transfer of patterned metal by cold-welding
KR100438895B1 (ko) 2001-12-28 2004-07-02 한국전자통신연구원 고전자 이동도 트랜지스터 전력 소자 및 그 제조 방법
US8173891B2 (en) * 2002-05-21 2012-05-08 Alliance For Sustainable Energy, Llc Monolithic, multi-bandgap, tandem, ultra-thin, strain-counterbalanced, photovoltaic energy converters with optimal subcell bandgaps
EP1532677B1 (en) * 2002-08-26 2011-08-03 S.O.I.Tec Silicon on Insulator Technologies Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom
JP4315744B2 (ja) * 2003-06-25 2009-08-19 株式会社沖データ 積層体及び半導体装置の製造方法
WO2005089098A2 (en) * 2004-01-14 2005-09-29 The Regents Of The University Of California Ultra broadband mirror using subwavelength grating
JP4518886B2 (ja) * 2004-09-09 2010-08-04 シャープ株式会社 半導体素子の製造方法
JP2007036010A (ja) 2005-07-28 2007-02-08 Toshiba Corp ショットキーバリアダイオード装置及びその製造方法
DE102005047152A1 (de) * 2005-09-30 2007-04-12 Osram Opto Semiconductors Gmbh Epitaxiesubstrat, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Halbleiterchips
US7709269B2 (en) * 2006-01-17 2010-05-04 Cree, Inc. Methods of fabricating transistors including dielectrically-supported gate electrodes
US20100047959A1 (en) 2006-08-07 2010-02-25 Emcore Solar Power, Inc. Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells
JP2008053250A (ja) * 2006-08-22 2008-03-06 Sony Corp 半導体装置の製造方法
KR101090900B1 (ko) * 2006-10-18 2011-12-08 니텍 인코포레이티드 수직구조의 심자외선 발광다이오드
SG182990A1 (en) * 2007-07-03 2012-08-30 Microlink Devices Inc Thin film iii-v compound solar cell
TW200905922A (en) * 2007-07-30 2009-02-01 Juh-Yuh Su Reusable substrate structure and method of handling the same

Also Published As

Publication number Publication date
EP2462631A2 (en) 2012-06-13
WO2011066029A3 (en) 2012-05-31
JP2013504878A (ja) 2013-02-07
KR101714812B1 (ko) 2017-03-22
TW201125152A (en) 2011-07-16
CN102804408A (zh) 2012-11-28
TWI550895B (zh) 2016-09-21
US20130237001A1 (en) 2013-09-12
AU2010325106A1 (en) 2012-04-12
JP5619901B2 (ja) 2014-11-05
EP2462631B1 (en) 2021-06-30
AU2010325106B2 (en) 2015-04-09
KR20120103762A (ko) 2012-09-19
US20110186910A1 (en) 2011-08-04
CN102804408B (zh) 2016-01-20
US8927319B2 (en) 2015-01-06
US8378385B2 (en) 2013-02-19
CA2789391A1 (en) 2011-06-03
WO2011066029A2 (en) 2011-06-03

Similar Documents

Publication Publication Date Title
IN2012DN03051A (ko)
WO2013061047A3 (en) Silicon carbide epitaxy
EP2423356A4 (en) PROCESS FOR PRODUCING INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR PRODUCING EPITAXIAL WAFER, INDIUM PHOSPHIDE SUBSTRATE, AND EPITAXIAL WAFER
EP2642001A4 (en) PROCESS FOR PREPARING AN EPITACTIC SILICON CARBIDE SINGLE CRYSTAL SUBSTRATE
EP2472568A4 (en) Silicon carbide epitaxial wafer and manufacturing method therefor
WO2012037532A3 (en) Concentrated solar power generation using solar receivers
UA104927C2 (uk) Стабілізація руху нестійких фрагментів космічного сміття
EP2555227A4 (en) EPITACTIC SILICON WAFER AND METHOD FOR THE PRODUCTION THEREOF, AND JOINT SOI WAFERS, AND METHOD FOR THE PRODUCTION THEREOF
EP2570522A4 (en) MONOCRYSTALLINE SUBSTRATE BASED ON EPITAXIAL SILICON CARBIDE AND METHOD FOR PRODUCING THE SAME
WO2011155858A3 (en) Method of graphene manufacturing
EP2518840A4 (en) GROUP III NITRIDE SEMICONDUCTOR LASER ELEMENT, METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR LASER ELEMENT, AND EPITAXIAL SUBSTRATE
WO2012166974A3 (en) Tunneling-junction solar cell with copper grid for concentrated photovoltaic application
PL2395830T3 (pl) Sposób hodowli roślin oraz pływający nośnik
WO2012057512A3 (ko) 화합물 반도체 장치 및 그 제조 방법
USD699346S1 (en) Backsheet of a diaper
MY158420A (en) P-doped silicon layers
WO2011092327A3 (de) Iii-v-halbleiter-solarzelle
WO2009116830A3 (ko) 반도체 소자 및 그 제조방법
WO2008155087A3 (de) Plasmareaktor und verfahren zur herstellung einkristalliner diamantschichten
EP2615629A4 (en) EPITAXIAL SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR PRODUCING EPITAXIAL SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT
PL2122015T3 (pl) Sposób wytwarzania monokryształu azotku przez wzrost epitaksjalny na podłożu zapobiegającym wzrostowi na krawędziach podłoża
WO2013084160A3 (en) Graphene composite and a method of manufacturing a graphene composite
EP2674969A4 (en) Substrate having etching mask and method for producing same
EP2612958A4 (en) METHOD FOR PRODUCING A SILICON CARBIDE INK CRYSTAL, SILICON CARBIDE INK CRYSTAL AND SILICON CARBIDE MONTERRY SUBSTRATE
WO2012020382A3 (en) Modified mask for photolithography of a wafer with recess, method for producing such a mask and method for photolithography of a wafer with recess