IN190932B - - Google Patents

Info

Publication number
IN190932B
IN190932B IN125CA1997A IN190932B IN 190932 B IN190932 B IN 190932B IN 125CA1997 A IN125CA1997 A IN 125CA1997A IN 190932 B IN190932 B IN 190932B
Authority
IN
India
Prior art keywords
card
layer
module element
levelling
top layer
Prior art date
Application number
Other languages
English (en)
Inventor
Roland Melzer
Detlef Dr Houdeau
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IN190932B publication Critical patent/IN190932B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Multi-Process Working Machines And Systems (AREA)
IN125CA1997 1996-01-26 1997-01-22 IN190932B (uk)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19602821A DE19602821C1 (de) 1996-01-26 1996-01-26 Verfahren zur Herstellung einer Datenkarte

Publications (1)

Publication Number Publication Date
IN190932B true IN190932B (uk) 2003-09-06

Family

ID=7783778

Family Applications (1)

Application Number Title Priority Date Filing Date
IN125CA1997 IN190932B (uk) 1996-01-26 1997-01-22

Country Status (12)

Country Link
US (1) US6305609B1 (uk)
EP (1) EP0976103B1 (uk)
JP (1) JP2000503436A (uk)
KR (1) KR19990082014A (uk)
CN (1) CN1196083C (uk)
AT (1) ATE216107T1 (uk)
DE (2) DE19602821C1 (uk)
ES (1) ES2175353T3 (uk)
IN (1) IN190932B (uk)
RU (1) RU2176819C2 (uk)
UA (1) UA46088C2 (uk)
WO (1) WO1997027564A1 (uk)

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AU761995B2 (en) 1997-09-11 2003-06-12 Precision Dynamics Corporation Laminated radio frequency identification device
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
FR2793577B1 (fr) * 1999-05-12 2001-11-02 Gemplus Card Int Procede de fabrication d'une carte sans contact
JP4588139B2 (ja) * 1999-08-31 2010-11-24 リンテック株式会社 Ｉｃカードの製造方法
EP1089220B1 (de) * 1999-10-01 2001-04-11 Sihl GmbH Mehrschichtige Laminatbahn mit integrierten RFID-Transpondern, insbesondere in Rollenform
US6557766B1 (en) * 1999-10-01 2003-05-06 Keith R. Leighton Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process
FR2803412A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Procede de fabrication continue de cartes a circuit integre
FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
DE10016715C1 (de) * 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US20020183882A1 (en) 2000-10-20 2002-12-05 Michael Dearing RF point of sale and delivery method and system using communication with remote computer and having features to read a large number of RF tags
USRE47599E1 (en) 2000-10-20 2019-09-10 Promega Corporation RF point of sale and delivery method and system using communication with remote computer and having features to read a large number of RF tags
DE60144402D1 (de) * 2000-10-20 2011-05-19 Promega Corp Hochfrequenzidenfikationsverfahren und System zum Verteilen von Produkten
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
DE10135595C1 (de) * 2001-07-20 2003-02-13 Optimel Schmelzgustechnik Gmbh Verfahren zum kontinuierlichen Herstellen von dünnen, beidseitig mit Isoliermaterialien umhüllten Transpondern
FR2832354B1 (fr) * 2001-11-20 2004-02-20 Arjo Wiggins Sa Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille
CA2518614A1 (en) * 2002-04-24 2003-11-06 Mineral Lassen Llc Manufacturing method for a wireless communication device and manufacturing apparatus
US7140540B2 (en) * 2002-05-08 2006-11-28 Lasercard Corporation Method of making secure personal data card
FR2847364B1 (fr) * 2002-11-15 2005-04-29 Smartware Procede de fabrication de boitier moule comportant des composants contact et/ou sans contact
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
US20040188010A1 (en) * 2003-03-24 2004-09-30 Chaoui Sam M. Continuous lamination of RFID bands and inlets
FR2868987B1 (fr) * 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US7290713B2 (en) * 2005-01-18 2007-11-06 Target Brands, Inc. Stored-value card with sound and light
US7785932B2 (en) * 2005-02-01 2010-08-31 Nagraid S.A. Placement method of an electronic module on a substrate and device produced by said method
US8119458B2 (en) * 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
EP1742173A3 (de) * 2005-06-21 2007-08-22 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
FR2895118B1 (fr) * 2005-12-15 2008-06-13 Arjowiggins Security Soc Par A Film de pelliculage incorporant une puce
US7777317B2 (en) 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
EP1991417A4 (en) * 2006-01-24 2011-06-08 Mycrolab Pty Ltd PROCESSES FOR THE GOOD MANUFACTURING OF MATERIALS AND COMPLEX LAMINATE DEVICES
US7654465B2 (en) * 2006-02-03 2010-02-02 Arthur Blank & Company, Inc. Method and apparatus for forming transaction cards and other sheet plastic products
US7316357B2 (en) * 2006-04-14 2008-01-08 Target Brands, Inc. Stored-value card with bubble wand
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US7710275B2 (en) 2007-03-16 2010-05-04 Promega Corporation RFID reader enclosure and man-o-war RFID reader system
US7784686B2 (en) * 2007-12-27 2010-08-31 Target Brands, Inc. Transaction card with enclosed chamber
US20090184168A1 (en) * 2008-01-17 2009-07-23 Roger Ricketts Recyclable plastic cards and methods of making same
DE102008021944A1 (de) * 2008-05-02 2009-11-05 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Aufbringen streifenförmiger Endlosfolien auf eine Substratbahn
DE102008034984C5 (de) * 2008-07-25 2018-06-14 Atlantic Zeiser Gmbh Verfahren zur Herstellung einer Kunststoffkarte
US8047443B2 (en) * 2008-10-23 2011-11-01 Ocelot, Llc Data storage devices
FR2944121B1 (fr) * 2009-04-03 2016-06-24 Paragon Identification Carte d'identification de radio frequence(rfid) semi-rigide, le procede de fabrication et la machine permettant sa fabrication
US8690064B2 (en) * 2009-04-30 2014-04-08 Abnote Usa, Inc. Transaction card assembly and methods of manufacture
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
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US9710745B1 (en) * 2012-02-09 2017-07-18 Dynamics Inc. Systems and methods for automated assembly of dynamic magnetic stripe communications devices
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Also Published As

Publication number Publication date
RU2176819C2 (ru) 2001-12-10
KR19990082014A (ko) 1999-11-15
DE59707003D1 (de) 2002-05-16
UA46088C2 (uk) 2002-05-15
JP2000503436A (ja) 2000-03-21
EP0976103B1 (de) 2002-04-10
CN1196083C (zh) 2005-04-06
DE19602821C1 (de) 1997-06-26
WO1997027564A1 (de) 1997-07-31
US6305609B1 (en) 2001-10-23
ES2175353T3 (es) 2002-11-16
EP0976103A1 (de) 2000-02-02
ATE216107T1 (de) 2002-04-15
CN1214780A (zh) 1999-04-21

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