IN185476B - - Google Patents

Info

Publication number
IN185476B
IN185476B IN1546CA1995A IN185476B IN 185476 B IN185476 B IN 185476B IN 1546CA1995 A IN1546CA1995 A IN 1546CA1995A IN 185476 B IN185476 B IN 185476B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Roh Jae-Woo
Original Assignee
Daewoo Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daewoo Electronics Co Ltd filed Critical Daewoo Electronics Co Ltd
Publication of IN185476B publication Critical patent/IN185476B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IN1546CA1995 1995-02-15 1995-11-30 IN185476B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950002765A KR100258802B1 (ko) 1995-02-15 1995-02-15 평탄화 장치 및 그를 이용한 평탄화 방법

Publications (1)

Publication Number Publication Date
IN185476B true IN185476B (ja) 2001-02-03

Family

ID=19408152

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1546CA1995 IN185476B (ja) 1995-02-15 1995-11-30

Country Status (5)

Country Link
US (1) US5664986A (ja)
JP (1) JP2969071B2 (ja)
KR (1) KR100258802B1 (ja)
CN (1) CN1073911C (ja)
IN (1) IN185476B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083839A (en) * 1997-12-31 2000-07-04 Intel Corporation Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control
KR100413493B1 (ko) * 2001-10-17 2004-01-03 주식회사 하이닉스반도체 화학적 기계적 연마 장치의 연마 플래튼 및 그를 이용한평탄화방법
KR100835517B1 (ko) 2003-12-26 2008-06-04 동부일렉트로닉스 주식회사 씨엠피 장비의 플래튼 장치
US7198548B1 (en) * 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
CN103029031A (zh) * 2011-09-30 2013-04-10 上海双明光学科技有限公司 一种晶圆基片加工方法
CN103639886A (zh) * 2013-11-29 2014-03-19 上海华力微电子有限公司 用于w-cmp的化学机械研磨装置及研磨方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
JP2016090439A (ja) * 2014-11-06 2016-05-23 株式会社日本自動車部品総合研究所 粒子状物質検出素子及び粒子状物質検出センサ
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
CN112605847B (zh) * 2020-11-23 2022-04-19 福建晶安光电有限公司 一种改进的晶片衬底抛光方法与装置
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948089A (en) * 1973-10-12 1976-04-06 Westinghouse Electric Corporation Strain gauge apparatus
NO135390C (no) * 1975-09-02 1977-03-30 Rdal Og Sunndal Verk A S Elektrisk kokeplate med termostat.
KR860008003A (ko) * 1985-04-08 1986-11-10 제이·로렌스 킨 양면 포리싱 작업용 캐리어 조립체
AU637087B2 (en) * 1989-03-24 1993-05-20 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
US5103596A (en) * 1990-11-05 1992-04-14 Toshiba Kikai Kabushiki Kaisha Method and apparatus for controlling cylinder grinding machines
EP0911115B1 (en) * 1992-09-24 2003-11-26 Ebara Corporation Polishing apparatus

Also Published As

Publication number Publication date
JPH08229806A (ja) 1996-09-10
KR100258802B1 (ko) 2000-06-15
CN1073911C (zh) 2001-10-31
KR960032635A (ko) 1996-09-17
JP2969071B2 (ja) 1999-11-02
CN1132676A (zh) 1996-10-09
US5664986A (en) 1997-09-09

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