IN181278B - - Google Patents

Info

Publication number
IN181278B
IN181278B IN163MA1993A IN181278B IN 181278 B IN181278 B IN 181278B IN 163MA1993 A IN163MA1993 A IN 163MA1993A IN 181278 B IN181278 B IN 181278B
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Carlo Ferrando
Stephen Chan
Original Assignee
Westinghouse Brake & Signal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake & Signal filed Critical Westinghouse Brake & Signal
Publication of IN181278B publication Critical patent/IN181278B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • H10W72/30—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • H10W72/073—
    • H10W72/07336—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
IN163MA1993 1992-03-05 1993-03-04 IN181278B (index.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929204731A GB9204731D0 (en) 1992-03-05 1992-03-05 A solder joint

Publications (1)

Publication Number Publication Date
IN181278B true IN181278B (index.php) 1998-05-02

Family

ID=10711519

Family Applications (1)

Application Number Title Priority Date Filing Date
IN163MA1993 IN181278B (index.php) 1992-03-05 1993-03-04

Country Status (5)

Country Link
US (1) US5380598A (index.php)
JP (1) JP3334813B2 (index.php)
DE (1) DE4306871C2 (index.php)
GB (2) GB9204731D0 (index.php)
IN (1) IN181278B (index.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798296A (en) * 1996-05-17 1998-08-25 Micron Technology, Inc. Method of fabricating a gate having a barrier of titanium silicide
DE10140826B4 (de) * 2000-12-13 2005-11-10 Infineon Technologies Ag Verfahren zur mehrschrittigen Bearbeitung eines dünnen und unter den Bearbeitungsschritten bruchgefährdeten Halbleiter-Waferprodukts
DE102004015017B4 (de) * 2004-03-26 2006-11-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Erzeugung von mechanischen und elektrischen Verbindungen zwischen den Oberflächen zweier Substrate
FR2982996B1 (fr) * 2011-11-23 2013-12-27 Valeo Systemes Thermiques Dispositif thermo electrique, notamment destine a generer un courant electrique dans un vehicule automobile, et procede de fabrication dudit dispositif.
JP6040817B2 (ja) 2013-03-21 2016-12-07 トヨタ紡織株式会社 乗物用シート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3555669A (en) * 1967-12-15 1971-01-19 Int Rectifier Corp Process for soldering silicon wafers to contacts
US3537174A (en) * 1968-10-07 1970-11-03 Gen Electric Process for forming tungsten barrier electrical connection
US3925808A (en) * 1974-08-08 1975-12-09 Westinghouse Electric Corp Silicon semiconductor device with stress-free electrodes
EP0067993A1 (en) * 1980-12-30 1983-01-05 Mostek Corporation Die attachment exhibiting enhanced quality and reliability
US4546374A (en) * 1981-03-23 1985-10-08 Motorola Inc. Semiconductor device including plateless package
US4513905A (en) * 1983-07-29 1985-04-30 The Perkin-Elmer Corporation Integrated circuit metallization technique
US4871617A (en) * 1984-04-02 1989-10-03 General Electric Company Ohmic contacts and interconnects to silicon and method of making same
US4772935A (en) * 1984-12-19 1988-09-20 Fairchild Semiconductor Corporation Die bonding process
EP0199078B1 (de) * 1985-04-11 1989-06-07 Siemens Aktiengesellschaft Integrierte Halbleiterschaltung mit einer aus Aluminium oder einer Aluminiumlegierung bestehenden Kontaktleiterbahnebene und einer als Diffusionsbarriere wirkenden Tantalsilizidzwischenschicht
JPS6242560A (ja) * 1985-08-20 1987-02-24 Fujitsu Ltd 半導体装置の電極
JP2685750B2 (ja) * 1987-01-30 1997-12-03 忠弘 大見 半導体装置形成用基板
US4921158A (en) * 1989-02-24 1990-05-01 General Instrument Corporation Brazing material
GB2238267A (en) * 1989-11-01 1991-05-29 Stc Plc Brazing process
US5170242A (en) * 1989-12-04 1992-12-08 Ramtron Corporation Reaction barrier for a multilayer structure in an integrated circuit

Also Published As

Publication number Publication date
JPH065546A (ja) 1994-01-14
GB2264662B (en) 1995-07-12
DE4306871A1 (index.php) 1993-09-09
JP3334813B2 (ja) 2002-10-15
GB9304265D0 (en) 1993-04-21
DE4306871C2 (de) 2003-03-20
GB2264662A (en) 1993-09-08
GB9204731D0 (en) 1992-04-15
US5380598A (en) 1995-01-10

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