IL97022A0 - Partitioning method for e-beam lithography - Google Patents

Partitioning method for e-beam lithography

Info

Publication number
IL97022A0
IL97022A0 IL97022A IL9702291A IL97022A0 IL 97022 A0 IL97022 A0 IL 97022A0 IL 97022 A IL97022 A IL 97022A IL 9702291 A IL9702291 A IL 9702291A IL 97022 A0 IL97022 A0 IL 97022A0
Authority
IL
Israel
Prior art keywords
beam lithography
partitioning method
partitioning
lithography
Prior art date
Application number
IL97022A
Other languages
English (en)
Original Assignee
Ibm Israel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm Israel filed Critical Ibm Israel
Priority to IL97022A priority Critical patent/IL97022A0/xx
Priority to EP19910311396 priority patent/EP0496158A3/en
Priority to JP4018377A priority patent/JPH04307723A/ja
Priority to US07/818,183 priority patent/US5241185A/en
Publication of IL97022A0 publication Critical patent/IL97022A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302—Controlling tubes by external information, e.g. programme control
    • H01J37/3023—Programme control
    • H01J37/3026—Patterning strategy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31764—Dividing into sub-patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31769—Proximity effect correction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
IL97022A 1991-01-24 1991-01-24 Partitioning method for e-beam lithography IL97022A0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IL97022A IL97022A0 (en) 1991-01-24 1991-01-24 Partitioning method for e-beam lithography
EP19910311396 EP0496158A3 (en) 1991-01-24 1991-12-06 Proximity correction method for e-beam lithography
JP4018377A JPH04307723A (ja) 1991-01-24 1992-01-08 電子ビーム・リソグラフィの近接効果補正方法
US07/818,183 US5241185A (en) 1991-01-24 1992-01-08 Proximity correction method for e-beam lithography

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL97022A IL97022A0 (en) 1991-01-24 1991-01-24 Partitioning method for e-beam lithography

Publications (1)

Publication Number Publication Date
IL97022A0 true IL97022A0 (en) 1992-03-29

Family

ID=11062037

Family Applications (1)

Application Number Title Priority Date Filing Date
IL97022A IL97022A0 (en) 1991-01-24 1991-01-24 Partitioning method for e-beam lithography

Country Status (4)

Country Link
US (1) US5241185A (de)
EP (1) EP0496158A3 (de)
JP (1) JPH04307723A (de)
IL (1) IL97022A0 (de)

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JP2647000B2 (ja) * 1994-05-25 1997-08-27 日本電気株式会社 電子ビームの露光方法
JPH08297692A (ja) * 1994-09-16 1996-11-12 Mitsubishi Electric Corp 光近接補正装置及び方法並びにパタン形成方法
US5682323A (en) 1995-03-06 1997-10-28 Lsi Logic Corporation System and method for performing optical proximity correction on macrocell libraries
US5663893A (en) * 1995-05-03 1997-09-02 Microunity Systems Engineering, Inc. Method for generating proximity correction features for a lithographic mask pattern
JP3348586B2 (ja) * 1995-12-28 2002-11-20 ソニー株式会社 電子線リソグラフィ技術における近接効果補正法
US5825040A (en) * 1996-12-23 1998-10-20 The United States Of America As Represented By The Secretary Of The Navy Bright beam method for super-resolution in e-beam lithography
US6578188B1 (en) 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
US6757645B2 (en) 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US6470489B1 (en) 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
US7617474B2 (en) * 1997-09-17 2009-11-10 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US6453452B1 (en) 1997-12-12 2002-09-17 Numerical Technologies, Inc. Method and apparatus for data hierarchy maintenance in a system for mask description
US7093229B2 (en) * 1997-09-17 2006-08-15 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US6370679B1 (en) 1997-09-17 2002-04-09 Numerical Technologies, Inc. Data hierarchy layout correction and verification method and apparatus
US6081658A (en) * 1997-12-31 2000-06-27 Avant! Corporation Proximity correction system for wafer lithography
WO2000060415A1 (de) * 1999-04-01 2000-10-12 Sigma-C Gmbh Verfahren zur korrektur von abbildungsfehlern
US6467076B1 (en) * 1999-04-30 2002-10-15 Nicolas Bailey Cobb Method and apparatus for submicron IC design
US6476400B1 (en) * 1999-12-21 2002-11-05 International Business Machines Corporation Method of adjusting a lithography system to enhance image quality
US6584609B1 (en) * 2000-02-28 2003-06-24 Numerical Technologies, Inc. Method and apparatus for mixed-mode optical proximity correction
JP4522547B2 (ja) * 2000-06-21 2010-08-11 大日本印刷株式会社 微細加工のシミュレーション方法
US6647137B1 (en) 2000-07-10 2003-11-11 International Business Machines Corporation Characterizing kernel function in photolithography based on photoresist pattern
US6523162B1 (en) 2000-08-02 2003-02-18 Numerical Technologies, Inc. General purpose shape-based layout processing scheme for IC layout modifications
US6792590B1 (en) 2000-09-29 2004-09-14 Numerical Technologies, Inc. Dissection of edges with projection points in a fabrication layout for correcting proximity effects
US6539521B1 (en) 2000-09-29 2003-03-25 Numerical Technologies, Inc. Dissection of corners in a fabrication layout for correcting proximity effects
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US6557162B1 (en) * 2000-09-29 2003-04-29 Numerical Technologies, Inc. Method for high yield reticle formation
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US6665856B1 (en) 2000-12-01 2003-12-16 Numerical Technologies, Inc. Displacing edge segments on a fabrication layout based on proximity effects model amplitudes for correcting proximity effects
US6596444B2 (en) 2000-12-15 2003-07-22 Dupont Photomasks, Inc. Photomask and method for correcting feature size errors on the same
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US6789237B1 (en) * 2001-05-11 2004-09-07 Northwestern University Efficient model order reduction via multi-point moment matching
US6684382B2 (en) 2001-08-31 2004-01-27 Numerical Technologies, Inc. Microloading effect correction
US6670082B2 (en) 2001-10-09 2003-12-30 Numerical Technologies, Inc. System and method for correcting 3D effects in an alternating phase-shifting mask
US7011926B2 (en) 2001-10-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. Gap forming pattern fracturing method for forming optical proximity corrected masking layer
US20030228542A1 (en) * 2002-06-06 2003-12-11 Seagate Technology Llc Method and structure to reduce e-beam and magnetic material interactions
US6792592B2 (en) 2002-08-30 2004-09-14 Numerical Technologies, Inc. Considering mask writer properties during the optical proximity correction process
US7172838B2 (en) * 2002-09-27 2007-02-06 Wilhelm Maurer Chromeless phase mask layout generation
US6998217B2 (en) * 2003-01-06 2006-02-14 Applied Materials, Inc. Critical dimension edge placement and slope enhancement with central pixel dose addition and modulated inner pixels
US20040173921A1 (en) * 2003-03-07 2004-09-09 Konica Minolta Holdings, Inc. Electron beam depicting method, production method of mother die, mother die, production method of metallic mold, metallic mold, optical element and electron beam depicting apparatus
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP4825450B2 (ja) * 2005-05-16 2011-11-30 株式会社東芝 パターン描画システム、荷電ビーム描画方法、及びフォトマスク製造方法
US7747977B1 (en) 2005-09-15 2010-06-29 D2S, Inc. Method and system for stencil design for particle beam writing
US7476879B2 (en) * 2005-09-30 2009-01-13 Applied Materials, Inc. Placement effects correction in raster pattern generator
US7498591B2 (en) * 2005-09-30 2009-03-03 Applied Materials, Inc. Critical dimension effects correction in raster pattern generator
JP5063071B2 (ja) * 2006-02-14 2012-10-31 株式会社ニューフレアテクノロジー パタン作成方法及び荷電粒子ビーム描画装置
JP4378648B2 (ja) 2006-10-06 2009-12-09 エルピーダメモリ株式会社 照射パターンデータ作成方法、マスク製造方法、及び描画システム
US7897008B2 (en) 2006-10-27 2011-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for regional plasma control
US7902528B2 (en) * 2006-11-21 2011-03-08 Cadence Design Systems, Inc. Method and system for proximity effect and dose correction for a particle beam writing device
US7824828B2 (en) * 2007-02-22 2010-11-02 Cadence Design Systems, Inc. Method and system for improvement of dose correction for particle beam writers
US8387674B2 (en) 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
US9323140B2 (en) 2008-09-01 2016-04-26 D2S, Inc. Method and system for forming a pattern on a reticle using charged particle beam lithography
US9341936B2 (en) 2008-09-01 2016-05-17 D2S, Inc. Method and system for forming a pattern on a reticle using charged particle beam lithography
US20120219886A1 (en) 2011-02-28 2012-08-30 D2S, Inc. Method and system for forming patterns using charged particle beam lithography with variable pattern dosage
US7901850B2 (en) 2008-09-01 2011-03-08 D2S, Inc. Method and system for design of a reticle to be manufactured using variable shaped beam lithography
US8057970B2 (en) 2008-09-01 2011-11-15 D2S, Inc. Method and system for forming circular patterns on a surface
EP2321840B1 (de) * 2008-09-01 2017-05-03 D2S, Inc. Verfahren zur korrektur von optischen naheffekten, entwurf und herstellung eines retikels mittels lithographie mit unterschiedlich geformten strahlen
US9448473B2 (en) 2009-08-26 2016-09-20 D2S, Inc. Method for fracturing and forming a pattern using shaped beam charged particle beam lithography
DE102010004939A1 (de) * 2010-01-18 2011-07-21 EQUIcon Software GmbH Jena, 07745 Verfahren zur Steuerung der Elektronenstrahl-Belichtung von Wafern und Masken mit Proximity-Korrektur
US8178280B2 (en) * 2010-02-05 2012-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. Self-contained proximity effect correction inspiration for advanced lithography (special)
US8539392B2 (en) 2011-02-24 2013-09-17 National Taiwan University Method for compensating proximity effects of particle beam lithography processes
US9612530B2 (en) 2011-02-28 2017-04-04 D2S, Inc. Method and system for design of enhanced edge slope patterns for charged particle beam lithography
US9034542B2 (en) 2011-06-25 2015-05-19 D2S, Inc. Method and system for forming patterns with charged particle beam lithography
US9400857B2 (en) 2011-09-19 2016-07-26 D2S, Inc. Method and system for forming patterns using charged particle beam lithography
US9343267B2 (en) 2012-04-18 2016-05-17 D2S, Inc. Method and system for dimensional uniformity using charged particle beam lithography
JP6057635B2 (ja) * 2012-09-14 2017-01-11 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
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CN113835307B (zh) * 2021-09-23 2022-10-28 中国科学院微电子研究所 一种电子束邻近效应的校正方法及其装置

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Also Published As

Publication number Publication date
EP0496158A3 (en) 1992-08-26
EP0496158A2 (de) 1992-07-29
US5241185A (en) 1993-08-31
JPH04307723A (ja) 1992-10-29

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