IL95947A0 - Copolyimide odpa/bpda/4-4'-oda or p-pda and articles coated therewith - Google Patents

Copolyimide odpa/bpda/4-4'-oda or p-pda and articles coated therewith

Info

Publication number
IL95947A0
IL95947A0 IL95947A IL9594790A IL95947A0 IL 95947 A0 IL95947 A0 IL 95947A0 IL 95947 A IL95947 A IL 95947A IL 9594790 A IL9594790 A IL 9594790A IL 95947 A0 IL95947 A0 IL 95947A0
Authority
IL
Israel
Prior art keywords
chem
copolyimide
block
odpa
bpda
Prior art date
Application number
IL95947A
Other languages
English (en)
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of IL95947A0 publication Critical patent/IL95947A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Organic Insulating Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Die Bonding (AREA)
  • Paints Or Removers (AREA)
IL95947A 1989-10-26 1990-10-10 Copolyimide odpa/bpda/4-4'-oda or p-pda and articles coated therewith IL95947A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/427,286 US5077382A (en) 1989-10-26 1989-10-26 Copolyimide odpa/bpda/4,4'-oda or p-pda

Publications (1)

Publication Number Publication Date
IL95947A0 true IL95947A0 (en) 1991-07-18

Family

ID=23694226

Family Applications (1)

Application Number Title Priority Date Filing Date
IL95947A IL95947A0 (en) 1989-10-26 1990-10-10 Copolyimide odpa/bpda/4-4'-oda or p-pda and articles coated therewith

Country Status (7)

Country Link
US (1) US5077382A (de)
EP (1) EP0424805B1 (de)
JP (1) JP2954689B2 (de)
AT (1) ATE102232T1 (de)
CA (1) CA2027957A1 (de)
DE (1) DE69007013T2 (de)
IL (1) IL95947A0 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5304626A (en) * 1988-06-28 1994-04-19 Amoco Corporation Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moieties
US5171828A (en) * 1989-10-26 1992-12-15 Occidental Chemical Corporation Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
DE69232894T2 (de) * 1991-03-12 2003-11-20 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Herstellungsverfahren fuer zweischichtenband vom tab-typ
JPH05105850A (ja) * 1991-10-16 1993-04-27 Sumitomo Bakelite Co Ltd エレクトロニクス用接着テープ
DE4135058A1 (de) * 1991-10-24 1993-04-29 Basf Lacke & Farben Loesungen von polyimidbildenden ausgangsstoffen
DE4229180A1 (de) * 1992-09-02 1994-03-03 Basf Ag Rekristallisierbare Polyimide
KR20000057392A (ko) * 1996-12-05 2000-09-15 메리 이. 보울러 높은 유리 전이온도, 높은 열산화 안정도, 및 낮은 수분율의폴리이미드
US6222007B1 (en) * 1998-05-29 2001-04-24 The United States Of America As Represented By The National Aeronautics And Space Administration Films, preimpregnated tapes and composites made from polyimide “Salt-like” Solutions
TW531547B (en) 1998-08-25 2003-05-11 Kaneka Corp Polyimide film and process for producing the same
KR100367720B1 (ko) * 2000-07-04 2003-01-10 학교법인 포항공과대학교 3,3'-비스[(4'-ｒ-4-스틸베닐)옥시알킬옥시]바이페닐-4,4'-디아민 및 그 제조방법
US6476182B1 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476177B2 (en) 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6444783B1 (en) 2000-12-21 2002-09-03 E. I. Du Pont De Nemours And Company Melt-processible semicrystalline block copolyimides
US6469126B1 (en) 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US8568867B2 (en) * 2006-06-26 2013-10-29 Sabic Innovative Plastics Ip B.V. Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US20080044639A1 (en) * 2006-06-26 2008-02-21 Kwok Pong Chan Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8545975B2 (en) * 2006-06-26 2013-10-01 Sabic Innovative Plastics Ip B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
JP2010085450A (ja) * 2008-09-29 2010-04-15 Ube Ind Ltd シームレスベルトおよびシームレスベルトの製造方法
WO2012081644A1 (ja) 2010-12-15 2012-06-21 宇部興産株式会社 ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物
WO2012173202A1 (ja) * 2011-06-14 2012-12-20 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
US20150090941A1 (en) * 2012-04-20 2015-04-02 Kaneka Corporation Method for manufacturing conductive polyimide film
CN104513395B (zh) * 2014-12-12 2017-01-18 珠海亚泰电子科技有限公司 聚酰胺酸溶液、二层型挠性覆铜板及二者的制备方法
WO2016194769A1 (ja) * 2015-05-29 2016-12-08 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
KR20210115255A (ko) * 2020-03-12 2021-09-27 삼성전자주식회사 박막, 이의 제조 방법 및 이를 포함하는 발광 소자

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3416994A (en) * 1967-01-12 1968-12-17 Du Pont Cross-linked polyimide
NL66822C (de) * 1967-07-03
US3520837A (en) * 1967-11-09 1970-07-21 Monsanto Res Corp Method of making a polyimide foam
US3959350A (en) * 1971-05-17 1976-05-25 E. I. Du Pont De Nemours And Company Melt-fusible linear polyimide of 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride
US4537947A (en) * 1973-05-25 1985-08-27 University Of Notre Dame Du Lac Chain-extending functional polyimides by dipole reactions
GB2032926B (en) * 1978-08-17 1983-03-02 Ube Industries Aromatic polyimide resin composition
US4290936A (en) * 1978-11-09 1981-09-22 Ube Industries, Ltd. Process for preparing polyimide solution
US4742153A (en) * 1986-04-16 1988-05-03 E. I. Du Pont De Nemours And Company Process for preparing polyimides
US4886573A (en) * 1986-08-27 1989-12-12 Hitachi, Ltd. Process for forming wiring on substrate
JP2847701B2 (ja) * 1986-11-29 1999-01-20 鐘淵化学工業株式会社 熱的寸法安定性にすぐれたポリアミド酸及びそれからなるポリイミドの製造方法
JPH0693984B2 (ja) * 1987-04-21 1994-11-24 宇部興産株式会社 ポリイミド気体分離膜
JP2574162B2 (ja) * 1988-01-06 1997-01-22 チッソ株式会社 低融点ポリイミド共重合体

Also Published As

Publication number Publication date
EP0424805B1 (de) 1994-03-02
ATE102232T1 (de) 1994-03-15
EP0424805A3 (en) 1991-07-17
US5077382A (en) 1991-12-31
DE69007013D1 (de) 1994-04-07
EP0424805A2 (de) 1991-05-02
JP2954689B2 (ja) 1999-09-27
JPH03157428A (ja) 1991-07-05
DE69007013T2 (de) 1994-06-09
CA2027957A1 (en) 1991-04-27

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