IL93101A - Method for connecting glass to aluminum and manufactured items according to it - Google Patents
Method for connecting glass to aluminum and manufactured items according to itInfo
- Publication number
- IL93101A IL93101A IL9310190A IL9310190A IL93101A IL 93101 A IL93101 A IL 93101A IL 9310190 A IL9310190 A IL 9310190A IL 9310190 A IL9310190 A IL 9310190A IL 93101 A IL93101 A IL 93101A
- Authority
- IL
- Israel
- Prior art keywords
- approximately
- moles
- stage
- vitreous
- pin
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 80
- 229910052782 aluminium Inorganic materials 0.000 title claims description 32
- 239000004411 aluminium Substances 0.000 title claims description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 30
- 239000005394 sealing glass Substances 0.000 title description 4
- 239000000463 material Substances 0.000 claims description 116
- 229910044991 metal oxide Inorganic materials 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 25
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011230 binding agent Substances 0.000 claims description 18
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 17
- 239000005365 phosphate glass Substances 0.000 claims description 17
- 229910017083 AlN Inorganic materials 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 238000002425 crystallisation Methods 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 9
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 9
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 8
- 239000000470 constituent Substances 0.000 claims description 8
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- 238000010397 one-hybrid screening Methods 0.000 claims description 5
- 229910000952 Be alloy Inorganic materials 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Inorganic materials [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims description 2
- 230000008030 elimination Effects 0.000 claims description 2
- 238000003379 elimination reaction Methods 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- 238000000643 oven drying Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 229940057838 polyethylene glycol 4000 Drugs 0.000 claims description 2
- 238000012216 screening Methods 0.000 claims description 2
- 238000005496 tempering Methods 0.000 claims description 2
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 claims description 2
- 230000008025 crystallization Effects 0.000 claims 6
- 239000000945 filler Substances 0.000 claims 3
- 238000001354 calcination Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229910000833 kovar Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005469 granulation Methods 0.000 description 3
- 230000003179 granulation Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 101150099374 PCF2 gene Proteins 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011872 intimate mixture Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011176 pooling Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000011369 resultant mixture Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 108020001572 subunits Proteins 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/32—Sealing leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
- H01B17/303—Sealing of leads to lead-through insulators
- H01B17/305—Sealing of leads to lead-through insulators by embedding in glass or ceramic material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Glass Compositions (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8900709A FR2642257B1 (fr) | 1989-01-20 | 1989-01-20 | Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants |
Publications (2)
Publication Number | Publication Date |
---|---|
IL93101A0 IL93101A0 (en) | 1990-11-05 |
IL93101A true IL93101A (en) | 1994-07-31 |
Family
ID=9377940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL9310190A IL93101A (en) | 1989-01-20 | 1990-01-18 | Method for connecting glass to aluminum and manufactured items according to it |
Country Status (6)
Country | Link |
---|---|
US (1) | US5538527A (fr) |
EP (1) | EP0379431B1 (fr) |
CA (1) | CA2008297C (fr) |
DE (1) | DE69013017D1 (fr) |
FR (1) | FR2642257B1 (fr) |
IL (1) | IL93101A (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6262477B1 (en) | 1993-03-19 | 2001-07-17 | Advanced Interconnect Technologies | Ball grid array electronic package |
US6274252B1 (en) * | 1994-08-04 | 2001-08-14 | Coors Ceramics Company | Hermetic glass-to-metal seal useful in headers for airbags |
DE102006004036A1 (de) * | 2006-01-27 | 2007-08-09 | Schott Ag | Metall-Fixiermaterial-Durchführung und Verwendung einer derartigen Durchführung sowie Airbag und Gurtspanner mit einer Zündeinrichtung |
US8733250B2 (en) * | 2006-01-27 | 2014-05-27 | Schott Ag | Metal-sealing material-feedthrough and utilization of the metal-sealing material feedthrough with an airbag, a belt tensioning device, and an ignition device |
JP4856025B2 (ja) * | 2007-08-10 | 2012-01-18 | セイコーインスツル株式会社 | 気密端子の製造方法及び気密端子、圧電振動子の製造方法及び圧電振動子、発振器、電子機器、電波時計 |
DE102010045641A1 (de) | 2010-09-17 | 2012-03-22 | Schott Ag | Verfahren zur Herstellung eines ring- oder plattenförmigen Elementes |
US10684102B2 (en) | 2010-09-17 | 2020-06-16 | Schott Ag | Method for producing a ring-shaped or plate-like element |
FR3036396B1 (fr) | 2015-05-22 | 2020-02-28 | Axon Cable | Composition de verre pour le scellement de connecteur micro-d |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB699492A (en) * | 1951-11-22 | 1953-11-11 | Mycalex Corp Of America | Terminal structures for electrical apparatus |
US4411680A (en) * | 1977-09-26 | 1983-10-25 | James C. Kyle | Ceramic seal between spaced members such as a terminal pin and a ferrule |
US4421947A (en) * | 1977-10-11 | 1983-12-20 | James C. Kyle | Polycrystalline insulating material seals between spaced members such as a terminal pin and a ferrule |
US4202700A (en) * | 1979-05-02 | 1980-05-13 | The United States Of America As Represented By The United States Department Of Energy | Glassy composition for hermetic seals |
JPS578273A (en) * | 1980-06-19 | 1982-01-16 | Dainippon Printing Co Ltd | Adhesive composition for laminate |
US4309507A (en) * | 1981-02-23 | 1982-01-05 | Motorola, Inc. | Glass and hermetic seal |
US4349692A (en) * | 1981-02-23 | 1982-09-14 | Motorola, Inc. | Glass hermetic seal |
US4349635A (en) * | 1981-10-26 | 1982-09-14 | Motorola, Inc. | Lower temperature glass and hermetic seal means and method |
JPS5898939A (ja) * | 1981-12-08 | 1983-06-13 | Matsushita Electronics Corp | 半導体装置 |
CA1201211A (fr) * | 1982-08-05 | 1986-02-25 | Olin Corporation | Enveloppe hermetique de semiconducteur |
US4455384A (en) * | 1982-12-08 | 1984-06-19 | The United States Of America As Represented By The United States Department Of Energy | Chemically durable nitrogen containing phosphate glasses useful for sealing to metals |
JPS60116156A (ja) * | 1983-11-29 | 1985-06-22 | Fujitsu Ltd | アルミニウム合金パッケ−ジ |
US4678358A (en) * | 1985-07-15 | 1987-07-07 | National Semiconductor Corporation | Glass compression seals using low temperature glass |
US4882212A (en) * | 1986-10-30 | 1989-11-21 | Olin Corporation | Electronic packaging of components incorporating a ceramic-glass-metal composite |
JPH07123147B2 (ja) * | 1986-12-09 | 1995-12-25 | 住友ベークライト株式会社 | パッケージを形成する方法 |
US4713580A (en) * | 1986-12-19 | 1987-12-15 | Gte Products Corporation | Sealing structure for metal vapor arc discharge lamps |
US4761518A (en) * | 1987-01-20 | 1988-08-02 | Olin Corporation | Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs |
EP0287722A1 (fr) * | 1987-04-22 | 1988-10-26 | Fujitsu Limited | Procédé pour le soudage au laser d'éléments à base d'aluminium |
US4915719A (en) * | 1988-09-30 | 1990-04-10 | Honeywell Inc. | Method of producing a hermetic glass to metal seal without metal oxidation |
US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
-
1989
- 1989-01-20 FR FR8900709A patent/FR2642257B1/fr not_active Expired - Fee Related
-
1990
- 1990-01-17 DE DE69013017T patent/DE69013017D1/de not_active Expired - Lifetime
- 1990-01-17 EP EP90400134A patent/EP0379431B1/fr not_active Expired - Lifetime
- 1990-01-18 IL IL9310190A patent/IL93101A/en not_active IP Right Cessation
- 1990-01-22 CA CA002008297A patent/CA2008297C/fr not_active Expired - Fee Related
-
1994
- 1994-06-10 US US08/257,960 patent/US5538527A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2642257A1 (fr) | 1990-07-27 |
CA2008297C (fr) | 1995-08-01 |
EP0379431A1 (fr) | 1990-07-25 |
US5538527A (en) | 1996-07-23 |
FR2642257B1 (fr) | 1996-05-24 |
IL93101A0 (en) | 1990-11-05 |
CA2008297A1 (fr) | 1990-07-20 |
DE69013017D1 (de) | 1994-11-10 |
EP0379431B1 (fr) | 1994-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
KB | Patent renewed | ||
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
MM9K | Patent not in force due to non-payment of renewal fees |