IL288608B2 - תרכובות חריטה - Google Patents

תרכובות חריטה

Info

Publication number
IL288608B2
IL288608B2 IL288608A IL28860821A IL288608B2 IL 288608 B2 IL288608 B2 IL 288608B2 IL 288608 A IL288608 A IL 288608A IL 28860821 A IL28860821 A IL 28860821A IL 288608 B2 IL288608 B2 IL 288608B2
Authority
IL
Israel
Prior art keywords
acid
composition
weight
salt
tan
Prior art date
Application number
IL288608A
Other languages
English (en)
Other versions
IL288608A (he
IL288608B1 (he
Inventor
Joshua Guske
Atsushi Mizutani
Original Assignee
Fujifilm Electronic Mat Usa Inc
Joshua Guske
Atsushi Mizutani
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Electronic Mat Usa Inc, Joshua Guske, Atsushi Mizutani filed Critical Fujifilm Electronic Mat Usa Inc
Publication of IL288608A publication Critical patent/IL288608A/he
Publication of IL288608B1 publication Critical patent/IL288608B1/he
Publication of IL288608B2 publication Critical patent/IL288608B2/he

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
    • C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
    • C09K15/30—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing heterocyclic ring with at least one nitrogen atom as ring member
    • H10P50/283—
    • H10P50/667—
    • H10P70/273—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Weting (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • ing And Chemical Polishing (AREA)
  • Inorganic Chemistry (AREA)
IL288608A 2019-06-03 2020-05-27 תרכובות חריטה IL288608B2 (he)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962856213P 2019-06-03 2019-06-03
PCT/US2020/034617 WO2020247216A1 (en) 2019-06-03 2020-05-27 Etching compositions

Publications (3)

Publication Number Publication Date
IL288608A IL288608A (he) 2022-02-01
IL288608B1 IL288608B1 (he) 2025-08-01
IL288608B2 true IL288608B2 (he) 2025-12-01

Family

ID=73550164

Family Applications (1)

Application Number Title Priority Date Filing Date
IL288608A IL288608B2 (he) 2019-06-03 2020-05-27 תרכובות חריטה

Country Status (8)

Country Link
US (2) US20200377792A1 (he)
EP (1) EP3976746A4 (he)
JP (1) JP7575407B2 (he)
KR (1) KR20220016913A (he)
CN (1) CN114144508A (he)
IL (1) IL288608B2 (he)
TW (2) TWI900187B (he)
WO (1) WO2020247216A1 (he)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12506014B2 (en) * 2021-10-19 2025-12-23 Tokyo Electron Limited Methods for non-isothermal wet atomic layer etching
US11802342B2 (en) * 2021-10-19 2023-10-31 Tokyo Electron Limited Methods for wet atomic layer etching of ruthenium
US12276033B2 (en) 2021-10-19 2025-04-15 Tokyo Electron Limited Methods for wet etching of noble metals
KR20240093578A (ko) * 2021-10-20 2024-06-24 엔테그리스, 아이엔씨. 선택적 습식 에칭 조성물 및 방법
CN114350365A (zh) * 2021-12-07 2022-04-15 湖北兴福电子材料有限公司 一种稳定蚀刻氮化钛的蚀刻液
WO2024107260A1 (en) * 2022-11-14 2024-05-23 Tokyo Electron Limited Methods for wet etching of noble metals
US12506011B2 (en) 2023-12-15 2025-12-23 Tokyo Electron Limited Methods for wet atomic layer etching of transition metal oxide dielectric materials

Citations (2)

* Cited by examiner, † Cited by third party
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US20040061092A1 (en) * 2002-09-30 2004-04-01 Seagate Technology Llc Wet etch for selective removal of alumina
US7470444B2 (en) * 2006-04-28 2008-12-30 Delaval, Inc. Tripe-bleaching composition

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EP0783034B1 (en) * 1995-12-22 2010-08-18 Mitsubishi Rayon Co., Ltd. Chelating agent and detergent comprising the same
US8092707B2 (en) * 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
JP3974305B2 (ja) * 1999-06-18 2007-09-12 エルジー フィリップス エルシーディー カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法と電子機器
US6787061B1 (en) * 2000-11-16 2004-09-07 Intel Corporation Copper polish slurry for reduced interlayer dielectric erosion and method of using same
US6717019B2 (en) 2002-01-30 2004-04-06 Air Products And Chemicals, Inc. Glycidyl ether-capped acetylenic diol ethoxylate surfactants
US8372757B2 (en) * 2003-10-20 2013-02-12 Novellus Systems, Inc. Wet etching methods for copper removal and planarization in semiconductor processing
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates
JP2009088243A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp 研磨液
US8513139B2 (en) * 2007-12-21 2013-08-20 Wako Pure Chemical Industries, Ltd. Etching agent, etching method and liquid for preparing etching agent
US8383003B2 (en) * 2008-06-20 2013-02-26 Nexplanar Corporation Polishing systems
JP2014093407A (ja) * 2012-11-02 2014-05-19 Fujifilm Corp エッチング液、これを用いたエッチング方法及び半導体素子の製造方法
US9234162B2 (en) * 2013-01-25 2016-01-12 Lmc Enterprises Cleaning composition and methods of use thereof
JP6723152B2 (ja) 2013-06-06 2020-07-15 インテグリス・インコーポレーテッド 窒化チタンを選択的にエッチングするための組成物及び方法
CN105378901B (zh) * 2013-07-05 2020-09-15 富士胶片电子材料有限公司 蚀刻剂、蚀刻方法和蚀刻剂制备液
US20150104952A1 (en) * 2013-10-11 2015-04-16 Ekc Technology, Inc. Method and composition for selectively removing metal hardmask and other residues from semiconductor device substrates comprising low-k dielectric material and copper
TWI659088B (zh) * 2014-03-18 2019-05-11 Fujifilm Electronic Materials U. S. A., Inc. 蝕刻組成物
KR102405063B1 (ko) * 2014-06-30 2022-06-07 엔테그리스, 아이엔씨. 텅스텐 및 코발트 상용성을 갖는 에치후 잔류물을 제거하기 위한 수성 및 반-수성 세정제
US9976111B2 (en) * 2015-05-01 2018-05-22 Versum Materials Us, Llc TiN hard mask and etch residual removal
JP6626748B2 (ja) 2016-03-09 2019-12-25 株式会社Adeka タンタル含有層用エッチング液組成物及びエッチング方法
US10793809B2 (en) * 2017-02-28 2020-10-06 Ecolab Usa Inc. Alkaline cleaning compositions comprising a hydroxyphosphono carboxylic acid and methods of reducing metal corrosion
WO2018181896A1 (ja) 2017-03-31 2018-10-04 関東化學株式会社 チタン層またはチタン含有層のエッチング液組成物およびエッチング方法
US10889757B2 (en) 2017-10-19 2021-01-12 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040061092A1 (en) * 2002-09-30 2004-04-01 Seagate Technology Llc Wet etch for selective removal of alumina
US7470444B2 (en) * 2006-04-28 2008-12-30 Delaval, Inc. Tripe-bleaching composition

Also Published As

Publication number Publication date
TW202106859A (zh) 2021-02-16
TW202449118A (zh) 2024-12-16
US20240287384A1 (en) 2024-08-29
JP7575407B2 (ja) 2024-10-29
EP3976746A1 (en) 2022-04-06
US20200377792A1 (en) 2020-12-03
KR20220016913A (ko) 2022-02-10
WO2020247216A1 (en) 2020-12-10
TWI900187B (zh) 2025-10-01
EP3976746A4 (en) 2022-07-27
CN114144508A (zh) 2022-03-04
IL288608A (he) 2022-02-01
IL288608B1 (he) 2025-08-01
JP2022535440A (ja) 2022-08-08
TWI856104B (zh) 2024-09-21

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