IL267672B2 - An adjustable assembly and a substrate exposure system containing this adjustable assembly - Google Patents

An adjustable assembly and a substrate exposure system containing this adjustable assembly

Info

Publication number
IL267672B2
IL267672B2 IL267672A IL26767219A IL267672B2 IL 267672 B2 IL267672 B2 IL 267672B2 IL 267672 A IL267672 A IL 267672A IL 26767219 A IL26767219 A IL 26767219A IL 267672 B2 IL267672 B2 IL 267672B2
Authority
IL
Israel
Prior art keywords
bellows
series
mechanically linked
linked components
exposure apparatus
Prior art date
Application number
IL267672A
Other languages
English (en)
Hebrew (he)
Other versions
IL267672B (en
IL267672A (en
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL2018108A external-priority patent/NL2018108B1/en
Priority claimed from US15/396,032 external-priority patent/US10048599B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL267672A publication Critical patent/IL267672A/en
Publication of IL267672B publication Critical patent/IL267672B/en
Publication of IL267672B2 publication Critical patent/IL267672B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0216—Means for avoiding or correcting vibration effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/024—Moving components not otherwise provided for
    • H01J2237/0245—Moving whole optical system relatively to object

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal Substances (AREA)
  • Facsimile Heads (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
IL267672A 2016-12-30 2017-12-14 An adjustable assembly and a substrate exposure system containing this adjustable assembly IL267672B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2018108A NL2018108B1 (en) 2016-12-30 2016-12-30 Adjustment assembly and substrate exposure system comprising such an adjustment assembly
US15/396,032 US10048599B2 (en) 2016-12-30 2016-12-30 Adjustment assembly and substrate exposure system comprising such an adjustment assembly
PCT/EP2017/082892 WO2018122003A1 (en) 2016-12-30 2017-12-14 Adjustment assembly and substrate exposure system comprising such an adjustment assembly

Publications (3)

Publication Number Publication Date
IL267672A IL267672A (en) 2019-08-29
IL267672B IL267672B (en) 2022-12-01
IL267672B2 true IL267672B2 (en) 2023-04-01

Family

ID=60788598

Family Applications (1)

Application Number Title Priority Date Filing Date
IL267672A IL267672B2 (en) 2016-12-30 2017-12-14 An adjustable assembly and a substrate exposure system containing this adjustable assembly

Country Status (8)

Country Link
US (1) US11237489B2 (zh)
EP (1) EP3563197B1 (zh)
JP (1) JP7022134B2 (zh)
KR (1) KR102344480B1 (zh)
CN (1) CN110325919B (zh)
IL (1) IL267672B2 (zh)
TW (1) TWI773710B (zh)
WO (1) WO2018122003A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102533089B1 (ko) * 2018-12-20 2023-05-17 에이에스엠엘 네델란즈 비.브이. 스테이지 장치
JP7465334B2 (ja) 2019-08-05 2024-04-10 エーエスエムエル ネザーランズ ビー．ブイ． サポート、振動絶縁システム、リソグラフィ装置、オブジェクト測定装置、デバイス製造方法
US11067899B1 (en) * 2020-02-03 2021-07-20 Vathys, Inc. Scattering lithography
JP7482760B2 (ja) 2020-11-20 2024-05-14 株式会社ニューフレアテクノロジー 荷電粒子ビーム照射装置

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DE3606103A1 (de) * 1986-02-26 1987-08-27 Festo Kg Vorrichtung zur fluidischen uebertragung einer kraft oder einer vorschubbewegung
JPH04291311A (ja) * 1991-03-20 1992-10-15 Mitsubishi Electric Corp 副鏡駆動機構
JPH04331834A (ja) * 1991-05-08 1992-11-19 Nissan Motor Co Ltd 制御型エンジンマウント
US5287700A (en) * 1992-10-14 1994-02-22 Mcdonnell Douglas Helicopter Company Flexible bellows actuation system
AU5447499A (en) 1998-09-03 2000-03-27 Nikon Corporation Exposure apparatus and exposure method, and device and method for producing the same
KR100522885B1 (ko) * 2002-06-07 2005-10-20 에이에스엠엘 네델란즈 비.브이. 리소그래피장치 및 디바이스제조방법
JP2004085778A (ja) * 2002-08-26 2004-03-18 Hitachi Electronics Eng Co Ltd 密着露光方法および密着露光装置
JP4458322B2 (ja) * 2003-01-14 2010-04-28 キヤノン株式会社 露光装置およびデバイス製造方法
KR20070011347A (ko) 2004-03-01 2007-01-24 가부시키가이샤 니콘 기체 스프링 장치, 방진 장치, 스테이지 장치 및 노광 장치
JPWO2006009254A1 (ja) 2004-07-23 2008-05-01 株式会社ニコン 支持装置、ステージ装置、露光装置、及びデバイスの製造方法
JP5237091B2 (ja) * 2005-06-02 2013-07-17 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学結像装置
JP2008227015A (ja) 2007-03-09 2008-09-25 Canon Inc 露光装置並びにデバイス製造方法
US8421994B2 (en) 2007-09-27 2013-04-16 Nikon Corporation Exposure apparatus
JP5319154B2 (ja) * 2008-04-18 2013-10-16 住友重機械工業株式会社 ステージ装置
US8473167B2 (en) 2008-07-03 2013-06-25 Rs Drawings, Llc Lift gate control system
WO2010042012A1 (en) 2008-10-10 2010-04-15 Milux Holding Sa Heart help device, system, and method
US20110085152A1 (en) * 2009-05-07 2011-04-14 Hideaki Nishino Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method
NL2005374C2 (en) 2010-09-20 2012-03-22 Mapper Lithography Ip Bv Method for arranging a lithography system on a foundation, and lithography system arranged on said foundation.
WO2013034753A1 (en) 2011-09-09 2013-03-14 Mapper Lithography Ip B.V. Vibration isolation module and substrate processing system
US9218935B2 (en) * 2013-07-08 2015-12-22 Carl Zeiss Microscopy, Llc Charged particle beam system and method of operating a charged particle beam system
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US10048599B2 (en) * 2016-12-30 2018-08-14 Mapper Lithography Ip B.V. Adjustment assembly and substrate exposure system comprising such an adjustment assembly

Also Published As

Publication number Publication date
IL267672B (en) 2022-12-01
CN110325919A (zh) 2019-10-11
JP7022134B2 (ja) 2022-02-17
CN110325919B (zh) 2022-02-11
US20190324375A1 (en) 2019-10-24
KR102344480B1 (ko) 2021-12-28
US11237489B2 (en) 2022-02-01
EP3563197B1 (en) 2024-01-31
KR20190098251A (ko) 2019-08-21
IL267672A (en) 2019-08-29
TWI773710B (zh) 2022-08-11
TW201833685A (zh) 2018-09-16
WO2018122003A1 (en) 2018-07-05
JP2020503557A (ja) 2020-01-30
EP3563197A1 (en) 2019-11-06

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