IL259705B - Accelerated learning-based machine model training for semiconductor applications - Google Patents
Accelerated learning-based machine model training for semiconductor applicationsInfo
- Publication number
- IL259705B IL259705B IL259705A IL25970518A IL259705B IL 259705 B IL259705 B IL 259705B IL 259705 A IL259705 A IL 259705A IL 25970518 A IL25970518 A IL 25970518A IL 259705 B IL259705 B IL 259705B
- Authority
- IL
- Israel
- Prior art keywords
- machine learning
- based model
- learning based
- semiconductor applications
- accelerated training
- Prior art date
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
- G06F18/217—Validation; Performance evaluation; Active pattern learning techniques
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
- G06N3/0455—Auto-encoder networks; Encoder-decoder networks
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0464—Convolutional networks [CNN, ConvNet]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/047—Probabilistic or stochastic networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0475—Generative networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/088—Non-supervised learning, e.g. competitive learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/0895—Weakly supervised learning, e.g. semi-supervised or self-supervised learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/09—Supervised learning
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/094—Adversarial learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/096—Transfer learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/12—Circuits of general importance; Signal processing
- G01N2201/129—Using chemometrical methods
- G01N2201/1296—Using chemometrical methods using neural networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Computational Linguistics (AREA)
- Molecular Biology (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Biochemistry (AREA)
- Probability & Statistics with Applications (AREA)
- Quality & Reliability (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Evolutionary Biology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Medical Informatics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562273985P | 2015-12-31 | 2015-12-31 | |
| US15/394,792 US9916965B2 (en) | 2015-12-31 | 2016-12-29 | Hybrid inspectors |
| PCT/US2016/069580 WO2017117568A1 (en) | 2015-12-31 | 2016-12-30 | Accelerated training of a machine learning based model for semiconductor applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL259705A IL259705A (en) | 2018-07-31 |
| IL259705B true IL259705B (en) | 2021-07-29 |
Family
ID=59225974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL259705A IL259705B (en) | 2015-12-31 | 2018-05-30 | Accelerated learning-based machine model training for semiconductor applications |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3398123B1 (enExample) |
| JP (1) | JP6941103B2 (enExample) |
| KR (1) | KR102812577B1 (enExample) |
| CN (1) | CN108475351B (enExample) |
| IL (1) | IL259705B (enExample) |
| WO (1) | WO2017117568A1 (enExample) |
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| WO2019173170A1 (en) * | 2018-03-05 | 2019-09-12 | Kla-Tencor Corporation | Visualization of three-dimensional semiconductor structures |
| US10677742B2 (en) * | 2018-03-09 | 2020-06-09 | Kla-Tencor Corp. | Detecting die repeating programmed defects located in backgrounds with non-repeating features |
| US10795346B2 (en) | 2018-03-13 | 2020-10-06 | Applied Materials, Inc. | Machine learning systems for monitoring of semiconductor processing |
| US10789703B2 (en) * | 2018-03-19 | 2020-09-29 | Kla-Tencor Corporation | Semi-supervised anomaly detection in scanning electron microscope images |
| DE102018207882A1 (de) | 2018-05-18 | 2019-11-21 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Analyse eines Elements eines Photolithographieprozesses mit Hilfe eines Transformationsmodells |
| DE102018207880A1 (de) | 2018-05-18 | 2019-11-21 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Bewerten einer unbekannten Auswirkung von Defekten eines Elements eines Photolithographieprozesses |
| DE102018209562B3 (de) | 2018-06-14 | 2019-12-12 | Carl Zeiss Smt Gmbh | Vorrichtungen und Verfahren zur Untersuchung und/oder Bearbeitung eines Elements für die Photolithographie |
| US10732130B2 (en) * | 2018-06-19 | 2020-08-04 | Kla-Tencor Corporation | Embedded particle depth binning based on multiple scattering signals |
| DE102018211099B4 (de) | 2018-07-05 | 2020-06-18 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses |
| WO2020049974A1 (ja) * | 2018-09-03 | 2020-03-12 | 株式会社Preferred Networks | 学習装置、推論装置、学習モデルの生成方法及び推論方法 |
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| US11947890B2 (en) | 2019-05-10 | 2024-04-02 | Sandisk Technologies Llc | Implementation of deep neural networks for testing and quality control in the production of memory devices |
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| EP3796230B1 (en) * | 2019-09-17 | 2022-03-09 | Imec VZW | A method for determining process limits of a semiconductor process |
| CN110648935A (zh) * | 2019-09-25 | 2020-01-03 | 上海众壹云计算科技有限公司 | 一种运用ai模型的半导体制造缺陷动态随机取样方法 |
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| US11816411B2 (en) * | 2020-01-29 | 2023-11-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for semiconductor wafer defect review |
| EP3910417A1 (en) * | 2020-05-13 | 2021-11-17 | ASML Netherlands B.V. | Method for determining an inspection strategy for a group of substrates in a semiconductor manufacturing process |
| CN115398345B (zh) * | 2020-04-02 | 2025-11-04 | Asml荷兰有限公司 | 在半导体制造过程中用于确定对于一组衬底的检查策略的方法 |
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| JP7492389B2 (ja) * | 2020-07-03 | 2024-05-29 | 株式会社ホロン | 画像検査装置および画像検査方法 |
| US12321876B2 (en) * | 2020-07-21 | 2025-06-03 | UiPath, Inc. | Artificial intelligence / machine learning model drift detection and correction for robotic process automation |
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| JP7527902B2 (ja) | 2020-09-04 | 2024-08-05 | キオクシア株式会社 | 情報処理装置 |
| JP7670959B2 (ja) * | 2021-04-13 | 2025-05-01 | 横浜ゴム株式会社 | 事前学習モデルを利用したターゲットモデル生成方法、評価データ予測方法、事前学習モデルを利用して生成されたターゲットモデルを記録したコンピュータ読取可能な記録媒体並びに事前学習モデルを利用したターゲットモデル生成方法のプログラム及び評価データ予測方法のプログラム |
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| JP2023005735A (ja) * | 2021-06-29 | 2023-01-18 | 株式会社アルバック | 数理モデル取得装置、推定装置、数理モデル取得方法、推定方法及びプログラム |
| KR20230013995A (ko) * | 2021-07-20 | 2023-01-27 | 삼성전자주식회사 | 공정 시뮬레이션 모델 생성 방법 및 장치 |
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-
2016
- 2016-12-30 EP EP16882778.0A patent/EP3398123B1/en active Active
- 2016-12-30 KR KR1020187021817A patent/KR102812577B1/ko active Active
- 2016-12-30 JP JP2018534670A patent/JP6941103B2/ja active Active
- 2016-12-30 CN CN201680075625.1A patent/CN108475351B/zh active Active
- 2016-12-30 WO PCT/US2016/069580 patent/WO2017117568A1/en not_active Ceased
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2018
- 2018-05-30 IL IL259705A patent/IL259705B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019508789A (ja) | 2019-03-28 |
| KR102812577B1 (ko) | 2025-05-23 |
| KR20180090385A (ko) | 2018-08-10 |
| EP3398123A1 (en) | 2018-11-07 |
| WO2017117568A1 (en) | 2017-07-06 |
| CN108475351A (zh) | 2018-08-31 |
| JP6941103B2 (ja) | 2021-09-29 |
| IL259705A (en) | 2018-07-31 |
| EP3398123B1 (en) | 2025-03-12 |
| EP3398123A4 (en) | 2019-08-28 |
| CN108475351B (zh) | 2022-10-04 |
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