IL248686A0 - Hermetically sealed package having stress reducing layer - Google Patents
Hermetically sealed package having stress reducing layerInfo
- Publication number
- IL248686A0 IL248686A0 IL248686A IL24868616A IL248686A0 IL 248686 A0 IL248686 A0 IL 248686A0 IL 248686 A IL248686 A IL 248686A IL 24868616 A IL24868616 A IL 24868616A IL 248686 A0 IL248686 A0 IL 248686A0
- Authority
- IL
- Israel
- Prior art keywords
- hermetically sealed
- sealed package
- reducing layer
- stress reducing
- stress
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0207—Bolometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/035—Soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2014/050589 WO2016024946A1 (en) | 2014-08-11 | 2014-08-11 | Hermetically sealed package having stress reducing layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL248686A0 true IL248686A0 (en) | 2017-01-31 |
| IL248686B IL248686B (en) | 2020-09-30 |
Family
ID=51398909
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL248686A IL248686B (en) | 2014-08-11 | 2016-11-01 | Hermetically sealed package having stress reducing layer |
| IL276281A IL276281B (en) | 2014-08-11 | 2020-07-26 | Hermetically sealed package having stress reducing layer |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL276281A IL276281B (en) | 2014-08-11 | 2020-07-26 | Hermetically sealed package having stress reducing layer |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP3180288A1 (en) |
| JP (1) | JP6487032B2 (en) |
| KR (1) | KR101931010B1 (en) |
| CN (1) | CN106414309B (en) |
| CA (1) | CA2946526C (en) |
| IL (2) | IL248686B (en) |
| WO (1) | WO2016024946A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016122318A1 (en) | 2016-11-21 | 2018-05-24 | Infineon Technologies Ag | Connection structure of a power semiconductor device |
| DE102017118899B4 (en) | 2016-12-15 | 2020-06-18 | Taiwan Semiconductor Manufacturing Co. Ltd. | Sealing ring structures and processes for their manufacture |
| US10453832B2 (en) | 2016-12-15 | 2019-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal ring structures and methods of forming same |
| FR3061549B1 (en) * | 2016-12-30 | 2020-10-02 | Commissariat Energie Atomique | ELECTROMAGNETIC RADIATION DETECTOR AND ESPECIALLY INFRARED RADIATION DETECTOR AND PROCESS FOR ITS REALIZATION |
| US10163974B2 (en) | 2017-05-17 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming absorption enhancement structure for image sensor |
| US10438980B2 (en) | 2017-05-31 | 2019-10-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Image sensor with a high absorption layer |
| US10559563B2 (en) | 2017-06-26 | 2020-02-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for manufacturing monolithic three-dimensional (3D) integrated circuits |
| US10304782B2 (en) | 2017-08-25 | 2019-05-28 | Infineon Technologies Ag | Compressive interlayer having a defined crack-stop edge extension |
| US11127693B2 (en) | 2017-08-25 | 2021-09-21 | Infineon Technologies Ag | Barrier for power metallization in semiconductor devices |
| KR102040593B1 (en) * | 2018-02-14 | 2019-11-06 | 주식회사 오킨스전자 | Filter chip package and wafer level package having improved bonding feature, and method for manufacturing the same |
| KR102587868B1 (en) * | 2018-07-10 | 2023-10-10 | 니폰 덴키 가라스 가부시키가이샤 | Package, package manufacturing method, cover body with bonding material attached, and manufacturing method of cover body with bonding material attached |
| US10734320B2 (en) | 2018-07-30 | 2020-08-04 | Infineon Technologies Austria Ag | Power metallization structure for semiconductor devices |
| US11031321B2 (en) | 2019-03-15 | 2021-06-08 | Infineon Technologies Ag | Semiconductor device having a die pad with a dam-like configuration |
| CN110265521B (en) * | 2019-04-29 | 2020-10-27 | 华灿光电(苏州）有限公司 | Flip light-emitting diode chip and manufacturing method thereof |
| KR102328922B1 (en) * | 2019-05-27 | 2021-11-22 | 주식회사 아이디피 | Wafer level packaging method with solderball for Cap wafer, and Cap wafer |
| EP4020541A4 (en) * | 2019-08-20 | 2022-10-12 | Mitsubishi Electric Corporation | Semiconductor package |
| CN110577186A (en) * | 2019-09-12 | 2019-12-17 | 南通大学 | Three-dimensional packaging structure of MEMS infrared detector and manufacturing method thereof |
| CN111446212A (en) * | 2020-04-16 | 2020-07-24 | 中国电子科技集团公司第四十三研究所 | Ceramic integrated packaging shell and manufacturing process thereof |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0434392B1 (en) * | 1989-12-19 | 1994-06-15 | Fujitsu Limited | Semiconductor device having improved adhesive structure and method of producing the same |
| JP2788672B2 (en) * | 1989-12-19 | 1998-08-20 | 富士通株式会社 | Semiconductor device |
| JPH06140527A (en) * | 1992-10-28 | 1994-05-20 | Sumitomo Electric Ind Ltd | Sealing device component for semiconductor |
| US5701008A (en) | 1996-11-29 | 1997-12-23 | He Holdings, Inc. | Integrated infrared microlens and gas molecule getter grating in a vacuum package |
| JPH11307688A (en) * | 1998-04-17 | 1999-11-05 | Ngk Spark Plug Co Ltd | Wiring board and its manufacture |
| US6521477B1 (en) | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
| US6342407B1 (en) * | 2000-12-07 | 2002-01-29 | International Business Machines Corporation | Low stress hermetic seal |
| EP1571704A1 (en) * | 2004-03-04 | 2005-09-07 | Interuniversitair Microelektronica Centrum Vzw | Method for depositing a solder material on a substrate in the form of a predetermined pattern |
| JP2009200093A (en) * | 2008-02-19 | 2009-09-03 | Murata Mfg Co Ltd | Hollow type electronic component |
| JPWO2010021267A1 (en) * | 2008-08-21 | 2012-01-26 | 株式会社村田製作所 | Electronic component device and manufacturing method thereof |
| US7948178B2 (en) * | 2009-03-04 | 2011-05-24 | Global Oled Technology Llc | Hermetic seal |
| US8809784B2 (en) * | 2010-10-21 | 2014-08-19 | Raytheon Company | Incident radiation detector packaging |
| JP5716627B2 (en) * | 2011-10-06 | 2015-05-13 | オムロン株式会社 | Wafer bonding method and bonded portion structure |
-
2014
- 2014-08-11 CN CN201480079309.2A patent/CN106414309B/en not_active Expired - Fee Related
- 2014-08-11 JP JP2017507405A patent/JP6487032B2/en not_active Expired - Fee Related
- 2014-08-11 WO PCT/US2014/050589 patent/WO2016024946A1/en active Application Filing
- 2014-08-11 KR KR1020167032332A patent/KR101931010B1/en active IP Right Grant
- 2014-08-11 EP EP14755503.1A patent/EP3180288A1/en not_active Withdrawn
- 2014-08-11 CA CA2946526A patent/CA2946526C/en active Active
-
2016
- 2016-11-01 IL IL248686A patent/IL248686B/en active IP Right Grant
-
2020
- 2020-07-26 IL IL276281A patent/IL276281B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL276281B (en) | 2021-05-31 |
| KR101931010B1 (en) | 2018-12-19 |
| JP6487032B2 (en) | 2019-03-20 |
| JP2017527113A (en) | 2017-09-14 |
| CA2946526C (en) | 2021-03-23 |
| CA2946526A1 (en) | 2016-02-18 |
| EP3180288A1 (en) | 2017-06-21 |
| KR20160146879A (en) | 2016-12-21 |
| IL276281A (en) | 2020-09-30 |
| CN106414309A (en) | 2017-02-15 |
| CN106414309B (en) | 2020-02-28 |
| IL248686B (en) | 2020-09-30 |
| WO2016024946A1 (en) | 2016-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed |