IL276281A - A hermetically sealed package with a pressure reduction layer - Google Patents

A hermetically sealed package with a pressure reduction layer

Info

Publication number
IL276281A
IL276281A IL276281A IL27628120A IL276281A IL 276281 A IL276281 A IL 276281A IL 276281 A IL276281 A IL 276281A IL 27628120 A IL27628120 A IL 27628120A IL 276281 A IL276281 A IL 276281A
Authority
IL
Israel
Prior art keywords
pressure reduction
hermetically sealed
sealed package
reduction layer
package
Prior art date
Application number
IL276281A
Other languages
Hebrew (he)
Other versions
IL276281B (en
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of IL276281A publication Critical patent/IL276281A/en
Publication of IL276281B publication Critical patent/IL276281B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0051—Packages or encapsulation for reducing stress inside of the package structure between the package lid and the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0207—Bolometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
IL276281A 2014-08-11 2020-07-26 Hermetically sealed package having stress reducing layer IL276281B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/050589 WO2016024946A1 (en) 2014-08-11 2014-08-11 Hermetically sealed package having stress reducing layer

Publications (2)

Publication Number Publication Date
IL276281A true IL276281A (en) 2020-09-30
IL276281B IL276281B (en) 2021-05-31

Family

ID=51398909

Family Applications (2)

Application Number Title Priority Date Filing Date
IL248686A IL248686B (en) 2014-08-11 2016-11-01 Hermetically sealed packaging with a layer to reduce pressure
IL276281A IL276281B (en) 2014-08-11 2020-07-26 Hermetically sealed package having stress reducing layer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL248686A IL248686B (en) 2014-08-11 2016-11-01 Hermetically sealed packaging with a layer to reduce pressure

Country Status (7)

Country Link
EP (1) EP3180288A1 (en)
JP (1) JP6487032B2 (en)
KR (1) KR101931010B1 (en)
CN (1) CN106414309B (en)
CA (1) CA2946526C (en)
IL (2) IL248686B (en)
WO (1) WO2016024946A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016122318A1 (en) 2016-11-21 2018-05-24 Infineon Technologies Ag Connection structure of a power semiconductor device
DE102017118899B4 (en) 2016-12-15 2020-06-18 Taiwan Semiconductor Manufacturing Co. Ltd. Sealing ring structures and processes for their manufacture
US10453832B2 (en) * 2016-12-15 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Seal ring structures and methods of forming same
FR3061549B1 (en) * 2016-12-30 2020-10-02 Commissariat Energie Atomique ELECTROMAGNETIC RADIATION DETECTOR AND ESPECIALLY INFRARED RADIATION DETECTOR AND PROCESS FOR ITS REALIZATION
US10163974B2 (en) 2017-05-17 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming absorption enhancement structure for image sensor
US10438980B2 (en) 2017-05-31 2019-10-08 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor with a high absorption layer
US10559563B2 (en) 2017-06-26 2020-02-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing monolithic three-dimensional (3D) integrated circuits
US11127693B2 (en) 2017-08-25 2021-09-21 Infineon Technologies Ag Barrier for power metallization in semiconductor devices
US10304782B2 (en) * 2017-08-25 2019-05-28 Infineon Technologies Ag Compressive interlayer having a defined crack-stop edge extension
KR102040593B1 (en) * 2018-02-14 2019-11-06 주식회사 오킨스전자 Filter chip package and wafer level package having improved bonding feature, and method for manufacturing the same
WO2020012974A1 (en) * 2018-07-10 2020-01-16 日本電気硝子株式会社 Package, method of manufacturing package, lid body with bonding material, and method of manufacturing lid body with bonding material
US10734320B2 (en) 2018-07-30 2020-08-04 Infineon Technologies Austria Ag Power metallization structure for semiconductor devices
US11031321B2 (en) 2019-03-15 2021-06-08 Infineon Technologies Ag Semiconductor device having a die pad with a dam-like configuration
CN110265521B (en) * 2019-04-29 2020-10-27 华灿光电(苏州）有限公司 Flip-chip light-emitting diode chip and method of making the same
KR102328922B1 (en) * 2019-05-27 2021-11-22 주식회사 아이디피 Wafer level packaging method with solderball for Cap wafer, and Cap wafer
CN114270497B (en) * 2019-08-20 2025-05-13 三菱电机株式会社 Semiconductor packaging
CN110577186A (en) * 2019-09-12 2019-12-17 南通大学 A MEMS infrared detector three-dimensional packaging structure and manufacturing method thereof
CN111446212B (en) * 2020-04-16 2024-12-06 中国电子科技集团公司第四十三研究所 A ceramic integrated packaging shell and its manufacturing process
US20230187459A1 (en) * 2020-07-03 2023-06-15 Mitsubishi Electric Corporation Infrared sensor and method of manufacturing infrared sensor
JP7579201B2 (en) * 2021-04-23 2024-11-07 シャープ福山レーザー株式会社 Light-emitting device
CN120980821B (en) * 2025-09-30 2026-02-03 广东永锢电子机械科技有限公司 Design method of shell sealing structure of integrated flexible circuit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69009958T2 (en) * 1989-12-19 1994-09-22 Fujitsu Ltd Adhesive structure for semiconductor device and method for their production.
JP2788672B2 (en) * 1989-12-19 1998-08-20 富士通株式会社 Semiconductor device
JPH06140527A (en) * 1992-10-28 1994-05-20 Sumitomo Electric Ind Ltd Semiconductor sealing device parts
US5701008A (en) 1996-11-29 1997-12-23 He Holdings, Inc. Integrated infrared microlens and gas molecule getter grating in a vacuum package
JPH11307688A (en) * 1998-04-17 1999-11-05 Ngk Spark Plug Co Ltd Wiring board and manufacturing method thereof
US6521477B1 (en) 2000-02-02 2003-02-18 Raytheon Company Vacuum package fabrication of integrated circuit components
US6342407B1 (en) * 2000-12-07 2002-01-29 International Business Machines Corporation Low stress hermetic seal
EP1571704A1 (en) * 2004-03-04 2005-09-07 Interuniversitair Microelektronica Centrum Vzw Method for depositing a solder material on a substrate in the form of a predetermined pattern
JP2009200093A (en) * 2008-02-19 2009-09-03 Murata Mfg Co Ltd Hollow type electronic component
WO2010021267A1 (en) * 2008-08-21 2010-02-25 株式会社村田製作所 Electronic component and method for manufacturing the same
US7948178B2 (en) * 2009-03-04 2011-05-24 Global Oled Technology Llc Hermetic seal
US8809784B2 (en) * 2010-10-21 2014-08-19 Raytheon Company Incident radiation detector packaging
JP5716627B2 (en) * 2011-10-06 2015-05-13 オムロン株式会社 Wafer bonding method and bonded portion structure

Also Published As

Publication number Publication date
IL248686B (en) 2020-09-30
CN106414309B (en) 2020-02-28
KR20160146879A (en) 2016-12-21
EP3180288A1 (en) 2017-06-21
KR101931010B1 (en) 2018-12-19
JP6487032B2 (en) 2019-03-20
JP2017527113A (en) 2017-09-14
IL248686A0 (en) 2017-01-31
IL276281B (en) 2021-05-31
CA2946526A1 (en) 2016-02-18
CA2946526C (en) 2021-03-23
CN106414309A (en) 2017-02-15
WO2016024946A1 (en) 2016-02-18

Similar Documents

Publication Publication Date Title
IL276281A (en) A hermetically sealed package with a pressure reduction layer
DK3119603T3 (en) PACKAGING FOIL
UA31329S (en) PACKAGING
PL3119693T3 (en) PACKAGE CONTAINING A BAG
DK3191067T3 (en) A PHARMACEUTICAL PACKAGE
HUE042830T2 (en) Flexible packaging
GB201700708D0 (en) A package
DK3166854T3 (en) PACKAGING
DK3581220T3 (en) PRESSURE CONTAINER TO OPERATE A MEDICAL DEVICE
EP3689775C0 (en) PACKAGING
GB2533885B (en) Determining pressure within a sealed annulus
GB201700709D0 (en) A package
DK3151927T3 (en) EVACUATION DEVICES
FR3034292B1 (en) FOOTWEAR ARTICLE WITH SEALED STRUCTURE
DK3157823T3 (en) PACKAGING
BR112016018583A2 (en) FLEXIBLE PACKAGING
TH1501005472A (en) A package that can be inflated when needed.
TH1401007541B (en) sealed compressor
TH1501005075A (en) A package of curing-moisture mixtures.
ITCZ20140004U1 (en) SECURITY SECURITY CHAIN SEALED WITH CHAIN PACKAGE
AU2014902452A0 (en) A package
UA30812S (en) SAUCE PACKAGING LABEL
UA28920S (en) PACKAGE
TH1401002953B (en) Sealed battery
UA30161S (en) SAUCE PACKAGING LABEL

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed