IL231667B - Process aware metrology - Google Patents
Process aware metrologyInfo
- Publication number
- IL231667B IL231667B IL231667A IL23166714A IL231667B IL 231667 B IL231667 B IL 231667B IL 231667 A IL231667 A IL 231667A IL 23166714 A IL23166714 A IL 23166714A IL 231667 B IL231667 B IL 231667B
- Authority
- IL
- Israel
- Prior art keywords
- metrology
- process aware
- aware metrology
- aware
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/10—Numerical modelling
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/333—Design for testability [DFT], e.g. scan chain or built-in self-test [BIST]
-
- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
- G16Z99/00—Subject matter not provided for in other main groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161538699P | 2011-09-23 | 2011-09-23 | |
| US13/411,433 US8468471B2 (en) | 2011-09-23 | 2012-03-02 | Process aware metrology |
| PCT/US2012/056272 WO2013043831A2 (en) | 2011-09-23 | 2012-09-20 | Process aware metrology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL231667A0 IL231667A0 (en) | 2014-05-28 |
| IL231667B true IL231667B (en) | 2018-02-28 |
Family
ID=47912686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL231667A IL231667B (en) | 2011-09-23 | 2014-03-23 | Process aware metrology |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8468471B2 (https=) |
| EP (1) | EP2758990B1 (https=) |
| JP (1) | JP5959648B2 (https=) |
| KR (1) | KR102060209B1 (https=) |
| IL (1) | IL231667B (https=) |
| WO (1) | WO2013043831A2 (https=) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8468471B2 (en) * | 2011-09-23 | 2013-06-18 | Kla-Tencor Corp. | Process aware metrology |
| US8675188B2 (en) | 2012-01-09 | 2014-03-18 | Kla-Tencor Corporation | Method and system for determining one or more optical characteristics of structure of a semiconductor wafer |
| US8869081B2 (en) * | 2013-01-15 | 2014-10-21 | International Business Machines Corporation | Automating integrated circuit device library generation in model based metrology |
| WO2015101458A1 (en) | 2013-12-30 | 2015-07-09 | Asml Netherlands B.V. | Method and apparatus for design of a metrology target |
| KR101860038B1 (ko) | 2013-12-30 | 2018-05-21 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 타겟의 디자인을 위한 방법 및 장치 |
| US9009638B1 (en) * | 2013-12-30 | 2015-04-14 | International Business Machines Corporation | Estimating transistor characteristics and tolerances for compact modeling |
| SG11201604739RA (en) | 2013-12-30 | 2016-07-28 | Asml Netherlands Bv | Method and apparatus for design of a metrology target |
| WO2015101460A1 (en) | 2013-12-30 | 2015-07-09 | Asml Netherlands B.V. | Method and apparatus for design of a metrology target |
| US9553033B2 (en) * | 2014-01-15 | 2017-01-24 | Kla-Tencor Corporation | Semiconductor device models including re-usable sub-structures |
| US10430719B2 (en) | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| KR102521159B1 (ko) * | 2014-11-25 | 2023-04-13 | 피디에프 솔루션즈, 인코포레이티드 | 반도체 제조 공정을 위한 개선된 공정 제어 기술 |
| US9946825B2 (en) | 2015-04-24 | 2018-04-17 | Leung W. TSANG | Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique |
| US9824176B2 (en) * | 2015-07-24 | 2017-11-21 | Nanometrics Incorporated | Optical critical dimension target design |
| WO2017117568A1 (en) * | 2015-12-31 | 2017-07-06 | Kla-Tencor Corporation | Accelerated training of a machine learning based model for semiconductor applications |
| US11580375B2 (en) | 2015-12-31 | 2023-02-14 | Kla-Tencor Corp. | Accelerated training of a machine learning based model for semiconductor applications |
| CN108700823B (zh) | 2016-02-22 | 2020-11-27 | Asml荷兰有限公司 | 对量测数据的贡献的分离 |
| EP3290911A1 (en) * | 2016-09-02 | 2018-03-07 | ASML Netherlands B.V. | Method and system to monitor a process apparatus |
| US11087043B2 (en) * | 2016-10-31 | 2021-08-10 | Leung W. TSANG | Full wave simulations of photonic crystals and metamaterials using the broadband green's functions |
| US11029673B2 (en) | 2017-06-13 | 2021-06-08 | Pdf Solutions, Inc. | Generating robust machine learning predictions for semiconductor manufacturing processes |
| US11022642B2 (en) | 2017-08-25 | 2021-06-01 | Pdf Solutions, Inc. | Semiconductor yield prediction |
| KR102499036B1 (ko) | 2017-09-22 | 2023-02-13 | 삼성전자주식회사 | 임계 치수 측정 시스템 및 임계 치수 측정 방법 |
| US11348017B1 (en) * | 2017-11-07 | 2022-05-31 | Synopsys, Inc. | Machine learning method and framework for optimizing setups for accurate, speedy and robust TCAD simulations |
| US11257207B2 (en) * | 2017-12-28 | 2022-02-22 | Kla-Tencor Corporation | Inspection of reticles using machine learning |
| US11775714B2 (en) | 2018-03-09 | 2023-10-03 | Pdf Solutions, Inc. | Rational decision-making tool for semiconductor processes |
| US11029359B2 (en) | 2018-03-09 | 2021-06-08 | Pdf Solutions, Inc. | Failure detection and classsification using sensor data and/or measurement data |
| US10777470B2 (en) | 2018-03-27 | 2020-09-15 | Pdf Solutions, Inc. | Selective inclusion/exclusion of semiconductor chips in accelerated failure tests |
| US11397134B2 (en) * | 2018-12-03 | 2022-07-26 | Raytheon Technologies Corporation | Intelligent learning device for part state detection and identification |
| CN120178612A (zh) * | 2019-03-25 | 2025-06-20 | Asml荷兰有限公司 | 用于确定图案化过程中的图案的方法 |
| EP3994526A1 (en) * | 2019-07-03 | 2022-05-11 | ASML Netherlands B.V. | Method for applying a deposition model in a semiconductor manufacturing process |
| US11928396B2 (en) * | 2019-08-30 | 2024-03-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Method for quantifying visual differences in automotive aerodynamic simulations |
| US12131103B2 (en) | 2020-03-30 | 2024-10-29 | Kla Corporation | Semiconductor fabrication process parameter determination using a generative adversarial network |
| US12489022B2 (en) * | 2020-08-12 | 2025-12-02 | Applied Materials, Inc. | In-situ etch rate and etch rate uniformity detection system |
| KR20220060214A (ko) | 2020-11-04 | 2022-05-11 | 삼성전자주식회사 | 반도체 설계 자동화 시스템 및 이를 포함하는 컴퓨팅 시스템 |
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| US8468471B2 (en) * | 2011-09-23 | 2013-06-18 | Kla-Tencor Corp. | Process aware metrology |
-
2012
- 2012-03-02 US US13/411,433 patent/US8468471B2/en active Active
- 2012-09-20 JP JP2014531950A patent/JP5959648B2/ja active Active
- 2012-09-20 EP EP12833283.0A patent/EP2758990B1/en active Active
- 2012-09-20 KR KR1020147010969A patent/KR102060209B1/ko active Active
- 2012-09-20 WO PCT/US2012/056272 patent/WO2013043831A2/en not_active Ceased
-
2013
- 2013-06-17 US US13/919,577 patent/US8832611B2/en active Active
-
2014
- 2014-03-23 IL IL231667A patent/IL231667B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US8832611B2 (en) | 2014-09-09 |
| US20130080984A1 (en) | 2013-03-28 |
| EP2758990A4 (en) | 2015-10-14 |
| WO2013043831A2 (en) | 2013-03-28 |
| EP2758990A2 (en) | 2014-07-30 |
| JP2014526805A (ja) | 2014-10-06 |
| US8468471B2 (en) | 2013-06-18 |
| KR102060209B1 (ko) | 2019-12-27 |
| WO2013043831A3 (en) | 2013-05-23 |
| KR20140069255A (ko) | 2014-06-09 |
| JP5959648B2 (ja) | 2016-08-02 |
| EP2758990B1 (en) | 2019-03-06 |
| US20130282340A1 (en) | 2013-10-24 |
| IL231667A0 (en) | 2014-05-28 |
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