IL192527A - Composition and method to polish silicon nitride - Google Patents

Composition and method to polish silicon nitride

Info

Publication number
IL192527A
IL192527A IL192527A IL19252708A IL192527A IL 192527 A IL192527 A IL 192527A IL 192527 A IL192527 A IL 192527A IL 19252708 A IL19252708 A IL 19252708A IL 192527 A IL192527 A IL 192527A
Authority
IL
Israel
Prior art keywords
polishing composition
polishing
substrate
acid
composition
Prior art date
Application number
IL192527A
Other languages
English (en)
Hebrew (he)
Other versions
IL192527A0 (en
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of IL192527A0 publication Critical patent/IL192527A0/en
Publication of IL192527A publication Critical patent/IL192527A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IL192527A 2006-03-13 2008-06-30 Composition and method to polish silicon nitride IL192527A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/374,238 US20070209287A1 (en) 2006-03-13 2006-03-13 Composition and method to polish silicon nitride
PCT/US2007/005594 WO2007108926A2 (en) 2006-03-13 2007-03-06 Composition and method to polish silicon nitride

Publications (2)

Publication Number Publication Date
IL192527A0 IL192527A0 (en) 2009-02-11
IL192527A true IL192527A (en) 2013-08-29

Family

ID=38436739

Family Applications (1)

Application Number Title Priority Date Filing Date
IL192527A IL192527A (en) 2006-03-13 2008-06-30 Composition and method to polish silicon nitride

Country Status (10)

Country Link
US (1) US20070209287A1 (https=)
EP (1) EP1994107A2 (https=)
JP (1) JP5524607B2 (https=)
KR (1) KR101371939B1 (https=)
CN (2) CN101389722B (https=)
IL (1) IL192527A (https=)
MY (1) MY153685A (https=)
SG (1) SG170108A1 (https=)
TW (1) TWI363797B (https=)
WO (1) WO2007108926A2 (https=)

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US8759216B2 (en) * 2006-06-07 2014-06-24 Cabot Microelectronics Corporation Compositions and methods for polishing silicon nitride materials
KR101564676B1 (ko) * 2008-02-01 2015-11-02 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 이를 이용한 연마 방법
JP5441362B2 (ja) * 2008-05-30 2014-03-12 富士フイルム株式会社 研磨液及び研磨方法
CN101747841A (zh) * 2008-12-05 2010-06-23 安集微电子（上海）有限公司 一种化学机械抛光液
SG10201401549SA (en) 2009-06-22 2014-06-27 Cabot Microelectronics Corp CMP Compositions And Methods For Suppressing Polysilicon Removal Rates
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
US20140197356A1 (en) * 2011-12-21 2014-07-17 Cabot Microelectronics Corporation Cmp compositions and methods for suppressing polysilicon removal rates
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
KR101612520B1 (ko) 2012-05-10 2016-04-14 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 화학 첨가제를 지닌 화학적 기계적 폴리싱 조성물 및 이를 사용하는 방법
US9633863B2 (en) 2012-07-11 2017-04-25 Cabot Microelectronics Corporation Compositions and methods for selective polishing of silicon nitride materials
SG11201607461PA (en) 2014-03-28 2016-10-28 Fujimi Inc Polishing composition and polishing method using the same
US9583359B2 (en) 2014-04-04 2017-02-28 Fujifilm Planar Solutions, LLC Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
CN105802511A (zh) * 2014-12-29 2016-07-27 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
CN108117838B (zh) * 2016-11-29 2021-09-17 安集微电子科技（上海）股份有限公司 一种氮化硅化学机械抛光液
CN113632205B (zh) * 2019-06-06 2024-12-20 株式会社力森诺科 研磨液及研磨方法

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US5230833A (en) * 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
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US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
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US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US5773364A (en) * 1996-10-21 1998-06-30 Motorola, Inc. Method for using ammonium salt slurries for chemical mechanical polishing (CMP)
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JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
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Also Published As

Publication number Publication date
SG170108A1 (en) 2011-04-29
IL192527A0 (en) 2009-02-11
EP1994107A2 (en) 2008-11-26
CN101389722A (zh) 2009-03-18
CN101389722B (zh) 2012-09-05
WO2007108926A3 (en) 2008-03-20
US20070209287A1 (en) 2007-09-13
TWI363797B (en) 2012-05-11
CN102604541B (zh) 2015-05-20
JP5524607B2 (ja) 2014-06-18
MY153685A (en) 2015-03-13
WO2007108926A2 (en) 2007-09-27
JP2009530811A (ja) 2009-08-27
TW200740970A (en) 2007-11-01
CN102604541A (zh) 2012-07-25
KR20080106575A (ko) 2008-12-08
KR101371939B1 (ko) 2014-03-07

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