IL161793A0 - Rotation type silicon wafer cleaning equipment - Google Patents

Rotation type silicon wafer cleaning equipment

Info

Publication number
IL161793A0
IL161793A0 IL16179303A IL16179303A IL161793A0 IL 161793 A0 IL161793 A0 IL 161793A0 IL 16179303 A IL16179303 A IL 16179303A IL 16179303 A IL16179303 A IL 16179303A IL 161793 A0 IL161793 A0 IL 161793A0
Authority
IL
Israel
Prior art keywords
silicon wafer
type silicon
cleaning equipment
rotation type
wafer cleaning
Prior art date
Application number
IL16179303A
Other languages
English (en)
Original Assignee
Tadahiro Ohmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tadahiro Ohmi filed Critical Tadahiro Ohmi
Publication of IL161793A0 publication Critical patent/IL161793A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
IL16179303A 2002-09-24 2003-09-11 Rotation type silicon wafer cleaning equipment IL161793A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002276818A JP4554146B2 (ja) 2002-09-24 2002-09-24 回転式シリコンウエハ洗浄装置
PCT/JP2003/011667 WO2004036637A1 (ja) 2002-09-24 2003-09-11 回転式シリコンウエハ洗浄装置

Publications (1)

Publication Number Publication Date
IL161793A0 true IL161793A0 (en) 2005-11-20

Family

ID=32104925

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16179303A IL161793A0 (en) 2002-09-24 2003-09-11 Rotation type silicon wafer cleaning equipment
IL161793A IL161793A (en) 2002-09-24 2004-05-05 Rotation type silicon wafer cleaning equipment

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL161793A IL161793A (en) 2002-09-24 2004-05-05 Rotation type silicon wafer cleaning equipment

Country Status (10)

Country Link
US (1) US7103990B2 (de)
EP (1) EP1544902A1 (de)
JP (1) JP4554146B2 (de)
KR (1) KR100705344B1 (de)
CN (1) CN100359641C (de)
AU (1) AU2003264411A1 (de)
CA (1) CA2465875A1 (de)
IL (2) IL161793A0 (de)
TW (1) TWI226661B (de)
WO (1) WO2004036637A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200524018A (en) * 2003-11-20 2005-07-16 Ulvac Inc Method of cleaning surface of semiconductor substrate, method of manufacturing film, method of manufacturing semiconductor device and semiconductor device
US9799536B2 (en) * 2005-02-07 2017-10-24 Planar Semiconductor, Inc. Apparatus and method for cleaning flat objects in a vertical orientation with pulsed liquid jet
US10179351B2 (en) 2005-02-07 2019-01-15 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
TWI552797B (zh) * 2005-06-22 2016-10-11 恩特葛瑞斯股份有限公司 整合式氣體混合用之裝置及方法
US7479460B2 (en) * 2005-08-23 2009-01-20 Asm America, Inc. Silicon surface preparation
US8895410B2 (en) * 2005-09-13 2014-11-25 Tadahiro Ohmi Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
US7877895B2 (en) * 2006-06-26 2011-02-01 Tokyo Electron Limited Substrate processing apparatus
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
CN101179009B (zh) * 2007-11-21 2011-09-21 上海宏力半导体制造有限公司 喷射清洗方法以及装置
CN101740324B (zh) * 2008-11-25 2011-09-28 上海华虹Nec电子有限公司 硅片清洗机及硅片清洗方法
US9454158B2 (en) 2013-03-15 2016-09-27 Bhushan Somani Real time diagnostics for flow controller systems and methods
CN104096667A (zh) * 2013-04-08 2014-10-15 广达电脑股份有限公司 烘胶设备
US10983537B2 (en) 2017-02-27 2021-04-20 Flow Devices And Systems Inc. Systems and methods for flow sensor back pressure adjustment for mass flow controller
KR101981738B1 (ko) * 2017-09-19 2019-05-27 무진전자 주식회사 기판 처리 방법 및 장치
KR102003361B1 (ko) * 2017-09-19 2019-07-24 무진전자 주식회사 인시튜 건식 세정 방법 및 장치
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
CN110335839B (zh) * 2019-07-05 2022-02-22 西安奕斯伟材料科技有限公司 一种片盒清洗装置及方法
CN111354662A (zh) * 2020-03-10 2020-06-30 南通欧贝黎新能源电力股份有限公司 一种太阳能电池片制备用硅片去除磷硅玻璃酸洗装置
JP7619800B2 (ja) * 2020-12-24 2025-01-22 株式会社アーステクニカ 造粒乾燥装置及び造粒乾燥方法
KR102916044B1 (ko) * 2021-03-18 2026-01-21 에이에스엠 아이피 홀딩 비.브이. 반도체 처리 사전 세정 방법 및 장치
CN114001546B (zh) * 2021-11-01 2022-09-30 华海清科股份有限公司 一种晶圆提拉干燥的动态交接方法及晶圆干燥装置
US12062636B2 (en) * 2022-04-08 2024-08-13 Kulicke And Soffa Industries, Inc. Bonding systems, and methods of providing a reducing gas on a bonding system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212050A (en) * 1988-11-14 1993-05-18 Mier Randall M Method of forming a permselective layer
US5129955A (en) * 1989-01-11 1992-07-14 Dainippon Screen Mfg. Co., Ltd. Wafer cleaning method
JP3436776B2 (ja) * 1993-08-09 2003-08-18 忠弘 大見 ウエハ洗浄装置及び洗浄方法
JP3742451B2 (ja) * 1996-01-17 2006-02-01 昌之 都田 洗浄方法
JP4375584B2 (ja) * 1998-07-08 2009-12-02 財団法人国際科学振興財団 乾燥方法

Also Published As

Publication number Publication date
US7103990B2 (en) 2006-09-12
CA2465875A1 (en) 2004-04-29
CN1596461A (zh) 2005-03-16
KR20040089117A (ko) 2004-10-20
KR100705344B1 (ko) 2007-04-10
TW200409218A (en) 2004-06-01
CN100359641C (zh) 2008-01-02
AU2003264411A1 (en) 2004-05-04
US20050126030A1 (en) 2005-06-16
WO2004036637A1 (ja) 2004-04-29
IL161793A (en) 2008-12-29
JP2004119417A (ja) 2004-04-15
JP4554146B2 (ja) 2010-09-29
TWI226661B (en) 2005-01-11
AU2003264411A8 (en) 2004-05-04
EP1544902A1 (de) 2005-06-22

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