IL127720A0 - Local particle cleaning - Google Patents

Local particle cleaning

Info

Publication number
IL127720A0
IL127720A0 IL12772098A IL12772098A IL127720A0 IL 127720 A0 IL127720 A0 IL 127720A0 IL 12772098 A IL12772098 A IL 12772098A IL 12772098 A IL12772098 A IL 12772098A IL 127720 A0 IL127720 A0 IL 127720A0
Authority
IL
Israel
Prior art keywords
particle cleaning
local particle
local
cleaning
particle
Prior art date
Application number
IL12772098A
Other languages
English (en)
Original Assignee
Oramir Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oramir Semiconductor Ltd filed Critical Oramir Semiconductor Ltd
Priority to IL12772098A priority Critical patent/IL127720A0/xx
Publication of IL127720A0 publication Critical patent/IL127720A0/xx
Priority to JP2000590866A priority patent/JP2002533946A/ja
Priority to EP99961260A priority patent/EP1152906A4/en
Priority to PCT/IL1999/000701 priority patent/WO2000038935A1/en
Priority to AU17953/00A priority patent/AU1795300A/en
Priority to US09/869,058 priority patent/US6566169B1/en
Priority to KR1020017008110A priority patent/KR20010099947A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1438—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for directional control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02098—Cleaning only involving lasers, e.g. laser ablation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
IL12772098A 1998-12-24 1998-12-24 Local particle cleaning IL127720A0 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IL12772098A IL127720A0 (en) 1998-12-24 1998-12-24 Local particle cleaning
JP2000590866A JP2002533946A (ja) 1998-12-24 1999-12-23 局所ベクトル式粒子洗浄方法と装置
EP99961260A EP1152906A4 (en) 1998-12-24 1999-12-23 LOCAL VECTOR REMOVAL OF PARTICLES
PCT/IL1999/000701 WO2000038935A1 (en) 1998-12-24 1999-12-23 Local vectorial particle cleaning
AU17953/00A AU1795300A (en) 1998-12-24 1999-12-23 Local vectorial particle cleaning
US09/869,058 US6566169B1 (en) 1998-12-24 1999-12-23 Method and apparatus for local vectorial particle cleaning
KR1020017008110A KR20010099947A (ko) 1998-12-24 1999-12-23 국부적 벡터 파티클 클리닝

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12772098A IL127720A0 (en) 1998-12-24 1998-12-24 Local particle cleaning

Publications (1)

Publication Number Publication Date
IL127720A0 true IL127720A0 (en) 1999-10-28

Family

ID=11072292

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12772098A IL127720A0 (en) 1998-12-24 1998-12-24 Local particle cleaning

Country Status (7)

Country Link
US (1) US6566169B1 (ja)
EP (1) EP1152906A4 (ja)
JP (1) JP2002533946A (ja)
KR (1) KR20010099947A (ja)
AU (1) AU1795300A (ja)
IL (1) IL127720A0 (ja)
WO (1) WO2000038935A1 (ja)

Families Citing this family (30)

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US5881226A (en) * 1996-10-28 1999-03-09 Veneklase; Brian J. Computer security system
US6827816B1 (en) 1999-12-16 2004-12-07 Applied Materials, Inc. In situ module for particle removal from solid-state surfaces
WO2002042013A1 (en) * 2000-11-22 2002-05-30 Applied Materials, Inc. An in situ module for particle removal from solid-state surfaces
US20020170897A1 (en) * 2001-05-21 2002-11-21 Hall Frank L. Methods for preparing ball grid array substrates via use of a laser
KR100432854B1 (ko) * 2001-07-31 2004-05-24 주식회사 한택 레이저를 이용한 반도체 소자의 세정 방법
US6799584B2 (en) 2001-11-09 2004-10-05 Applied Materials, Inc. Condensation-based enhancement of particle removal by suction
US6764386B2 (en) 2002-01-11 2004-07-20 Applied Materials, Inc. Air bearing-sealed micro-processing chamber
DE10208718A1 (de) * 2002-02-28 2003-10-02 Wacker Siltronic Halbleitermat Verfahren zur Entfernung von Partikeln von Oberflächen
US6829035B2 (en) * 2002-11-12 2004-12-07 Applied Materials Israel, Ltd. Advanced mask cleaning and handling
KR101037057B1 (ko) * 2002-12-10 2011-05-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7006222B2 (en) * 2003-01-08 2006-02-28 Kla-Tencor Technologies Corporation Concurrent measurement and cleaning of thin films on silicon-on-insulator (SOI)
US6864458B2 (en) 2003-01-21 2005-03-08 Applied Materials, Inc. Iced film substrate cleaning
US6874510B2 (en) * 2003-02-07 2005-04-05 Lsi Logic Corporation Method to use a laser to perform the edge clean operation on a semiconductor wafer
JP4013839B2 (ja) * 2003-06-17 2007-11-28 ミツミ電機株式会社 アンテナ装置
US6943062B2 (en) * 2003-10-20 2005-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. Contaminant particle removal by optical tweezers
JP4890746B2 (ja) * 2004-06-14 2012-03-07 株式会社ディスコ ウエーハの加工方法
US20060096622A1 (en) * 2004-11-11 2006-05-11 Samsung Electronics Co., Ltd. Dry cleaning apparatus used to manufacture semiconductor devices
KR20060077363A (ko) * 2004-12-30 2006-07-05 엘지.필립스 엘시디 주식회사 대기개방형 박막처리장치 및 이를 이용한 평판표시장치용기판의 박막처리방법
DE102005024812A1 (de) * 2005-05-27 2006-11-30 Emag Laser Tec Gmbh Verfahren und Vorrichtung zur Behandlung von Werkstückoberflächen mittels Laserstrahlung
JP4413831B2 (ja) * 2005-08-11 2010-02-10 株式会社日立ハイテクノロジーズ ウェハ表面検査装置及びウェハ表面検査方法
US7628865B2 (en) * 2006-04-28 2009-12-08 Asml Netherlands B.V. Methods to clean a surface, a device manufacturing method, a cleaning assembly, cleaning apparatus, and lithographic apparatus
US20090183322A1 (en) * 2008-01-17 2009-07-23 Banqiu Wu Electrostatic surface cleaning
US8084757B2 (en) * 2008-01-17 2011-12-27 Applied Materials, Inc. Contamination prevention in extreme ultraviolet lithography
DE102009045008A1 (de) 2008-10-15 2010-04-29 Carl Zeiss Smt Ag EUV-Lithographievorrichtung und Verfahren zum Bearbeiten einer Maske
JP5395405B2 (ja) * 2008-10-27 2014-01-22 東京エレクトロン株式会社 基板洗浄方法及び装置
US9399143B2 (en) * 2008-10-31 2016-07-26 Medtronic, Inc. Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same
JP5518598B2 (ja) * 2010-07-02 2014-06-11 東京エレクトロン株式会社 パーティクル分布解析支援方法及びその方法を実施するためのプログラムを記録した記録媒体
JP6255152B2 (ja) * 2012-07-24 2017-12-27 株式会社日立ハイテクノロジーズ 検査装置
CN111736425B (zh) * 2020-06-15 2021-08-31 上海集成电路研发中心有限公司 一种光掩模板保护装置
KR102458561B1 (ko) * 2020-11-28 2022-10-25 주식회사 테크네스트 웨이퍼 엣지 파티클 제거 장치

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WO1998054632A2 (en) * 1997-05-29 1998-12-03 Castrucci Paul P Semiconductor wafer processing with defect eradication

Also Published As

Publication number Publication date
US6566169B1 (en) 2003-05-20
WO2000038935A1 (en) 2000-07-06
KR20010099947A (ko) 2001-11-09
EP1152906A1 (en) 2001-11-14
EP1152906A4 (en) 2007-10-17
JP2002533946A (ja) 2002-10-08
AU1795300A (en) 2000-07-31

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