IL122250A - Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof - Google Patents

Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof

Info

Publication number
IL122250A
IL122250A IL12225097A IL12225097A IL122250A IL 122250 A IL122250 A IL 122250A IL 12225097 A IL12225097 A IL 12225097A IL 12225097 A IL12225097 A IL 12225097A IL 122250 A IL122250 A IL 122250A
Authority
IL
Israel
Prior art keywords
amenable
manufacture
assembly
smart card
manufacturing stages
Prior art date
Application number
IL12225097A
Other languages
English (en)
Other versions
IL122250A0 (en
Original Assignee
On Track Innovations Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Track Innovations Ltd filed Critical On Track Innovations Ltd
Priority to IL12225097A priority Critical patent/IL122250A/xx
Publication of IL122250A0 publication Critical patent/IL122250A0/xx
Priority to AU10510/99A priority patent/AU1051099A/en
Priority to US09/554,734 priority patent/US6719206B1/en
Priority to CA002310680A priority patent/CA2310680A1/fr
Priority to EP98952996A priority patent/EP1036373A4/fr
Priority to PCT/IL1998/000543 priority patent/WO1999026197A1/fr
Publication of IL122250A publication Critical patent/IL122250A/xx

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
IL12225097A 1997-11-19 1997-11-19 Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof IL122250A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IL12225097A IL122250A (en) 1997-11-19 1997-11-19 Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
AU10510/99A AU1051099A (en) 1997-11-19 1998-11-09 Data transaction card and method of manufacture thereof
US09/554,734 US6719206B1 (en) 1997-11-19 1998-11-09 Data transaction card and method of manufacture thereof
CA002310680A CA2310680A1 (fr) 1997-11-19 1998-11-09 Carte de transaction et procede de fabrication associe
EP98952996A EP1036373A4 (fr) 1997-11-19 1998-11-09 Carte de transaction et procede de fabrication associe
PCT/IL1998/000543 WO1999026197A1 (fr) 1997-11-19 1998-11-09 Carte de transaction et procede de fabrication associe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12225097A IL122250A (en) 1997-11-19 1997-11-19 Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof

Publications (2)

Publication Number Publication Date
IL122250A0 IL122250A0 (en) 1998-04-05
IL122250A true IL122250A (en) 2003-07-31

Family

ID=11070865

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12225097A IL122250A (en) 1997-11-19 1997-11-19 Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof

Country Status (6)

Country Link
US (1) US6719206B1 (fr)
EP (1) EP1036373A4 (fr)
AU (1) AU1051099A (fr)
CA (1) CA2310680A1 (fr)
IL (1) IL122250A (fr)
WO (1) WO1999026197A1 (fr)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7334734B2 (en) * 2000-01-27 2008-02-26 Hitachi Maxwell, Ltd. Non-contact IC module
DE10006816C2 (de) * 2000-02-15 2003-03-13 Sokymat Id Component Gmbh Transponder-Vorrichtung zur Identifikation von Objekten gegenüber Einrichtungen
US20020099473A1 (en) * 2000-11-08 2002-07-25 Paul Amadeo Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards
GB2372012A (en) * 2001-01-18 2002-08-14 Pioneer Oriental Engineering L Forming a high frequency contact-less smart card with an antenna coil
GB2371263A (en) * 2001-01-18 2002-07-24 Pioneer Oriental Engineering L Forming a low frequency contact-less smart card with an antenna coil
DE10107179C2 (de) * 2001-02-15 2003-02-27 Infineon Technologies Ag Chipkartenmodul
FR2834103B1 (fr) * 2001-12-20 2004-04-02 Gemplus Card Int Carte a puce a module de surface etendue
US20030218064A1 (en) * 2002-03-12 2003-11-27 Storcard, Inc. Multi-purpose personal portable electronic system
US7028896B2 (en) * 2002-08-22 2006-04-18 Arthur Blank & Company, Inc. Transaction card fabrication control system and method
JP2004118694A (ja) * 2002-09-27 2004-04-15 Toshiba Corp コンビicカードの実装方法
KR20040038134A (ko) * 2002-10-31 2004-05-08 주식회사 쓰리비 시스템 안정된 비접촉 통신수단을 제공하는 콤비형 스마트 카드
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Icカード
DE10303740B4 (de) * 2003-01-30 2006-09-14 Infineon Technologies Flash Gmbh & Co. Kg Sicherheitsspeicherkarte und Herstellungsverfahren
FR2853434B1 (fr) * 2003-04-03 2005-07-01 Oberthur Card Syst Sa Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication
JP2004364199A (ja) * 2003-06-06 2004-12-24 Sony Corp アンテナモジュール及びこれを備えた携帯型通信端末
WO2005069585A1 (fr) * 2004-01-14 2005-07-28 Innovision Research & Technology Plc Appareil a configuration variable
US7376444B2 (en) * 2004-02-27 2008-05-20 Jigatek Corporation Method and apparatus for radio frequency identification
EP1738602A1 (fr) * 2004-04-21 2007-01-03 Telecom Italia S.p.A. Carte d'identification d'abonne realisant une fonctionnalite d'emetteur/recepteur pour des applications a grande distance
JP4359198B2 (ja) * 2004-06-30 2009-11-04 株式会社日立製作所 Icタグ実装基板の製造方法
EP1617353A1 (fr) * 2004-07-13 2006-01-18 Axalto SA Carte mini-plug de type SIM comportant moyen de positionnement amelioré
DE102004034768B4 (de) * 2004-07-19 2007-11-15 Infineon Technologies Ag Identifikations-Datenträger
FR2880160B1 (fr) * 2004-12-28 2007-03-30 K Sa As Module electronique double face pour carte a puce hybride
US20070200684A1 (en) * 2005-05-06 2007-08-30 Colby Steven M RFID Device Configured for Data Entry
US8816826B2 (en) * 2005-05-06 2014-08-26 Steven M. Colby Passive radio frequency data logger
US9524458B2 (en) 2005-02-07 2016-12-20 Mynette Technologies, Inc. Switchable epassport including shielding
US9569777B2 (en) 2005-02-07 2017-02-14 Mynette Technologies, Inc. EPassport including shielding method
US20070200681A1 (en) * 2005-05-06 2007-08-30 Colby Steven M Identity Device Including Switchable RFID Tag
US20070200679A1 (en) * 2005-05-06 2007-08-30 Colby Steven M RFID Device Including Multiple RFID Tags
US20070200682A1 (en) 2005-05-06 2007-08-30 Colby Steven M RFID Device Including Multiple Active Modes
US20060267737A1 (en) * 2005-05-27 2006-11-30 Colby Steven M RF Powered Remote Control
US20070200680A1 (en) * 2005-05-06 2007-08-30 Colby Steven M Transaction Card Including Switchable RFID Tag
JP5430050B2 (ja) 2005-06-24 2014-02-26 フェリカネットワークス株式会社 データ通信システム、icカード機能を実行するデバイス及びその制御方法、並びに情報処理端末
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
US20070087838A1 (en) * 2005-09-12 2007-04-19 Jonathan Bradbury Video game media
US7883420B2 (en) * 2005-09-12 2011-02-08 Mattel, Inc. Video game systems
WO2007102360A1 (fr) * 2006-03-06 2007-09-13 Mitsubishi Electric Corporation Etiquette rfid, procede de fabrication d'etiquette rfid et procede de mise en place d'etiquette rfid
FR2915010B1 (fr) * 2007-04-16 2009-06-05 Smart Packaging Solutions Sps Module microelectronique a double interface de communication notamment pour carte a puce.
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090128332A1 (en) * 2007-11-15 2009-05-21 Claridy Solutions, Inc. Rfid-enabled hologram laser tag
FR2932910B1 (fr) * 2008-06-20 2011-02-11 Smart Packaging Solutions Sps Carte sans contact avec logo securitaire
US20100078485A1 (en) * 2008-09-29 2010-04-01 Dynacard Co., Ltd. Subscriber identity module card
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
US20100102131A1 (en) * 2008-10-28 2010-04-29 First Data Corporation Systems and Methods for Disabling a Contactless Transaction Device
US8550361B2 (en) * 2008-10-28 2013-10-08 First Data Corporation Systems, methods, and apparatus to facilitate locating a user of a transaction device
US20100102123A1 (en) * 2008-10-28 2010-04-29 First Data Corporation Systems, Methods, and Apparatus for Facilitating Access to Medical Information
US10803515B2 (en) * 2008-10-31 2020-10-13 First Data Corporation Systems, methods, and apparatus for using a contactless transaction device reader with a computing system
FR2940556B1 (fr) * 2008-12-23 2011-03-18 Oberthur Technologies Carte a microcircuit et terminal mobile comprenant une telle carte.
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
WO2011063270A1 (fr) 2009-11-19 2011-05-26 Cubic Corporation Antennes enroulées sur mandrin à pas variable, et systèmes et procédés de réalisation
JP5672067B2 (ja) 2010-03-09 2015-02-18 株式会社リコー 可逆性感熱記録媒体の製造方法及び製造装置、並びに可逆性感熱記録媒体
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
WO2012020073A2 (fr) 2010-08-12 2012-02-16 Féinics Amatech Teoranta Limited Modules d'antenne rfid et amélioration de couplage
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
DE102010036057A1 (de) 2010-09-01 2012-03-01 Giesecke & Devrient Gmbh Chipmodul mit Kennzeichnung
FR2964487B1 (fr) * 2010-09-02 2013-07-12 Oberthur Technologies Carte a microcircuit comprenant un moyen lumineux
EP2426627B1 (fr) * 2010-09-02 2016-10-12 Oberthur Technologies Module lumineux pour dispositif à microcircuit
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
JP5614335B2 (ja) * 2011-03-01 2014-10-29 株式会社リコー Rfidタグ及びrfidタグを搭載した電子機器
BR112014003130A2 (pt) 2011-08-08 2017-06-06 Féinics Amatech Teoranta aperfeiçoamentos de acoplamento em e para cartões inteligentes rfid
AU2012293707A1 (en) 2011-08-08 2014-02-20 Feinics Amatech Teoranta Improving coupling in and to RFID smart cards
KR20140071423A (ko) 2011-09-11 2014-06-11 페이닉스 아마테크 테오란타 Rfid 안테나 모듈 및 그 제조 방법
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD691610S1 (en) * 2011-11-07 2013-10-15 Blackberry Limited Device smart card
CN104137335A (zh) 2012-02-05 2014-11-05 菲尼克斯阿美特克有限公司 Rfid天线模块和方法
CN103999287B (zh) * 2012-09-18 2016-11-16 松下知识产权经营株式会社 天线、发送装置、接收装置、三维集成电路及非接触通信系统
DE102012018928A1 (de) * 2012-09-25 2014-03-27 Infineon Technologies Ag Halbleitergehäuse für Chipkarten
EP2722795A1 (fr) * 2012-10-19 2014-04-23 Gemalto SA Procédé de fabrication d'un dispositif multi-composants comprenant un module électrique et/ou électronique
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
US8763912B1 (en) * 2013-03-29 2014-07-01 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module
CN203279336U (zh) * 2013-04-27 2013-11-06 中兴通讯股份有限公司 一种内散热的终端
JP6090006B2 (ja) 2013-06-25 2017-03-08 凸版印刷株式会社 Icモジュール、デュアルicカードおよびicモジュールの製造方法
CN104361386B (zh) * 2014-11-06 2016-05-18 北京豹驰智能科技有限公司 一种多层布线式耦合式双界面卡载带模块
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
FR3047101B1 (fr) 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532508A (en) * 1983-04-01 1985-07-30 Siemens Corporate Research & Support, Inc. Personal authentication system
DE3935364C1 (fr) 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De
NL9200835A (nl) 1992-05-11 1993-12-01 Nedap Nv Flexibele spoelconstructie in identificatiekaart.
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19516227C2 (de) 1995-05-03 2002-02-07 Infineon Technologies Ag Datenträgeranordnung, insbesondere Chipkarte
US5757521A (en) * 1995-05-11 1998-05-26 Advanced Deposition Technologies, Inc. Pattern metallized optical varying security devices
DE19530608A1 (de) * 1995-08-21 1997-02-27 Orga Kartensysteme Gmbh Sicherheitschipkarte
FR2738370B1 (fr) 1995-09-06 1997-11-07 France Telecom Installation pour l'echange d'informations a distance entre un objet portatif passif et une station, objet et station correspondants
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
JP2000514581A (ja) * 1996-07-15 2000-10-31 オーストリア カード プラスティッカルテン ウント アウスヴァイスジステーム ゲゼルシャフト ミット ベシュレンクテル ハフツング モジュール及びホログラムを有しているデータキャリヤ
KR20000049028A (ko) * 1996-10-09 2000-07-25 피에이브이 카드 게엠베하 칩카드 제조방법과 칩카드제조용 접속장치
IL119943A (en) 1996-12-31 2000-11-21 On Track Innovations Ltd Contact/contactless data transaction card
DE19701167A1 (de) * 1997-01-15 1998-07-23 Siemens Ag Chipkarte
WO1998059318A1 (fr) * 1997-06-23 1998-12-30 Rohm Co., Ltd. Module pour circuit integre et carte a circuit integre
WO1999026195A1 (fr) * 1997-11-14 1999-05-27 Toppan Printing Co., Ltd. Module ci composite et carte ci composite

Also Published As

Publication number Publication date
WO1999026197A1 (fr) 1999-05-27
IL122250A0 (en) 1998-04-05
US6719206B1 (en) 2004-04-13
EP1036373A1 (fr) 2000-09-20
AU1051099A (en) 1999-06-07
CA2310680A1 (fr) 1999-05-27
EP1036373A4 (fr) 2002-11-06

Similar Documents

Publication Publication Date Title
IL122250A0 (en) Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
US5475919B1 (en) Pcmcia card manufacturing process
EP0680099A3 (fr) Cellule solaire et méthode de fabrication.
SG70657A1 (en) A production method of acrylic acid
PL338560A1 (en) Method of manufacturing a relatively soft product and product itself obtained thereby
GB9822007D0 (en) Waterproof connector and manufacturing method thereof
ZA965741B (en) A method of manufacturing fastener-device elements and elements manufactured in accordance with the method
ZA949753B (en) Method of manufacturing a grounding connector and improved grounding connector.
PL332381A1 (en) Glass-furnace and production plant incorporating same
GB2325066B (en) Method of manufacturing dies
ZA9811568B (en) Production of syringyl lignin in gymnosperms
GB2308505B (en) IC card and manufacturing method thereof
IL117296A (en) Antenna antenna assembly and a method of manufacturing same
HK1020923A1 (en) Method of manufacturing a transparent spherical-object and a transparent spherical-object obtained with this method.
SG66485A1 (en) Manufacturing method for a batch of laminated cells and laminated cells thereby obtained
SG77268A1 (en) Method for manufacturing a clockwork wheel and a clockwork wheel manufactured according to such method
GB9422793D0 (en) Method of manufacturing a smartcard
GB9705533D0 (en) Decorative panels, and methods of manufacturing them
ZA98444B (en) Process for manufacturing a thermobonding interlining and thermobonding interlining obtained
GB9814953D0 (en) Preform and production method therefor
EP0692771A3 (fr) Carte mémoire et méthode de fabrication
GB9313757D0 (en) A method of manufacturing a card
GB9321181D0 (en) A method of manufacturing a bearing assembly and a bearing assembly
ZA989595B (en) Building and method of manufacturing a building
GB9705419D0 (en) Medallion and method of manufacturing a medallion

Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees