IE41859L - Electrodeposition of gold - Google Patents

Electrodeposition of gold

Info

Publication number
IE41859L
IE41859L IE752018A IE201875A IE41859L IE 41859 L IE41859 L IE 41859L IE 752018 A IE752018 A IE 752018A IE 201875 A IE201875 A IE 201875A IE 41859 L IE41859 L IE 41859L
Authority
IE
Ireland
Prior art keywords
gold
electrodeposition
bath
gb1526215a
thiosulphato
Prior art date
Application number
IE752018A
Other versions
IE41859B1 (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of IE41859L publication Critical patent/IE41859L/en
Publication of IE41859B1 publication Critical patent/IE41859B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The bath is free of cyanide and contains the gold in the form of a thiosulphato complex. In this bath, gold is electrodeposited as a levelling, non-porous layer at pH values between 4 and 13 and at temperatures between 10 and 80 DEG C with a current between 0.1 and 2 A/dm<2> onto a suitable substrate. [GB1526215A]
IE2018/75A 1974-09-20 1975-09-16 Improvements in or relating to the electrodeposition of gold IE41859B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742445537 DE2445537A1 (en) 1974-09-20 1974-09-20 BATH FOR GALVANIC DEPOSITION OF GOLD

Publications (2)

Publication Number Publication Date
IE41859L true IE41859L (en) 1976-03-20
IE41859B1 IE41859B1 (en) 1980-04-09

Family

ID=5926580

Family Applications (1)

Application Number Title Priority Date Filing Date
IE2018/75A IE41859B1 (en) 1974-09-20 1975-09-16 Improvements in or relating to the electrodeposition of gold

Country Status (21)

Country Link
JP (1) JPS5147539A (en)
AR (1) AR206828A1 (en)
AT (1) AT335813B (en)
BR (1) BR7505838A (en)
CA (1) CA1053174A (en)
CH (1) CH614240A5 (en)
CS (1) CS181784B2 (en)
DD (1) DD118124A5 (en)
DE (1) DE2445537A1 (en)
ES (1) ES438407A1 (en)
FR (1) FR2285473A1 (en)
GB (1) GB1526215A (en)
HU (1) HU172424B (en)
IE (1) IE41859B1 (en)
IT (1) IT1042698B (en)
NL (1) NL7511062A (en)
RO (1) RO69581A (en)
SE (1) SE408436B (en)
SU (1) SU923375A3 (en)
YU (1) YU36050B (en)
ZA (1) ZA755978B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845026B2 (en) * 1979-05-29 1983-10-06 松下電器産業株式会社 electrophotographic equipment
JPS55157773A (en) * 1979-05-29 1980-12-08 Matsushita Electric Ind Co Ltd Toner recovery device
DE4226167C2 (en) * 1992-08-07 1996-10-24 Sel Alcatel Ag Method for electrically conductive connection using flip-chip technology
DE19546325C1 (en) * 1995-12-12 1997-06-05 Benckiser Knapsack Ladenburg Process for coloring ceramic surfaces
CN100412236C (en) 2002-03-13 2008-08-20 三菱化学株式会社 Gold plating solution and gold plating method
CN108441901A (en) * 2018-04-18 2018-08-24 中国工程物理研究院激光聚变研究中心 A kind of gold-plating solution of no cyanogen organic solvent
EP4245893A1 (en) 2022-03-15 2023-09-20 Université de Franche-Comté Gold electroplating solution and its use for electrodepositing gold with an aged appearance
CN115627505B (en) * 2022-12-19 2023-04-28 深圳创智芯联科技股份有限公司 Pulse cyanide-free gold electroplating liquid and electroplating process thereof
CN115821341B (en) * 2023-01-06 2023-04-28 深圳创智芯联科技股份有限公司 Environment-friendly cyanide-free electroplating solution and electroplating process thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513318B2 (en) * 1973-12-27 1980-04-08

Also Published As

Publication number Publication date
RO69581A (en) 1980-08-15
FR2285473B1 (en) 1979-06-22
CA1053174A (en) 1979-04-24
SE408436B (en) 1979-06-11
NL7511062A (en) 1976-03-23
GB1526215A (en) 1978-09-27
ZA755978B (en) 1976-08-25
JPS5147539A (en) 1976-04-23
IT1042698B (en) 1980-01-30
YU36050B (en) 1981-11-13
DE2445537A1 (en) 1976-04-08
CS181784B2 (en) 1978-03-31
CH614240A5 (en) 1979-11-15
AR206828A1 (en) 1976-08-23
DD118124A5 (en) 1976-02-12
AT335813B (en) 1977-04-12
IE41859B1 (en) 1980-04-09
SU923375A3 (en) 1982-04-23
SE7510455L (en) 1976-03-22
BR7505838A (en) 1976-08-03
ES438407A1 (en) 1977-02-01
AU8506575A (en) 1977-03-31
FR2285473A1 (en) 1976-04-16
YU106175A (en) 1981-04-30
ATA722575A (en) 1976-07-15
HU172424B (en) 1978-08-28

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