IE34219B1 - Stabilized nickel plating compositions - Google Patents

Stabilized nickel plating compositions

Info

Publication number
IE34219B1
IE34219B1 IE670/70A IE67070A IE34219B1 IE 34219 B1 IE34219 B1 IE 34219B1 IE 670/70 A IE670/70 A IE 670/70A IE 67070 A IE67070 A IE 67070A IE 34219 B1 IE34219 B1 IE 34219B1
Authority
IE
Ireland
Prior art keywords
nickel plating
plating compositions
stabilized nickel
stabilized
compositions
Prior art date
Application number
IE670/70A
Other languages
English (en)
Other versions
IE34219L (en
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691926100 external-priority patent/DE1926100C3/de
Application filed by Schering Ag filed Critical Schering Ag
Publication of IE34219L publication Critical patent/IE34219L/xx
Publication of IE34219B1 publication Critical patent/IE34219B1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IE670/70A 1969-05-22 1970-05-21 Stabilized nickel plating compositions IE34219B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691926100 DE1926100C3 (de) 1969-05-22 Stabilisiertes reduktives Nickelbad

Publications (2)

Publication Number Publication Date
IE34219L IE34219L (en) 1970-11-22
IE34219B1 true IE34219B1 (en) 1975-03-05

Family

ID=5734868

Family Applications (1)

Application Number Title Priority Date Filing Date
IE670/70A IE34219B1 (en) 1969-05-22 1970-05-21 Stabilized nickel plating compositions

Country Status (10)

Country Link
US (1) US3661596A (de)
JP (1) JPS4943172B1 (de)
AT (1) AT293132B (de)
CH (1) CH533172A (de)
ES (1) ES379897A1 (de)
FR (1) FR2048610A5 (de)
GB (1) GB1315548A (de)
IE (1) IE34219B1 (de)
NL (1) NL165508C (de)
SE (1) SE356764B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889017A (en) * 1971-02-02 1975-06-10 Ppg Industries Inc Chemical filming solution and process for plating therewith
US3915717A (en) * 1973-11-12 1975-10-28 Rca Corp Stabilized autocatalytic metal deposition baths
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
JPS5658321U (de) * 1979-10-09 1981-05-19
US5300330A (en) * 1981-04-01 1994-04-05 Surface Technology, Inc. Stabilized composite electroless plating compositions
US5145517A (en) * 1981-04-01 1992-09-08 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
EP0063946A1 (de) * 1981-04-21 1982-11-03 AMERSHAM INTERNATIONAL plc Diagnose der Nierenfunktion
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
CN106176721B (zh) * 2016-07-14 2021-04-30 深圳福山生物科技有限公司 有机硒化合物的癌症预防和治疗用途
CN106146372B (zh) * 2016-07-14 2019-05-14 深圳福山生物科技有限公司 用于预防和治疗癌症的有机硒化合物
TW201816183A (zh) * 2016-10-14 2018-05-01 日商上村工業股份有限公司 無電解鍍鎳浴

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2929742A (en) * 1957-03-05 1960-03-22 Minjer Clara Hinderina De Electroless deposition of nickel
DE1243493B (de) * 1961-02-04 1967-06-29 Bayer Ag Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction

Also Published As

Publication number Publication date
AT293132B (de) 1971-09-27
US3661596A (en) 1972-05-09
DE1926100A1 (de) 1970-12-03
GB1315548A (en) 1973-05-02
JPS4943172B1 (de) 1974-11-19
NL165508C (nl) 1981-04-15
CH533172A (de) 1973-01-31
DE1926100B2 (de) 1977-04-28
FR2048610A5 (de) 1971-03-19
NL7007482A (de) 1970-11-24
SE356764B (de) 1973-06-04
SU381231A3 (de) 1973-05-15
ES379897A1 (es) 1972-09-01
IE34219L (en) 1970-11-22
NL165508B (nl) 1980-11-17

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