HUT34644A - Method for coating silicon chip with mechanical strength metal layer by chemicla reduction
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Method for coating silicon chip with mechanical strength metal layer by chemicla reduction
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HUT34644A
HUT34644AHU270883AHU270883AHUT34644AHU T34644 AHUT34644 AHU T34644AHU 270883 AHU270883 AHU 270883AHU 270883 AHU270883 AHU 270883AHU T34644 AHUT34644 AHU T34644A
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Application filed by Villamos Ipari Kutato IntezetfiledCriticalVillamos Ipari Kutato Intezet
Priority to HU270883ApriorityCriticalpatent/HU188359B/en
Publication of HUT34644ApublicationCriticalpatent/HUT34644A/en
Publication of HU188359BpublicationCriticalpatent/HU188359B/en
Deposition of metal layers of high mechanical strength on the surface of silicon wafers is affected by a chemical radiation process involving (a) deposition of a Ni layer, (e) sintering, and (c) deposited of the metal. - The improvement comprises treating the situated article after step (e) and prior to step (c) by dipping in a 1-2:1 H2O2/H2O soln. rinsing and subjecting to aq. ultrasonic treatment in a cyclic manner of frequencies of 20-40 kHz.
HU270883A1983-07-291983-07-29Method for coating silicon chip with mechanical strength metal layer by chemicla reduction
HU188359B
(en)