HUP0800625A2 - Reducing the helting point of modified moru-hightemperature solder - Google Patents

Reducing the helting point of modified moru-hightemperature solder

Info

Publication number
HUP0800625A2
HUP0800625A2 HU0800625A HUP0800625A HUP0800625A2 HU P0800625 A2 HUP0800625 A2 HU P0800625A2 HU 0800625 A HU0800625 A HU 0800625A HU P0800625 A HUP0800625 A HU P0800625A HU P0800625 A2 HUP0800625 A2 HU P0800625A2
Authority
HU
Hungary
Prior art keywords
moru
hightemperature
solder
modified
reducing
Prior art date
Application number
HU0800625A
Other languages
English (en)
Hungarian (hu)
Inventor
Tanja Dr Eckardt
David Francis Lupton
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of HU0800625D0 publication Critical patent/HU0800625D0/hu
Publication of HUP0800625A2 publication Critical patent/HUP0800625A2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
HU0800625A 2007-10-19 2008-10-16 Reducing the helting point of modified moru-hightemperature solder HUP0800625A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007050487A DE102007050487A1 (de) 2007-10-19 2007-10-19 Zur Schmelzpunktabsenkung modifiziertes MoRu-Hochtemperaturlot

Publications (2)

Publication Number Publication Date
HU0800625D0 HU0800625D0 (en) 2008-12-29
HUP0800625A2 true HUP0800625A2 (en) 2009-05-28

Family

ID=40490052

Family Applications (1)

Application Number Title Priority Date Filing Date
HU0800625A HUP0800625A2 (en) 2007-10-19 2008-10-16 Reducing the helting point of modified moru-hightemperature solder

Country Status (3)

Country Link
BE (1) BE1019089A5 (de)
DE (1) DE102007050487A1 (de)
HU (1) HUP0800625A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3498409A1 (de) 2017-12-12 2019-06-19 Hilti Aktiengesellschaft Meisselndes werkzeug und herstellungsverfahren
CN117564544B (zh) * 2024-01-15 2024-03-26 长春三友汽车部件制造有限公司 一种钨铜钴钼电阻点焊电极材料及其制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2725287A (en) 1952-11-26 1955-11-29 Raytheon Mfg Co Molybdenum solder powder
DE1225023B (de) * 1962-12-17 1966-09-15 Snecma Verfahren zur Herstellung einer Hartloet-verbindung zwischen zwei Graphitteilen oder einem Graphitteil und einem Teil aus schwer schmelzbarem Werkstoff
US3292255A (en) * 1964-06-25 1966-12-20 James C Marshall Brazing alloys for tungsten and molybdenum
IL34931A (en) * 1969-07-28 1973-04-30 Gillette Co Metal articles with protective metal layers and methods and apparatus for their manufacture
NL7300381A (de) * 1973-01-11 1974-07-15
LU76107A1 (de) * 1976-10-29 1978-05-16
JPS57142765A (en) 1981-02-28 1982-09-03 Iwasaki Electric Co Ltd Brazing method for high melting point metal
JPS5816795A (ja) 1981-07-20 1983-01-31 Toho Kinzoku Kk ろう材
JPS58157593A (ja) 1982-03-12 1983-09-19 Tokyo Tungsten Co Ltd 高融点難溶性金属部品への鑞着方法
JPS58157549A (ja) * 1982-03-16 1983-09-19 ウラジミ−ル・ニコラエウイツチ・ミロフ 中空品鋳造用鋳型
JPS58204436A (ja) 1982-05-21 1983-11-29 Hitachi Ltd マグネトロン
JPS601720A (ja) * 1983-06-20 1985-01-07 Hitachi Ltd 電子管陰極構体の製造方法
JPS60115395A (ja) 1983-11-28 1985-06-21 Tokyo Tungsten Co Ltd 難溶性金属と黒鉛のろう接用金属材料
JPH01109633A (ja) * 1987-10-23 1989-04-26 Hitachi Ltd 含浸形陰極構体
JP3783975B2 (ja) * 1996-08-23 2006-06-07 株式会社アライドマテリアル ろう接方法
JP3727914B2 (ja) * 1996-11-20 2005-12-21 株式会社東芝 反強磁性体膜とそれを用いた磁気抵抗効果素子および磁気装置
JPH10244363A (ja) * 1997-03-03 1998-09-14 Tokyo Tungsten Co Ltd 高融点金属ろう接円筒形状部材及びその製造方法
JP3309309B2 (ja) * 1998-01-26 2002-07-29 株式会社アライドマテリアル ろう接電極用部品及び放電灯用ろう接電極
DE10336087A1 (de) 2003-08-06 2005-03-03 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektrodensystem mit neuartiger Verbindung, zugehörige Lampe mit dieser Folie und Verfahren zur Herstellung der Verbindung
DE102005030113A1 (de) 2005-06-28 2007-01-25 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Elektrodensystem für eine Lampe
DE102005053553A1 (de) 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel

Also Published As

Publication number Publication date
HU0800625D0 (en) 2008-12-29
BE1019089A5 (fr) 2012-03-06
DE102007050487A1 (de) 2009-04-30

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Legal Events

Date Code Title Description
GB9A Succession in title

Owner name: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG, DE

Free format text: FORMER OWNER(S): W.C. HERAEUS GMBH, DE

FD9A Lapse of provisional protection due to non-payment of fees