HUP0201029A2 - Félvezető-hűtő szerelési eljárás - Google Patents
Félvezető-hűtő szerelési eljárás Download PDFInfo
- Publication number
- HUP0201029A2 HUP0201029A2 HU0201029A HUP0201029A HUP0201029A2 HU P0201029 A2 HUP0201029 A2 HU P0201029A2 HU 0201029 A HU0201029 A HU 0201029A HU P0201029 A HUP0201029 A HU P0201029A HU P0201029 A2 HUP0201029 A2 HU P0201029A2
- Authority
- HU
- Hungary
- Prior art keywords
- semiconductor
- soldering
- soldered
- shows
- carrier
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 17
- 238000001816 cooling Methods 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000002513 implantation Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HU0201029A HUP0201029A2 (hu) | 2002-03-20 | 2002-03-20 | Félvezető-hűtő szerelési eljárás |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| HU0201029A HUP0201029A2 (hu) | 2002-03-20 | 2002-03-20 | Félvezető-hűtő szerelési eljárás |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HU0201029D0 HU0201029D0 (cg-RX-API-DMAC7.html) | 2002-05-29 |
| HUP0201029A2 true HUP0201029A2 (hu) | 2004-05-28 |
Family
ID=89980277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HU0201029A HUP0201029A2 (hu) | 2002-03-20 | 2002-03-20 | Félvezető-hűtő szerelési eljárás |
Country Status (1)
| Country | Link |
|---|---|
| HU (1) | HUP0201029A2 (cg-RX-API-DMAC7.html) |
-
2002
- 2002-03-20 HU HU0201029A patent/HUP0201029A2/hu unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HU0201029D0 (cg-RX-API-DMAC7.html) | 2002-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5311395A (en) | Surface mount heat sink | |
| Scrantom et al. | LTCC technology: where we are and where we're going. II | |
| US8524531B2 (en) | System and method for improving solder joint reliability in an integrated circuit package | |
| WO1999021402A1 (en) | Heat sink mounting assembly for surface mount electronic device packages | |
| US20090199400A1 (en) | Electronic apparatus and method of manufacturing the same | |
| DE4220966A1 (de) | Verfahren zum Herstellen einer Trägerplatte für elektrische Bauteile | |
| US6414246B1 (en) | Printed circuit board (PCB) | |
| HUP0201029A2 (hu) | Félvezető-hűtő szerelési eljárás | |
| GB2345576A (en) | Heat-sink of ICs and method of mounting to PCBs | |
| US20040031588A1 (en) | Heat sink and method of removing heat from power electronics components | |
| US20070089903A1 (en) | Printed circuit board | |
| KR200143231Y1 (ko) | 전자부품용 방열판의 기판 결합구조 | |
| CN1533605A (zh) | 免焊接印刷电路板组合 | |
| JP2000244080A (ja) | プリント配線板 | |
| JPH04243187A (ja) | プリント基板 | |
| JP2017162846A (ja) | 回路モジュール及び回路モジュールの製造方法 | |
| KR200224156Y1 (ko) | 인쇄회로기판의 표면실장구조 | |
| JPH03145193A (ja) | 混成集積回路装置の製造方法 | |
| JP4654394B2 (ja) | 電子機器の製造方法及び電子回路基板 | |
| JP4654394B6 (ja) | 電子機器の製造方法及び電子回路基板 | |
| JP2025157741A (ja) | 配線基板の放熱構造、電源装置及び電源装置の製造方法 | |
| JPH0536302Y2 (cg-RX-API-DMAC7.html) | ||
| JPH04167378A (ja) | モールドパワーモジュールの製造方法 | |
| EP2239767A1 (en) | Package for a semiconductor die and method of making the same | |
| JPH07273449A (ja) | 長穴スルーホールの製造方法 |