HUE058087T2 - Hûtõtönk, hûtõtönkkel ellátott ipari elektronikai egység, és eljárás ipari elektronikai egység összeszerelésére - Google Patents
Hûtõtönk, hûtõtönkkel ellátott ipari elektronikai egység, és eljárás ipari elektronikai egység összeszereléséreInfo
- Publication number
- HUE058087T2 HUE058087T2 HUE16206002A HUE16206002A HUE058087T2 HU E058087 T2 HUE058087 T2 HU E058087T2 HU E16206002 A HUE16206002 A HU E16206002A HU E16206002 A HUE16206002 A HU E16206002A HU E058087 T2 HUE058087 T2 HU E058087T2
- Authority
- HU
- Hungary
- Prior art keywords
- heat sink
- power electronics
- electronics unit
- assembling
- unit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16206002.4A EP3340292B1 (en) | 2016-12-21 | 2016-12-21 | Heat sink, power electronics unit comprising the heat sink and method for assembling the power electronics unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HUE058087T2 true HUE058087T2 (hu) | 2022-07-28 |
Family
ID=57708386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HUE16206002A HUE058087T2 (hu) | 2016-12-21 | 2016-12-21 | Hûtõtönk, hûtõtönkkel ellátott ipari elektronikai egység, és eljárás ipari elektronikai egység összeszerelésére |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP3340292B1 (hu) |
| HU (1) | HUE058087T2 (hu) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021211246A1 (de) | 2021-10-06 | 2023-04-06 | Volkswagen Aktiengesellschaft | Kühlkörper zur Kühlung elektronischer Komponenten eines elektrifizierten Kraftfahrzeugantriebs |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3762738B2 (ja) * | 2002-10-31 | 2006-04-05 | 三菱電機株式会社 | 車載電子機器の筐体構造 |
| JP2005142520A (ja) * | 2003-10-14 | 2005-06-02 | Sumitomo Electric Ind Ltd | パワーモジュール |
| JP4580997B2 (ja) * | 2008-03-11 | 2010-11-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP2009283656A (ja) * | 2008-05-22 | 2009-12-03 | Denso Corp | 半導体装置およびその製造方法 |
| JP2010109016A (ja) * | 2008-10-28 | 2010-05-13 | Toyota Industries Corp | 冷却器 |
| JP2015231042A (ja) * | 2014-06-09 | 2015-12-21 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
-
2016
- 2016-12-21 EP EP16206002.4A patent/EP3340292B1/en active Active
- 2016-12-21 HU HUE16206002A patent/HUE058087T2/hu unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3340292B1 (en) | 2022-02-09 |
| EP3340292A1 (en) | 2018-06-27 |
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