HUE044849T2 - Optikai mérõrendszer félvezetõ munkadarab minta spektrális leképezésére - Google Patents

Optikai mérõrendszer félvezetõ munkadarab minta spektrális leképezésére

Info

Publication number
HUE044849T2
HUE044849T2 HUE14800193A HUE044849T2 HU E044849 T2 HUE044849 T2 HU E044849T2 HU E14800193 A HUE14800193 A HU E14800193A HU E044849 T2 HUE044849 T2 HU E044849T2
Authority
HU
Hungary
Prior art keywords
metrology system
spectral imaging
optical metrology
semiconductor workpiece
workpiece sample
Prior art date
Application number
Other languages
English (en)
Inventor
Andrzej Buczkowski
Original Assignee
Nanometrics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanometrics Inc filed Critical Nanometrics Inc
Publication of HUE044849T2 publication Critical patent/HUE044849T2/hu

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6489—Photoluminescence of semiconductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/6456—Spatial resolved fluorescence measurements; Imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N2021/4735—Solid samples, e.g. paper, glass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/6456—Spatial resolved fluorescence measurements; Imaging
    • G01N2021/646—Detecting fluorescent inhomogeneities at a position, e.g. for detecting defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/105—Purely optical scan
    • G01N2201/1053—System of scan mirrors for composite motion of beam
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
    • H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
    • H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
    • H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
    • H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor

Landscapes

  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
HUE14800193 2013-11-26 2014-10-29 Optikai mérõrendszer félvezetõ munkadarab minta spektrális leképezésére HUE044849T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/091,199 US9182351B2 (en) 2013-11-26 2013-11-26 Optical metrology system for spectral imaging of a sample

Publications (1)

Publication Number Publication Date
HUE044849T2 true HUE044849T2 (hu) 2019-11-28

Family

ID=51932583

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14800193 HUE044849T2 (hu) 2013-11-26 2014-10-29 Optikai mérõrendszer félvezetõ munkadarab minta spektrális leképezésére

Country Status (5)

Country Link
US (2) US9182351B2 (hu)
EP (1) EP3074755B1 (hu)
HU (1) HUE044849T2 (hu)
TW (2) TWI604185B (hu)
WO (1) WO2015080827A1 (hu)

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US9685906B2 (en) 2013-07-03 2017-06-20 Semilab SDI LLC Photoluminescence mapping of passivation defects for silicon photovoltaics
US9846122B2 (en) * 2013-11-26 2017-12-19 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
JP6479407B2 (ja) * 2014-10-20 2019-03-06 株式会社ニューフレアテクノロジー 放射温度計及び温度測定方法
US9859138B2 (en) * 2014-10-20 2018-01-02 Lam Research Corporation Integrated substrate defect detection using precision coating
JP6758197B2 (ja) * 2015-01-28 2020-09-23 東レエンジニアリング株式会社 ワイドギャップ半導体基板の欠陥検査方法及び欠陥検査装置
US10883941B2 (en) * 2015-05-04 2021-01-05 Semilab Semiconductor Physics Laboratory Co., Ltd. Micro photoluminescence imaging
US10012593B2 (en) * 2015-05-04 2018-07-03 Semilab Semiconductor Physics Laboratory Co., Ltd. Micro photoluminescence imaging
US10018565B2 (en) 2015-05-04 2018-07-10 Semilab Semiconductor Physics Laboratory Co., Ltd. Micro photoluminescence imaging with optical filtering
EP3113215A1 (en) * 2015-06-30 2017-01-04 IMEC vzw Method and device for inspection of a semiconductor device
US10132612B2 (en) * 2015-07-30 2018-11-20 Hseb Dresden Gmbh Method and assembly for determining the thickness of a layer in a sample stack
TWI735471B (zh) * 2015-10-09 2021-08-11 美商勝米磊Ｓｄｉ有限責任公司 用於識別在晶圓之單晶矽中的局部結晶缺陷之系統及方法
EP3165903B1 (en) * 2015-11-09 2018-12-26 Nanometrics Incorporated Optical metrology system for spectral imaging of a sample
WO2018017897A1 (en) * 2016-07-20 2018-01-25 Mura Inc. Systems and methods for 3d surface measurements
US10908127B2 (en) * 2017-07-14 2021-02-02 Illinois Tool Works Inc. Testing apparatus and handles for testing apparatus
NO346147B1 (en) * 2017-11-09 2022-03-21 Spinchip Diagnostics As Method and apparatus for controlling a focus point of stationary beam focusing on a sample in a rotating cartridge placed in a rotating disc
US11249032B2 (en) * 2017-11-15 2022-02-15 Corning Incorporated Methods and apparatus for detecting surface defects on glass sheets
US11441893B2 (en) * 2018-04-27 2022-09-13 Kla Corporation Multi-spot analysis system with multiple optical probes
CN109387522A (zh) * 2018-10-18 2019-02-26 无锡小班科技有限公司 小型视觉检测机
US20200158632A1 (en) * 2018-11-19 2020-05-21 Luminit Llc Test System for a Holographic Optical Element
US10761032B1 (en) 2019-02-26 2020-09-01 Bwxt Nuclear Operations Group, Inc. Apparatus and method for inspection of a film on a substrate

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GB9618897D0 (en) 1996-09-10 1996-10-23 Bio Rad Micromeasurements Ltd Micro defects in silicon wafers
US6587193B1 (en) 1999-05-11 2003-07-01 Applied Materials, Inc. Inspection systems performing two-dimensional imaging with line light spot
US20070008525A1 (en) 1999-07-19 2007-01-11 David Tuschel Method for Raman imaging of semiconductor materials
GB0107618D0 (en) 2001-03-27 2001-05-16 Aoti Operating Co Inc Detection and classification of micro-defects in semi-conductors
US7149366B1 (en) 2001-09-12 2006-12-12 Flight Landata, Inc. High-definition hyperspectral imaging system
US7012695B2 (en) 2003-07-18 2006-03-14 Chemimage Corporation Method and apparatus for multiwavelength imaging spectrometer
WO2006014494A2 (en) * 2004-07-07 2006-02-09 Corcoran Timothy C Multiple-label fluorescence imaging using excitation-emission matrices
DE102007056944B4 (de) 2007-11-25 2011-02-24 Thomas Wolff Lumineszenz-Messgerät zur ortsaufgelösten Messung von Halbleiterproben
CN102473663B (zh) 2009-07-22 2016-11-09 克拉-坦科股份有限公司 用环形照射的暗场检查系统
US8330946B2 (en) 2009-12-15 2012-12-11 Nanometrics Incorporated Silicon filter for photoluminescence metrology
TWI522609B (zh) 2010-01-04 2016-02-21 Ｂｔ映像私人有限公司 用於分析半導體的方法與系統以及執行該方法與操作該系統的製造物件
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Also Published As

Publication number Publication date
TWI604185B (zh) 2017-11-01
US20160116411A1 (en) 2016-04-28
TW201527740A (zh) 2015-07-16
EP3074755A1 (en) 2016-10-05
TWI606233B (zh) 2017-11-21
US9182351B2 (en) 2015-11-10
TW201627652A (zh) 2016-08-01
EP3074755B1 (en) 2019-04-17
WO2015080827A1 (en) 2015-06-04
US20150146193A1 (en) 2015-05-28

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