HUE043119T2 - Eljárás fém/kerámia kötést tartalmazó hordozó elõállítására - Google Patents
Eljárás fém/kerámia kötést tartalmazó hordozó elõállításáraInfo
- Publication number
- HUE043119T2 HUE043119T2 HUE04007068A HUE04007068A HUE043119T2 HU E043119 T2 HUE043119 T2 HU E043119T2 HU E04007068 A HUE04007068 A HU E04007068A HU E04007068 A HUE04007068 A HU E04007068A HU E043119 T2 HUE043119 T2 HU E043119T2
- Authority
- HU
- Hungary
- Prior art keywords
- bonded substrate
- producing metal
- ceramic bonded
- ceramic
- producing
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
- C04B2237/127—The active component for bonding being a refractory metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003086957 | 2003-03-27 | ||
JP2003183844 | 2003-06-27 | ||
JP2004049135A JP4394477B2 (ja) | 2003-03-27 | 2004-02-25 | 金属−セラミックス接合基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE043119T2 true HUE043119T2 (hu) | 2019-08-28 |
Family
ID=32854121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE04007068A HUE043119T2 (hu) | 2003-03-27 | 2004-03-24 | Eljárás fém/kerámia kötést tartalmazó hordozó elõállítására |
Country Status (4)
Country | Link |
---|---|
US (1) | US7219826B2 (hu) |
EP (1) | EP1465251B1 (hu) |
JP (1) | JP4394477B2 (hu) |
HU (1) | HUE043119T2 (hu) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10144269A1 (de) * | 2001-09-08 | 2003-03-27 | Bosch Gmbh Robert | Sensorelement zur Erfassung einer physikalischen Messgröße zwischen tribologisch hoch beanspruchten Körpern |
JP3863067B2 (ja) * | 2002-06-04 | 2006-12-27 | Dowaホールディングス株式会社 | 金属−セラミックス接合体の製造方法 |
EP1394528A3 (en) * | 2002-08-13 | 2005-11-16 | Csir | A gas borne substance sampling device |
JP4014528B2 (ja) * | 2003-03-28 | 2007-11-28 | 日本碍子株式会社 | ヒートスプレッダモジュールの製造方法及びヒートスプレッダモジュール |
US7776426B2 (en) * | 2005-03-04 | 2010-08-17 | Dowa Metaltech Co., Ltd. | Ceramic circuit substrate and manufacturing method thereof |
JP4930833B2 (ja) * | 2006-12-11 | 2012-05-16 | 日立金属株式会社 | セラミックス回路基板およびその製造方法 |
EP2109138B1 (en) * | 2006-12-26 | 2015-12-23 | Kyocera Corporation | Heat dissipating substrate and electronic device using the same |
DE102007029031A1 (de) * | 2007-06-23 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot |
WO2009008273A1 (ja) * | 2007-07-09 | 2009-01-15 | Sumitomo Metal Mining Co., Ltd. | プリント配線基板の製造方法および該製造方法により得られたプリント配線基板 |
CN101690429B (zh) * | 2007-09-10 | 2013-09-11 | 住友金属矿山株式会社 | 印刷布线基板的制造方法及由该制造方法所得的印刷布线基板 |
DE102009000514A1 (de) | 2009-01-30 | 2010-08-26 | Robert Bosch Gmbh | Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil |
JP5492191B2 (ja) * | 2009-03-30 | 2014-05-14 | 株式会社トクヤマ | メタライズド基板を製造する方法、メタライズド基板 |
JP2011077364A (ja) * | 2009-09-30 | 2011-04-14 | Hitachi Cable Ltd | プリント配線基板の製造方法及びその製造装置 |
US9096471B2 (en) * | 2009-11-27 | 2015-08-04 | Showa Denko K.K. | Method for producing a layered material |
CN102783256B (zh) | 2010-03-02 | 2015-07-01 | 株式会社德山 | 金属化基板的制造方法 |
CN102335793B (zh) * | 2010-07-22 | 2016-11-23 | 江苏道康发电机组有限公司 | 不锈钢与氧化铝陶瓷的连接方法 |
JP5743503B2 (ja) * | 2010-11-29 | 2015-07-01 | 京セラ株式会社 | ろう材およびこれを用いた回路基板ならびに電子装置 |
JP5752504B2 (ja) * | 2011-06-30 | 2015-07-22 | 株式会社トクヤマ | 配線基板のめっき方法、めっき配線基板の製造方法、及び銀エッチング液 |
US10105795B2 (en) * | 2012-05-25 | 2018-10-23 | General Electric Company | Braze compositions, and related devices |
JP6111764B2 (ja) | 2013-03-18 | 2017-04-12 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP5672324B2 (ja) * | 2013-03-18 | 2015-02-18 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
JP6079505B2 (ja) * | 2013-08-26 | 2017-02-15 | 三菱マテリアル株式会社 | 接合体及びパワーモジュール用基板 |
EP3041045B1 (en) * | 2013-08-26 | 2019-09-18 | Mitsubishi Materials Corporation | Bonded body and power module substrate |
PL2916627T3 (pl) | 2013-08-29 | 2019-09-30 | Hitachi Metals, Ltd. | Sposób wytwarzania ceramicznej płytki drukowanej układu elektronicznego |
CN106061923B (zh) * | 2014-02-21 | 2019-07-26 | 电化株式会社 | 陶瓷线路基板 |
JP6256176B2 (ja) * | 2014-04-25 | 2018-01-10 | 三菱マテリアル株式会社 | 接合体の製造方法、パワーモジュール用基板の製造方法 |
JP6400422B2 (ja) * | 2014-10-07 | 2018-10-03 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板およびその製造方法 |
US9548518B2 (en) * | 2014-12-16 | 2017-01-17 | General Electric Company | Methods for joining ceramic and metallic structures |
KR101856106B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856107B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856108B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
KR101856109B1 (ko) * | 2015-04-24 | 2018-05-09 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
CN107889559B (zh) | 2015-04-24 | 2020-04-28 | 阿莫善斯有限公司 | 陶瓷基板的制造方法及由其所制造的陶瓷基板 |
US10872841B2 (en) | 2015-07-09 | 2020-12-22 | Kabushiki Kaisha Toshiba | Ceramic metal circuit board and semiconductor device using the same |
JP6819299B2 (ja) * | 2016-01-22 | 2021-01-27 | 三菱マテリアル株式会社 | 接合体、パワーモジュール用基板、接合体の製造方法及びパワーモジュール用基板の製造方法 |
WO2017126641A1 (ja) * | 2016-01-22 | 2017-07-27 | 三菱マテリアル株式会社 | 接合体、パワーモジュール用基板、接合体の製造方法及びパワーモジュール用基板の製造方法 |
US10252371B2 (en) | 2016-02-12 | 2019-04-09 | The Boeing Company | Diffusion-bonded metallic materials |
US9682445B1 (en) * | 2016-02-12 | 2017-06-20 | The Boeing Company | Diffusion-bonded metallic materials |
JP6646258B2 (ja) * | 2016-02-26 | 2020-02-14 | 住友金属鉱山株式会社 | 積層体のエッチング方法とそれを用いたプリント配線基板の製造方法 |
JP6631333B2 (ja) * | 2016-03-11 | 2020-01-15 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
JP6904094B2 (ja) * | 2016-06-23 | 2021-07-14 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
JP6799479B2 (ja) * | 2017-03-03 | 2020-12-16 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板の製造方法 |
KR102479866B1 (ko) | 2017-05-30 | 2022-12-20 | 덴카 주식회사 | 세라믹스 회로 기판 및 그 제조 방법 |
KR102521140B1 (ko) | 2017-07-25 | 2023-04-12 | 덴카 주식회사 | 세라믹스 회로 기판 및 그 제조 방법 |
CN117062326A (zh) * | 2017-09-12 | 2023-11-14 | 株式会社东芝 | 陶瓷电路基板的制造方法 |
JP2020010004A (ja) * | 2018-07-12 | 2020-01-16 | Koa株式会社 | 抵抗器及び回路基板 |
CN111490018A (zh) * | 2019-01-29 | 2020-08-04 | 瑷司柏电子股份有限公司 | 具有金属导热凸块接垫的陶瓷基板元件、组件及制法 |
CN110248465B (zh) * | 2019-06-20 | 2024-03-19 | 上海铠琪科技有限公司 | 一种厚膜和覆铜一体陶瓷电路板及其制备方法 |
CN111621787B (zh) * | 2020-04-27 | 2022-07-12 | 江苏富乐华半导体科技股份有限公司 | 一种蚀刻液体系及一种氮化铝基板的刻蚀方法 |
DE102021105520B4 (de) | 2021-03-08 | 2022-10-27 | Rogers Germany Gmbh | Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats |
JP2023006077A (ja) * | 2021-06-30 | 2023-01-18 | Dowaメタルテック株式会社 | 金属-セラミックス接合基板およびその製造方法、並びに、ろう材 |
CN114163259B (zh) * | 2021-12-14 | 2023-05-23 | 东莞智昊光电科技有限公司 | 陶瓷表面金属化的方法和金属化陶瓷 |
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JPH0710028B2 (ja) * | 1987-09-22 | 1995-02-01 | 株式会社日立製作所 | プリント板の製造法 |
EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
JP2594475B2 (ja) | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
JPH0736467B2 (ja) * | 1991-07-05 | 1995-04-19 | 電気化学工業株式会社 | セラミックス回路基板の製造法 |
JP3512977B2 (ja) * | 1996-08-27 | 2004-03-31 | 同和鉱業株式会社 | 高信頼性半導体用基板 |
JP3682552B2 (ja) * | 1997-03-12 | 2005-08-10 | 同和鉱業株式会社 | 金属−セラミックス複合基板の製造方法 |
JP2000269615A (ja) * | 1999-03-17 | 2000-09-29 | Denki Kagaku Kogyo Kk | 回路基板 |
JP4334054B2 (ja) * | 1999-03-26 | 2009-09-16 | 株式会社東芝 | セラミックス回路基板 |
JP2000323618A (ja) * | 1999-05-07 | 2000-11-24 | Sumitomo Electric Ind Ltd | 銅回路接合基板及びその製造方法 |
JP3930671B2 (ja) * | 1999-11-08 | 2007-06-13 | Dowaホールディングス株式会社 | 窒化ケイ素回路基板の製造方法 |
WO2001077241A2 (en) * | 2000-04-05 | 2001-10-18 | Applied Materials, Inc. | Composition for metal cmp with low dishing and overpolish insensitivity |
JP4887583B2 (ja) * | 2001-08-09 | 2012-02-29 | Dowaメタルテック株式会社 | セラミックス回路基板の製造方法 |
JP4168114B2 (ja) * | 2001-09-28 | 2008-10-22 | Dowaホールディングス株式会社 | 金属−セラミックス接合体 |
JP4811756B2 (ja) * | 2001-09-28 | 2011-11-09 | Dowaメタルテック株式会社 | 金属−セラミックス接合回路基板の製造方法 |
JP3868854B2 (ja) * | 2002-06-14 | 2007-01-17 | Dowaホールディングス株式会社 | 金属−セラミックス接合体およびその製造方法 |
-
2004
- 2004-02-25 JP JP2004049135A patent/JP4394477B2/ja not_active Expired - Lifetime
- 2004-03-22 US US10/805,768 patent/US7219826B2/en active Active
- 2004-03-24 EP EP04007068.2A patent/EP1465251B1/en not_active Expired - Lifetime
- 2004-03-24 HU HUE04007068A patent/HUE043119T2/hu unknown
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EP1465251A2 (en) | 2004-10-06 |
US20040262367A1 (en) | 2004-12-30 |
US7219826B2 (en) | 2007-05-22 |
JP2005035874A (ja) | 2005-02-10 |
EP1465251B1 (en) | 2019-01-23 |
EP1465251A3 (en) | 2009-09-09 |
JP4394477B2 (ja) | 2010-01-06 |
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