HK83388A - Wave soldering system - Google Patents

Wave soldering system

Info

Publication number
HK83388A
HK83388A HK833/88A HK83388A HK83388A HK 83388 A HK83388 A HK 83388A HK 833/88 A HK833/88 A HK 833/88A HK 83388 A HK83388 A HK 83388A HK 83388 A HK83388 A HK 83388A
Authority
HK
Hong Kong
Prior art keywords
wave soldering
soldering system
wave
soldering
Prior art date
Application number
HK833/88A
Other languages
English (en)
Inventor
Kenneth G Boynton
Harold Terrance O'rourke
Original Assignee
Hollis Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollis Automation Inc filed Critical Hollis Automation Inc
Publication of HK83388A publication Critical patent/HK83388A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
HK833/88A 1977-12-02 1988-10-13 Wave soldering system HK83388A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US85675977A 1977-12-02 1977-12-02
US85676077A 1977-12-02 1977-12-02
US89749278A 1978-04-18 1978-04-18
US89749378A 1978-04-18 1978-04-18

Publications (1)

Publication Number Publication Date
HK83388A true HK83388A (en) 1988-10-21

Family

ID=27505924

Family Applications (1)

Application Number Title Priority Date Filing Date
HK833/88A HK83388A (en) 1977-12-02 1988-10-13 Wave soldering system

Country Status (7)

Country Link
JP (2) JPS5495955A (ja)
DE (1) DE2852132A1 (ja)
FR (1) FR2410938A1 (ja)
GB (2) GB1602779A (ja)
HK (1) HK83388A (ja)
IT (1) IT1107979B (ja)
NL (1) NL184862C (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897894A (ja) * 1981-12-07 1983-06-10 日本電気株式会社 はんだ付け装置
US4451000A (en) * 1982-06-11 1984-05-29 Hollis Engineering, Inc. Soldering apparatus exhaust system
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
GB8331200D0 (en) * 1983-11-23 1983-12-29 Treiber Automation Ltd Solder method and apparatus
FR2572970B1 (fr) * 1984-11-15 1987-02-13 Outillages Scient Lab Dispositif chauffant de generation d'une vague de soudure pour machine de soudage a la vague
DE3539585A1 (de) * 1985-10-11 1987-07-02 Kaspar Eidenberg Verfahren zum verloeten der anschluesse von bauteilen mit den leiterbahnen und loetaugen von leiterplatten und vorrichtung zum durchfuehren dieses verfahrens
JPH039263U (ja) * 1989-06-08 1991-01-29
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
JP2506695Y2 (ja) * 1990-08-04 1996-08-14 三菱電機株式会社 プリント基板冷却装置
DE4416788C2 (de) * 1994-05-06 1999-08-19 Siemens Ag Verfahren zum Wellenlöten von Leiterplatten
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
DE10061032A1 (de) * 2000-12-08 2002-06-27 Messer Griesheim Gmbh Verfahren und Vorrichtung zum Löten elektronischer Bauelemente auf Leiterplatten

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605244A (en) * 1966-04-20 1971-09-20 Electrovert Mfg Co Ltd Soldering methods and apparatus
US3398873A (en) * 1966-09-07 1968-08-27 Hollis Engineering Sumps and nozzles for soldering machines
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3773261A (en) * 1969-06-13 1973-11-20 North American Rockwell Material removing device
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
US3948212A (en) * 1972-03-30 1976-04-06 Robert Bosch G.M.B.H. Coating apparatus
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
JPS5258042A (en) * 1975-11-10 1977-05-13 Hitachi Ltd Dip soldering device

Also Published As

Publication number Publication date
FR2410938B1 (ja) 1984-11-02
DE2852132A1 (de) 1979-06-07
JPS5495955A (en) 1979-07-28
JPS63268563A (ja) 1988-11-07
NL7811803A (nl) 1979-06-06
GB2009012B (en) 1982-10-13
NL184862C (nl) 1989-11-16
IT7852160A0 (it) 1978-12-01
IT1107979B (it) 1985-12-02
GB2009012A (en) 1979-06-13
FR2410938A1 (fr) 1979-06-29
GB1602779A (en) 1981-11-18
DE2852132C2 (ja) 1989-08-10

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Legal Events

Date Code Title Description
PE Patent expired