HK77590A - Flexible tape having bridges of electrically conductive particles extending across its pressure sensitive adhesive layer - Google Patents
Flexible tape having bridges of electrically conductive particles extending across its pressure sensitive adhesive layerInfo
- Publication number
- HK77590A HK77590A HK775/90A HK77590A HK77590A HK 77590 A HK77590 A HK 77590A HK 775/90 A HK775/90 A HK 775/90A HK 77590 A HK77590 A HK 77590A HK 77590 A HK77590 A HK 77590A
- Authority
- HK
- Hong Kong
- Prior art keywords
- bridges
- adhesive layer
- electrically conductive
- sensitive adhesive
- pressure sensitive
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title 1
- 239000010410 layer Substances 0.000 title 1
- 239000002245 particle Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/08—Cable junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/90—Magnetic feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/906—Roll or coil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/646,825 US4548862A (en) | 1984-09-04 | 1984-09-04 | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
Publications (1)
Publication Number | Publication Date |
---|---|
HK77590A true HK77590A (en) | 1990-10-05 |
Family
ID=24594627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK775/90A HK77590A (en) | 1984-09-04 | 1990-09-27 | Flexible tape having bridges of electrically conductive particles extending across its pressure sensitive adhesive layer |
Country Status (11)
Country | Link |
---|---|
US (1) | US4548862A (pt) |
EP (1) | EP0174777B1 (pt) |
JP (1) | JPS6166310A (pt) |
KR (1) | KR930011232B1 (pt) |
AU (1) | AU573363B2 (pt) |
BR (1) | BR8504037A (pt) |
CA (1) | CA1237176A (pt) |
DE (1) | DE3576604D1 (pt) |
ES (2) | ES8700804A1 (pt) |
HK (1) | HK77590A (pt) |
IE (1) | IE58447B1 (pt) |
Families Citing this family (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
US4640981A (en) * | 1984-10-04 | 1987-02-03 | Amp Incorporated | Electrical interconnection means |
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
US4808470A (en) * | 1986-06-06 | 1989-02-28 | Compagnie Internationale De Participation Et D'investissement Cipart S.A. | Heating element and method for the manufacture thereof |
JPS6340216A (ja) * | 1986-08-05 | 1988-02-20 | 住友スリ−エム株式会社 | 導電性テ−プ |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
US4838347A (en) * | 1987-07-02 | 1989-06-13 | American Telephone And Telegraph Company At&T Bell Laboratories | Thermal conductor assembly |
US4960612A (en) * | 1987-07-02 | 1990-10-02 | At&T Bell Laboratories | Thermal conductor assembly method |
US4923739A (en) * | 1987-07-30 | 1990-05-08 | American Telephone And Telegraph Company | Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method |
US4859813A (en) * | 1987-09-04 | 1989-08-22 | Calcomp Inc. | Digitizer tablet having electrical interconnect components on the writing substrate |
US4859189A (en) * | 1987-09-25 | 1989-08-22 | Minnesota Mining And Manufacturing Company | Multipurpose socket |
SE459827B (sv) * | 1987-11-20 | 1989-08-07 | Labino Patent Ab | Tryckkaenslig potentiometer |
AU612771B2 (en) * | 1988-02-26 | 1991-07-18 | Minnesota Mining And Manufacturing Company | Electrically conductive pressure-sensitive adhesive tape |
US4882239A (en) * | 1988-03-08 | 1989-11-21 | Minnesota Mining And Manufacturing Company | Light-rechargeable battery |
US4880599A (en) * | 1988-03-25 | 1989-11-14 | General Electric Company | Method of making a ferrite composite containing silver metallization |
US5246771A (en) * | 1988-04-18 | 1993-09-21 | Teraoka Seisakusho Co., Ltd. | Adhesive tape for preventing implosion and removing electrostatic charge |
US5240761A (en) * | 1988-08-29 | 1993-08-31 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US4931598A (en) * | 1988-12-30 | 1990-06-05 | 3M Company | Electrical connector tape |
US5104210A (en) * | 1989-04-24 | 1992-04-14 | Monsanto Company | Light control films and method of making |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
US5141790A (en) * | 1989-11-20 | 1992-08-25 | Minnesota Mining And Manufacturing Company | Repositionable pressure-sensitive adhesive tape |
US5049085A (en) * | 1989-12-22 | 1991-09-17 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
US5082595A (en) * | 1990-01-31 | 1992-01-21 | Adhesives Research, Inc. | Method of making an electrically conductive pressure sensitive adhesive |
EP0466937B2 (en) * | 1990-02-06 | 1998-03-18 | Sumitomo Bakelite Company Limited | Plastic carrier tape and cover tape for electronic component chip |
TW226406B (pt) * | 1991-04-12 | 1994-07-11 | Minnesota Mining & Mfg | |
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
US5206585A (en) * | 1991-12-02 | 1993-04-27 | At&T Bell Laboratories | Methods for testing integrated circuit devices |
US5221417A (en) * | 1992-02-20 | 1993-06-22 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5453148A (en) * | 1992-04-14 | 1995-09-26 | Industrial Technology Research Institute | Adhesive for connecting a circuit member to a substrate |
US5429701A (en) * | 1992-04-14 | 1995-07-04 | Industrial Technology Research Institute | Method of electrically interconnecting conductors |
WO1993024178A1 (en) * | 1992-06-02 | 1993-12-09 | Alza Corporation | Iontophoretic drug delivery apparatus |
US5308667A (en) * | 1992-10-16 | 1994-05-03 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
US5416622A (en) * | 1993-02-01 | 1995-05-16 | Minnesota Mining And Manufacturing Company | Electrical connector |
US5510174A (en) * | 1993-07-14 | 1996-04-23 | Chomerics, Inc. | Thermally conductive materials containing titanium diboride filler |
US5378405A (en) * | 1993-07-28 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
US5508107A (en) * | 1993-07-28 | 1996-04-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tapes for electronics applications |
US5371326A (en) * | 1993-08-31 | 1994-12-06 | Clearwaters-Dreager; Cindy | Non-toxic fabric conductors and method for making same |
US5981053A (en) * | 1993-10-05 | 1999-11-09 | Sandia Corporation | Tamper resistant magnetic stripes |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
US5683798A (en) * | 1993-11-10 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
US5616670A (en) * | 1993-11-10 | 1997-04-01 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good oily surface adhesion |
US5602221A (en) * | 1993-11-10 | 1997-02-11 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good low energy surface adhesion |
US5654387A (en) * | 1993-11-10 | 1997-08-05 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives |
US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
ATE216122T1 (de) * | 1994-01-27 | 2002-04-15 | Loctite Ireland Ltd | Zusammenstellungen und methoden zur anordnung anisotropisch leitender bahnen und verbindungen zwischen zwei sätzen von leitern |
US5643668A (en) * | 1994-12-30 | 1997-07-01 | Minnesota Mining And Manufacturing Company | Tape for rough surfaces |
EP0802856A2 (en) * | 1995-01-13 | 1997-10-29 | Minnesota Mining And Manufacturing Company | Damped laminates with improved fastener force retention, a method of making, and novel tools useful in making |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
WO1997003143A1 (en) | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US6339875B1 (en) | 1996-04-08 | 2002-01-22 | Heat Technology, Inc. | Method for removing heat from an integrated circuit |
US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
US6977025B2 (en) * | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US5916641A (en) * | 1996-08-01 | 1999-06-29 | Loctite (Ireland) Limited | Method of forming a monolayer of particles |
TW345667B (en) * | 1996-09-09 | 1998-11-21 | Tokiin Corp | High thermal conductivity composite magnetic substance |
US5929138A (en) * | 1996-11-05 | 1999-07-27 | Raychem Corporation | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
US5885708A (en) * | 1997-02-14 | 1999-03-23 | Minnesota Mining And Manufacturing Company | Antistatic latex adhesives |
US5929172A (en) * | 1997-03-20 | 1999-07-27 | Adhesives Research, Inc. | Conductive heterocyclic graft copolymer |
US6088471A (en) * | 1997-05-16 | 2000-07-11 | Authentec, Inc. | Fingerprint sensor including an anisotropic dielectric coating and associated methods |
DE69805300T2 (de) * | 1997-06-12 | 2003-01-23 | Papyron B.V., Groningen | Substrat mit gerichteter leitfähigkeit senkrecht zu seiner oberfläche, vorrichtungen mit einem solchen substrat und verfahren zur herstellung eines solchen substrates |
US6011307A (en) * | 1997-08-12 | 2000-01-04 | Micron Technology, Inc. | Anisotropic conductive interconnect material for electronic devices, method of use and resulting product |
US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
US6096982A (en) * | 1998-02-18 | 2000-08-01 | Nanopierce Technologies, Inc. | Method and apparatus for conductively joining components |
US6218629B1 (en) | 1999-01-20 | 2001-04-17 | International Business Machines Corporation | Module with metal-ion matrix induced dendrites for interconnection |
JP3696429B2 (ja) * | 1999-02-22 | 2005-09-21 | 日本化学工業株式会社 | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
US6524675B1 (en) | 1999-05-13 | 2003-02-25 | 3M Innovative Properties Company | Adhesive-back articles |
JP2000331538A (ja) * | 1999-05-17 | 2000-11-30 | Nitto Denko Corp | 異方導電性フィルムおよびその製造方法 |
DE19924138A1 (de) * | 1999-05-26 | 2000-11-30 | Henkel Kgaa | Lösbare Klebeverbindungen |
DE19951599A1 (de) * | 1999-10-27 | 2001-05-23 | Henkel Kgaa | Verfahren zur adhesiven Trennung von Klebeverbunden |
US6496373B1 (en) | 1999-11-04 | 2002-12-17 | Amerasia International Technology, Inc. | Compressible thermally-conductive interface |
DE10037884A1 (de) * | 2000-08-03 | 2002-02-21 | Henkel Kgaa | Verfahren zur beschleunigten Klebstoffaushärtung |
US6849335B2 (en) * | 2000-08-09 | 2005-02-01 | Jsr Corporation | Anisotropic conductive sheet |
JP2002299378A (ja) * | 2001-03-30 | 2002-10-11 | Lintec Corp | 導電体付接着シート、半導体装置製造方法および半導体装置 |
US6847747B2 (en) * | 2001-04-30 | 2005-01-25 | Intel Corporation | Optical and electrical interconnect |
WO2003075409A1 (fr) * | 2002-03-04 | 2003-09-12 | Sumitomo Electric Industries, Ltd. | Film conducteur anisotrope et procede de production |
US7034403B2 (en) * | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
US7595790B2 (en) * | 2005-01-31 | 2009-09-29 | Panasonic Corporation | Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same |
KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
US7763326B2 (en) * | 2006-12-20 | 2010-07-27 | United Technologies Corporation | Photocurable maskant composition and method of use |
DE112008000326T5 (de) * | 2007-02-06 | 2010-02-11 | World Properties, Inc., Lincolnwood | Leitfähige Polymerschäume, Herstellungsverfahren und Anwendungen derselben |
US8623265B2 (en) | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
WO2009079216A1 (en) * | 2007-12-18 | 2009-06-25 | 3M Innovative Properties Company | Conductive adhesive precursor, method of using the same, and article |
EP2297262B1 (en) * | 2008-07-03 | 2016-12-21 | Henkel IP & Holding GmbH | Silver coated flaky material filled conductive curable composition and the application in die attach |
KR20150129045A (ko) * | 2008-07-18 | 2015-11-18 | 플렉스콘 컴퍼니 인코포레이티드 | 심전도 검출 시스템에서 사용하기 위한 고임피던스 신호 검출 시스템 및 방법 |
CN104127178A (zh) * | 2008-08-06 | 2014-11-05 | 弗莱康股份有限公司 | 用于心电图检测系统的多电极复合系统和方法 |
US20110214735A1 (en) * | 2008-11-07 | 2011-09-08 | 3M Innovative Properities Company | Conductive laminated assembly |
NO333507B1 (no) * | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
JP2013515840A (ja) * | 2009-12-29 | 2013-05-09 | ロジャース コーポレーション | 導電性ポリマーフォーム、その製造方法および使用 |
KR101900961B1 (ko) * | 2010-03-01 | 2018-09-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 거친 표면을 보호하기 위한 반투명 필름 |
US8816807B2 (en) * | 2010-05-21 | 2014-08-26 | Purdue Research Foundation | Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles |
US9061478B2 (en) | 2011-05-18 | 2015-06-23 | 3M Innovative Properties Company | Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom |
US9818499B2 (en) | 2011-10-13 | 2017-11-14 | Flexcon Company, Inc. | Electrically conductive materials formed by electrophoresis |
CN103201352B (zh) | 2011-10-25 | 2014-07-09 | 3M创新有限公司 | 非织造粘合胶带以及由其制得的制品 |
US9041171B2 (en) * | 2011-12-29 | 2015-05-26 | Broadcom Corporation | Programmable interposer with conductive particles |
KR101284212B1 (ko) | 2012-04-27 | 2013-07-09 | 주식회사 아이에스시 | 위치정렬이 용이한 테스트용 소켓 |
KR101339166B1 (ko) | 2012-06-18 | 2013-12-09 | 주식회사 아이에스시 | 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법 |
KR101390706B1 (ko) * | 2012-10-09 | 2014-05-07 | 한국표준과학연구원 | 폴리머 복합체 및 그 제조방법 |
KR20140099716A (ko) * | 2013-02-04 | 2014-08-13 | 삼성전자주식회사 | 센서플랫폼 및 그의 제조 방법 |
US9142475B2 (en) | 2013-08-13 | 2015-09-22 | Intel Corporation | Magnetic contacts |
CN105659375B (zh) | 2014-09-26 | 2021-08-24 | 英特尔公司 | 柔性封装架构 |
CA2968967A1 (en) * | 2014-11-26 | 2016-06-02 | The University Of Akron | Electric field alignment in polymer solutions |
US9911559B2 (en) * | 2016-01-29 | 2018-03-06 | Microsoft Technology Licensing, Llc | Magnetically aligned circuit |
US10058014B1 (en) | 2017-12-13 | 2018-08-21 | International Business Machines Corporation | Conductive adhesive layer for gasket assembly |
US11201104B2 (en) * | 2019-12-30 | 2021-12-14 | Advanced Micro Devices, Inc. | Thermal management using variation of thermal resistance of thermal interface |
EP4125590A1 (en) | 2020-03-25 | 2023-02-08 | Flexcon Company, Inc. | Isotropic non-aqueous electrode sensing material |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3132204A (en) * | 1964-05-05 | Electrically conductive pressure sensitive adhesive tapes | ||
US3359145A (en) * | 1964-12-28 | 1967-12-19 | Monsanto Res Corp | Electrically conducting adhesive |
US3475213A (en) * | 1965-09-13 | 1969-10-28 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
FR1594956A (pt) * | 1968-12-09 | 1970-06-08 | ||
US3762946A (en) * | 1971-10-21 | 1973-10-02 | Minnesota Mining & Mfg | Small particle loaded electrically conductive adhesive tape |
CH553065A (fr) * | 1972-04-26 | 1974-08-30 | Battelle Memorial Institute | Ruban a conductivite electrique anisotrope. |
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
JPS5724456Y2 (pt) * | 1977-09-09 | 1982-05-27 | ||
US4427481A (en) * | 1978-02-27 | 1984-01-24 | R & D Chemical Company | Magnetized hot melt adhesive and method of preparing same |
US4448837A (en) * | 1982-07-19 | 1984-05-15 | Oki Densen Kabushiki Kaisha | Pressure-sensitive conductive elastic sheet |
JPS59101782A (ja) * | 1982-12-01 | 1984-06-12 | 東レ株式会社 | 低抵抗エラスチックコネクターの製造方法 |
-
1984
- 1984-09-04 US US06/646,825 patent/US4548862A/en not_active Expired - Lifetime
-
1985
- 1985-07-09 IE IE172085A patent/IE58447B1/en not_active IP Right Cessation
- 1985-07-17 ES ES545322A patent/ES8700804A1/es not_active Expired
- 1985-07-17 AU AU45086/85A patent/AU573363B2/en not_active Ceased
- 1985-07-17 CA CA000486950A patent/CA1237176A/en not_active Expired
- 1985-08-05 JP JP60171294A patent/JPS6166310A/ja active Pending
- 1985-08-23 BR BR8504037A patent/BR8504037A/pt not_active IP Right Cessation
- 1985-08-29 EP EP85306123A patent/EP0174777B1/en not_active Expired - Lifetime
- 1985-08-29 DE DE8585306123T patent/DE3576604D1/de not_active Expired - Lifetime
- 1985-09-04 KR KR1019850006443A patent/KR930011232B1/ko not_active IP Right Cessation
-
1986
- 1986-06-02 ES ES1986294516U patent/ES294516Y/es not_active Expired
-
1990
- 1990-09-27 HK HK775/90A patent/HK77590A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3576604D1 (de) | 1990-04-19 |
ES294516U (es) | 1986-11-01 |
JPS6166310A (ja) | 1986-04-05 |
EP0174777A3 (en) | 1986-08-06 |
BR8504037A (pt) | 1986-06-10 |
IE58447B1 (en) | 1993-09-22 |
AU573363B2 (en) | 1988-06-02 |
KR930011232B1 (ko) | 1993-11-29 |
CA1237176A (en) | 1988-05-24 |
IE851720L (en) | 1986-03-04 |
AU4508685A (en) | 1986-03-13 |
KR860002890A (ko) | 1986-04-30 |
ES294516Y (es) | 1987-07-16 |
EP0174777B1 (en) | 1990-03-14 |
EP0174777A2 (en) | 1986-03-19 |
ES8700804A1 (es) | 1986-10-16 |
US4548862A (en) | 1985-10-22 |
ES545322A0 (es) | 1986-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |