HK69085A - Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors - Google Patents
Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitorsInfo
- Publication number
- HK69085A HK69085A HK690/85A HK69085A HK69085A HK 69085 A HK69085 A HK 69085A HK 690/85 A HK690/85 A HK 690/85A HK 69085 A HK69085 A HK 69085A HK 69085 A HK69085 A HK 69085A
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductors
- capacitors
- polymerizable composition
- electrical devices
- relief structures
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/145—Polyamides; Polyesteramides; Polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Paints Or Removers (AREA)
- Graft Or Block Polymers (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Organic Insulating Materials (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/183,648 US4329419A (en) | 1980-09-03 | 1980-09-03 | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
Publications (1)
Publication Number | Publication Date |
---|---|
HK69085A true HK69085A (en) | 1985-09-20 |
Family
ID=22673724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK690/85A HK69085A (en) | 1980-09-03 | 1985-09-12 | Radiation polymerizable composition for forming heat-resistant relief structures on electrical devices such as semiconductors and capacitors |
Country Status (14)
Country | Link |
---|---|
US (1) | US4329419A (es) |
EP (1) | EP0047184B1 (es) |
JP (2) | JPS5776017A (es) |
KR (1) | KR900006352B1 (es) |
AU (1) | AU543702B2 (es) |
CA (1) | CA1165932A (es) |
DE (1) | DE3168153D1 (es) |
ES (1) | ES505185A0 (es) |
GB (1) | GB2083064B (es) |
HK (1) | HK69085A (es) |
IE (1) | IE51582B1 (es) |
IL (1) | IL63717A0 (es) |
MY (1) | MY8600180A (es) |
SG (1) | SG70685G (es) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4414312A (en) * | 1980-09-03 | 1983-11-08 | E. I. Du Pont De Nemours & Co. | Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger |
US4518473A (en) * | 1981-08-06 | 1985-05-21 | The Upjohn Company | Compositions and process |
CA1195039A (en) * | 1982-01-04 | 1985-10-08 | David L. Goff | Radiation-sensitive polyimide precursor composition derived from a diaryl fluoro compound |
JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
DE3227584A1 (de) * | 1982-07-23 | 1984-01-26 | Merck Patent Gmbh, 6100 Darmstadt | Fotolacke |
DE3233912A1 (de) * | 1982-09-13 | 1984-03-15 | Merck Patent Gmbh, 6100 Darmstadt | Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren |
GB8321379D0 (en) * | 1982-10-22 | 1983-09-07 | Ciba Geigy Ag | Positive image formation |
JPS5978339A (ja) * | 1982-10-28 | 1984-05-07 | Fuji Photo Film Co Ltd | 光重合性組成物 |
EP0110285A3 (en) * | 1982-11-27 | 1985-11-21 | Prutec Limited | Interconnection of integrated circuits |
US4548891A (en) * | 1983-02-11 | 1985-10-22 | Ciba Geigy Corporation | Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators |
JPS6026033A (ja) * | 1983-07-01 | 1985-02-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 感光性ポリアミド酸誘導体およびこれを用いて基体上にポリイミドパタ−ンを形成する方法 |
DE3342851A1 (de) * | 1983-11-26 | 1985-06-05 | Merck Patent Gmbh, 6100 Darmstadt | Fotolacke |
US5125138A (en) * | 1983-12-19 | 1992-06-30 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making same |
US4499520A (en) * | 1983-12-19 | 1985-02-12 | General Electric Company | Capacitor with dielectric comprising poly-functional acrylate polymer and method of making |
US4490774A (en) * | 1983-12-19 | 1984-12-25 | General Electric Company | Capacitors containing polyfunctional acrylate polymers as dielectrics |
US5097800A (en) * | 1983-12-19 | 1992-03-24 | Spectrum Control, Inc. | High speed apparatus for forming capacitors |
EP0146089B1 (en) * | 1983-12-19 | 1992-08-05 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Capacitor with dielectric comprising polyfunctional acrylate polymer and method of making |
US4842893A (en) * | 1983-12-19 | 1989-06-27 | Spectrum Control, Inc. | High speed process for coating substrates |
US5018048A (en) * | 1983-12-19 | 1991-05-21 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
US4513349A (en) * | 1983-12-19 | 1985-04-23 | General Electric Company | Acrylate-containing mixed ester monomers and polymers thereof useful as capacitor dielectrics |
US5032461A (en) * | 1983-12-19 | 1991-07-16 | Spectrum Control, Inc. | Method of making a multi-layered article |
US4568601A (en) * | 1984-10-19 | 1986-02-04 | International Business Machines Corporation | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures |
DE3660339D1 (en) * | 1985-01-15 | 1988-07-28 | Merck Patent Gmbh | Photoresist compositions with enhanced sensitivity using polyamide esters |
US4612210A (en) * | 1985-07-25 | 1986-09-16 | International Business Machines Corporation | Process for planarizing a substrate |
NL8601041A (nl) * | 1986-04-23 | 1987-11-16 | Philips Nv | Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd met de werkwijze. |
US4943471A (en) * | 1986-05-20 | 1990-07-24 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Patterned thin film and process for preparing the same |
JPH0770527B2 (ja) * | 1987-02-27 | 1995-07-31 | アメリカン テレフォン アンド テレグラフ カムパニー | デバイス作製方法 |
DE3717933A1 (de) * | 1987-05-27 | 1988-12-08 | Hoechst Ag | Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen |
JPS6461746A (en) * | 1987-09-02 | 1989-03-08 | Hitachi Ltd | Heat-resisting photosensitive polymer composition |
CA1303281C (en) * | 1987-09-25 | 1992-06-09 | Masakazu Uekita | Patterned thin film and process for preparing the same |
DE3808927A1 (de) * | 1988-03-17 | 1989-10-05 | Ciba Geigy Ag | Negativ-fotoresists von polyimid-typ mit 1,2-disulfonen |
US4908096A (en) * | 1988-06-24 | 1990-03-13 | Allied-Signal Inc. | Photodefinable interlevel dielectrics |
US4987160A (en) * | 1989-01-31 | 1991-01-22 | Union Camp Corporation | Radiation-curable aminoamide acrylate polymer |
US5155177A (en) * | 1991-03-18 | 1992-10-13 | Union Camp Corporation | Three component aminoamide acrylate resin compositions |
JP2546940B2 (ja) * | 1991-11-06 | 1996-10-23 | 住友ベークライト株式会社 | 感光性樹脂組成物 |
US6099783A (en) * | 1995-06-06 | 2000-08-08 | Board Of Trustees Operating Michigan State University | Photopolymerizable compositions for encapsulating microelectronic devices |
US5786086A (en) * | 1996-01-02 | 1998-07-28 | Union Camp Corporation | Conductive wire coating |
US7208260B2 (en) | 1998-12-31 | 2007-04-24 | Hynix Semiconductor Inc. | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same |
KR100362937B1 (ko) * | 1998-12-31 | 2003-10-04 | 주식회사 하이닉스반도체 | 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물 |
US20070202421A1 (en) * | 2004-02-19 | 2007-08-30 | Dick Broer | Process For Preparing A Polymeric Relief Structure |
WO2006085741A1 (en) * | 2005-02-09 | 2006-08-17 | Stichting Dutch Polymer Institute | Process for preparing a polymeric relief structure |
KR101934171B1 (ko) * | 2014-03-17 | 2018-12-31 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물, 경화 릴리프 패턴의 제조 방법, 그리고 반도체 장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE635804A (es) * | 1962-03-21 | |||
US3380831A (en) * | 1964-05-26 | 1968-04-30 | Du Pont | Photopolymerizable compositions and elements |
US3479185A (en) * | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
US3552973A (en) * | 1967-07-20 | 1971-01-05 | Du Pont | Light sensitive hexaarylbiimidazole/p- aminophenyl ketone compositions |
US3623870A (en) * | 1969-07-22 | 1971-11-30 | Bell Telephone Labor Inc | Technique for the preparation of thermally stable photoresist |
DE2326314C2 (de) * | 1973-05-23 | 1983-10-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung von Reliefstrukturen |
NL177718C (nl) * | 1973-02-22 | 1985-11-01 | Siemens Ag | Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren. |
US3897395A (en) * | 1973-05-25 | 1975-07-29 | Univ Notre Dame Du Lac | Process for chain-extending unsaturated terminated polyimides and products prepared therefrom |
DE2437348B2 (de) * | 1974-08-02 | 1976-10-07 | Ausscheidung in: 24 62 105 | Verfahren zur herstellung von reliefstrukturen |
CH615935A5 (es) * | 1975-06-19 | 1980-02-29 | Ciba Geigy Ag | |
US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
US4188224A (en) * | 1976-02-23 | 1980-02-12 | Ciba-Geigy Corporation | Photopolymerizable composition containing anthrones |
US4132812A (en) * | 1977-09-02 | 1979-01-02 | W. R. Grace & Co. | Photocurable imidizable polyene-polythiol compositions |
US4080484A (en) * | 1976-12-23 | 1978-03-21 | W. R. Grace & Co. | Photocurable imidizable polyene-polythiol compositions, method of coating therewith and coated articles |
JPS5545748A (en) * | 1978-09-29 | 1980-03-31 | Hitachi Ltd | Photosensitive polymer and its production |
-
1980
- 1980-09-03 US US06/183,648 patent/US4329419A/en not_active Expired - Lifetime
-
1981
- 1981-09-01 AU AU74822/81A patent/AU543702B2/en not_active Ceased
- 1981-09-01 CA CA000384952A patent/CA1165932A/en not_active Expired
- 1981-09-01 JP JP56136213A patent/JPS5776017A/ja active Granted
- 1981-09-01 IE IE2006/81A patent/IE51582B1/en not_active IP Right Cessation
- 1981-09-02 GB GB8126576A patent/GB2083064B/en not_active Expired
- 1981-09-02 DE DE8181304016T patent/DE3168153D1/de not_active Expired
- 1981-09-02 EP EP81304016A patent/EP0047184B1/en not_active Expired
- 1981-09-02 KR KR1019810003267A patent/KR900006352B1/ko active
- 1981-09-02 IL IL63717A patent/IL63717A0/xx not_active IP Right Cessation
- 1981-09-03 ES ES505185A patent/ES505185A0/es active Granted
-
1985
- 1985-09-12 HK HK690/85A patent/HK69085A/xx not_active IP Right Cessation
- 1985-09-24 SG SG706/85A patent/SG70685G/en unknown
-
1986
- 1986-12-30 MY MY180/86A patent/MY8600180A/xx unknown
-
1989
- 1989-11-22 JP JP1302294A patent/JPH02210712A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR830007762A (ko) | 1983-11-07 |
IE812006L (en) | 1982-03-03 |
JPH0233723B2 (es) | 1990-07-30 |
CA1165932A (en) | 1984-04-17 |
EP0047184A2 (en) | 1982-03-10 |
KR900006352B1 (ko) | 1990-08-28 |
EP0047184A3 (en) | 1982-07-21 |
ES8303486A1 (es) | 1983-02-01 |
AU543702B2 (en) | 1985-04-26 |
EP0047184B1 (en) | 1985-01-09 |
MY8600180A (en) | 1986-12-31 |
JPH02210712A (ja) | 1990-08-22 |
GB2083064A (en) | 1982-03-17 |
US4329419A (en) | 1982-05-11 |
IL63717A0 (en) | 1981-12-31 |
DE3168153D1 (en) | 1985-02-21 |
SG70685G (en) | 1986-05-02 |
AU7482281A (en) | 1982-03-11 |
GB2083064B (en) | 1984-08-15 |
IE51582B1 (en) | 1987-01-21 |
JPS5776017A (en) | 1982-05-12 |
ES505185A0 (es) | 1983-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE | Patent expired |