HK67386A - Electroplating bath and process for white palladium - Google Patents

Electroplating bath and process for white palladium

Info

Publication number
HK67386A
HK67386A HK673/86A HK67386A HK67386A HK 67386 A HK67386 A HK 67386A HK 673/86 A HK673/86 A HK 673/86A HK 67386 A HK67386 A HK 67386A HK 67386 A HK67386 A HK 67386A
Authority
HK
Hong Kong
Prior art keywords
electroplating bath
white palladium
palladium
white
electroplating
Prior art date
Application number
HK673/86A
Other languages
English (en)
Inventor
Kathleen B Miscioscio
Paul T Smith
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of HK67386A publication Critical patent/HK67386A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK673/86A 1980-12-17 1986-09-11 Electroplating bath and process for white palladium HK67386A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/217,319 US4487665A (en) 1980-12-17 1980-12-17 Electroplating bath and process for white palladium

Publications (1)

Publication Number Publication Date
HK67386A true HK67386A (en) 1986-09-18

Family

ID=22810562

Family Applications (1)

Application Number Title Priority Date Filing Date
HK673/86A HK67386A (en) 1980-12-17 1986-09-11 Electroplating bath and process for white palladium

Country Status (15)

Country Link
US (1) US4487665A (de)
JP (1) JPS5933674B2 (de)
AT (1) AT375966B (de)
AU (1) AU529986B2 (de)
BR (1) BR8108196A (de)
CA (1) CA1193225A (de)
CH (1) CH648606A5 (de)
DE (1) DE3149043A1 (de)
ES (1) ES508039A0 (de)
FR (1) FR2496127A1 (de)
GB (1) GB2090868B (de)
HK (1) HK67386A (de)
IT (1) IT8149863A0 (de)
MX (1) MX158963A (de)
SE (1) SE8106869L (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4564426A (en) * 1985-04-15 1986-01-14 International Business Machines Corporation Process for the deposition of palladium-nickel alloy
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
DE3609309A1 (de) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco Bad zum elektrolytischen abscheiden von silber-palladium-legierungen
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
US5024733A (en) * 1989-08-29 1991-06-18 At&T Bell Laboratories Palladium alloy electroplating process
US5415685A (en) * 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
DE102010011269B4 (de) * 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458409A (en) * 1964-10-12 1969-07-29 Shinichi Hayashi Method and electrolyte for thick,brilliant plating of palladium
JPS4733176B1 (de) * 1967-01-11 1972-08-23
CH572989A5 (de) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
US3972787A (en) * 1974-06-14 1976-08-03 Lea-Ronal, Inc. Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
DE2839360C2 (de) * 1978-09-09 1982-11-04 Oxy Metal Industries Corp., Detroit, Mich. Wäßriges Bad zur galvanischen Abscheidung von glänzenden Überzügen aus Palladium oder seinen Legierungen
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys

Also Published As

Publication number Publication date
FR2496127A1 (fr) 1982-06-18
MX158963A (es) 1989-04-04
IT8149863A0 (it) 1981-12-09
JPS57126990A (en) 1982-08-06
GB2090868B (en) 1984-02-08
CH648606A5 (de) 1985-03-29
BR8108196A (pt) 1982-09-28
ES8304224A1 (es) 1983-02-16
DE3149043A1 (de) 1982-07-15
SE8106869L (sv) 1982-06-18
GB2090868A (en) 1982-07-21
AU529986B2 (en) 1983-06-30
ES508039A0 (es) 1983-02-16
CA1193225A (en) 1985-09-10
ATA527581A (de) 1984-02-15
US4487665A (en) 1984-12-11
AU7765281A (en) 1982-06-24
AT375966B (de) 1984-09-25
JPS5933674B2 (ja) 1984-08-17

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