HK65990A - Copper metallization for dielectric materials - Google Patents
Copper metallization for dielectric materialsInfo
- Publication number
- HK65990A HK65990A HK659/90A HK65990A HK65990A HK 65990 A HK65990 A HK 65990A HK 659/90 A HK659/90 A HK 659/90A HK 65990 A HK65990 A HK 65990A HK 65990 A HK65990 A HK 65990A
- Authority
- HK
- Hong Kong
- Prior art keywords
- dielectric materials
- copper metallization
- metallization
- copper
- dielectric
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 239000003989 dielectric material Substances 0.000 title 1
- 238000001465 metallisation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5127—Cu, e.g. Cu-CuO eutectic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/5183—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/494,475 US4511601A (en) | 1983-05-13 | 1983-05-13 | Copper metallization for dielectric materials |
Publications (1)
Publication Number | Publication Date |
---|---|
HK65990A true HK65990A (en) | 1990-08-31 |
Family
ID=23964645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK659/90A HK65990A (en) | 1983-05-13 | 1990-08-23 | Copper metallization for dielectric materials |
Country Status (5)
Country | Link |
---|---|
US (1) | US4511601A (xx) |
EP (1) | EP0125730B1 (xx) |
JP (1) | JPS59226178A (xx) |
DE (1) | DE3475799D1 (xx) |
HK (1) | HK65990A (xx) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183807A (ja) * | 1985-02-08 | 1986-08-16 | 松下電器産業株式会社 | メタライズ組成物 |
JPS61183806A (ja) * | 1985-02-08 | 1986-08-16 | 松下電器産業株式会社 | メタライズ組成物 |
JPS61290601A (ja) * | 1985-06-19 | 1986-12-20 | 松下電器産業株式会社 | メタライズ組成物 |
US4713300A (en) * | 1985-12-13 | 1987-12-15 | Minnesota Mining And Manufacturing Company | Graded refractory cermet article |
US4619836A (en) * | 1985-12-31 | 1986-10-28 | Rca Corporation | Method of fabricating thick film electrical components |
US4885038A (en) * | 1986-05-01 | 1989-12-05 | International Business Machines Corporation | Method of making multilayered ceramic structures having an internal distribution of copper-based conductors |
DE3785506T2 (de) * | 1986-07-29 | 1993-08-12 | Tdk Corp | Halbleitende keramische zusammensetzung, sowie kondensator aus halbleitender keramik. |
JPS6355807A (ja) * | 1986-08-27 | 1988-03-10 | 古河電気工業株式会社 | 導電性ペ−スト |
JP2788510B2 (ja) * | 1989-10-27 | 1998-08-20 | 第一工業製薬株式会社 | 銅ペースト組成物 |
FR2660320A1 (fr) * | 1990-04-03 | 1991-10-04 | Europ Composants Electron | Encre de terminaison pour composants ceramiques, procede de preparation d'une telle encre et son utilisation dans un condensateur electrique. |
JPH06504028A (ja) * | 1991-10-31 | 1994-05-12 | シーティーエス・コーポレーション | 誘電ブロック・フィルタの改善された製造方法 |
US5279850A (en) * | 1992-07-15 | 1994-01-18 | Harris Corporation | Gas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding ink |
US5561082A (en) * | 1992-07-31 | 1996-10-01 | Kabushiki Kaisha Toshiba | Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide |
JP2885616B2 (ja) * | 1992-07-31 | 1999-04-26 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP3724592B2 (ja) * | 1993-07-26 | 2005-12-07 | ハイニックス セミコンダクター アメリカ インコーポレイテッド | 半導体基板の平坦化方法 |
JP3454065B2 (ja) * | 1997-01-29 | 2003-10-06 | 株式会社村田製作所 | 誘電体ペーストおよびそれを用いた厚膜コンデンサ |
US6010749A (en) * | 1998-10-28 | 2000-01-04 | Goldman; Mark A. | Process for the production of volatile metal |
US6507477B1 (en) | 2000-09-11 | 2003-01-14 | John E. Stauffer | Electrical capacitor |
US7688569B2 (en) * | 2004-03-16 | 2010-03-30 | E. I. Du Pont De Nemours And Company | Thick-film dielectric and conductive compositions |
EP1578179A3 (en) * | 2004-03-16 | 2006-05-03 | E.I. du Pont de Nemours and Company | Thick-film dielectric and conductive compositions |
US20060282999A1 (en) * | 2005-06-20 | 2006-12-21 | Diptarka Majumdar | Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II |
US7531416B2 (en) * | 2005-12-21 | 2009-05-12 | E. I. Du Pont De Nemours And Company | Thick film capacitors on ceramic interconnect substrates |
US8791018B2 (en) * | 2006-12-19 | 2014-07-29 | Spansion Llc | Method of depositing copper using physical vapor deposition |
US20140141175A1 (en) * | 2010-09-09 | 2014-05-22 | Aps Materials, Inc. | Vibration damping coating |
RU2654963C1 (ru) * | 2017-03-06 | 2018-05-23 | Акционерное общество "Научно-производственное предприятие "Исток" имени А.И. Шокина" (АО "НПП "Исток" им. Шокина") | Способ металлизации диэлектрического материала компонента электронной техники СВЧ |
JP7089402B2 (ja) * | 2018-05-18 | 2022-06-22 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
JP7145652B2 (ja) * | 2018-06-01 | 2022-10-03 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
JP7446705B2 (ja) | 2018-06-12 | 2024-03-11 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
US20230092683A1 (en) * | 2021-09-10 | 2023-03-23 | Utility Global, Inc. | Method of making an electrode |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2993815A (en) * | 1959-05-25 | 1961-07-25 | Bell Telephone Labor Inc | Metallizing refractory substrates |
US3180756A (en) * | 1962-09-07 | 1965-04-27 | Robert E Cowan | Copper metallizing of alumina ceramics |
US3902102A (en) * | 1974-04-01 | 1975-08-26 | Sprague Electric Co | Ceramic capacitor with base metal electrodes |
US4122232A (en) * | 1975-04-21 | 1978-10-24 | Engelhard Minerals & Chemicals Corporation | Air firable base metal conductors |
US4130854A (en) * | 1976-09-23 | 1978-12-19 | Erie Technological Products, Inc. | Borate treated nickel pigment for metallizing ceramics |
US4070518A (en) * | 1976-10-15 | 1978-01-24 | E. I. Du Pont De Nemours And Company | Copper metallizations |
US4172919A (en) * | 1977-04-22 | 1979-10-30 | E. I. Du Pont De Nemours And Company | Copper conductor compositions containing copper oxide and Bi2 O3 |
US4140817A (en) * | 1977-11-04 | 1979-02-20 | Bell Telephone Laboratories, Incorporated | Thick film resistor circuits |
US4271232A (en) * | 1978-08-28 | 1981-06-02 | International Business Machines Corporation | Amorphous magnetic film |
US4246625A (en) * | 1978-11-16 | 1981-01-20 | Union Carbide Corporation | Ceramic capacitor with co-fired end terminations |
US4323483A (en) * | 1979-11-08 | 1982-04-06 | E. I. Du Pont De Nemours And Company | Mixed oxide bonded copper conductor compositions |
US4316920A (en) * | 1980-07-03 | 1982-02-23 | Bell Telephone Laboratories, Incorporated | Thick film resistor circuits |
US4317750A (en) * | 1980-08-22 | 1982-03-02 | Ferro Corporation | Thick film conductor employing nickel oxide |
-
1983
- 1983-05-13 US US06/494,475 patent/US4511601A/en not_active Expired - Lifetime
-
1984
- 1984-05-10 EP EP84200668A patent/EP0125730B1/en not_active Expired
- 1984-05-10 DE DE8484200668T patent/DE3475799D1/de not_active Expired
- 1984-05-14 JP JP59096309A patent/JPS59226178A/ja active Granted
-
1990
- 1990-08-23 HK HK659/90A patent/HK65990A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JPS59226178A (ja) | 1984-12-19 |
JPH0340109B2 (xx) | 1991-06-17 |
DE3475799D1 (en) | 1989-02-02 |
US4511601A (en) | 1985-04-16 |
EP0125730A1 (en) | 1984-11-21 |
EP0125730B1 (en) | 1988-12-28 |
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