HK51178A - Machine and method for cutting brittle materials - Google Patents

Machine and method for cutting brittle materials

Info

Publication number
HK51178A
HK51178A HK511/78A HK51178A HK51178A HK 51178 A HK51178 A HK 51178A HK 511/78 A HK511/78 A HK 511/78A HK 51178 A HK51178 A HK 51178A HK 51178 A HK51178 A HK 51178A
Authority
HK
Hong Kong
Prior art keywords
machine
brittle materials
cutting brittle
cutting
materials
Prior art date
Application number
HK511/78A
Other languages
English (en)
Inventor
H W Mech
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of HK51178A publication Critical patent/HK51178A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/547—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a wire-like cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
HK511/78A 1971-11-22 1978-09-07 Machine and method for cutting brittle materials HK51178A (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US20094371A 1971-11-22 1971-11-22
US00377672A US3831576A (en) 1971-11-22 1973-07-09 Machine and method for cutting brittle materials using a reciprocating cutting wire
GB5564273A GB1397676A (en) 1971-11-22 1973-11-30 Machine and method for cutting brittle materials
NLAANVRAGE7317041,A NL171031C (nl) 1971-11-22 1973-12-12 Inrichting voor het snijden van broze materialen.
DE2362023A DE2362023C3 (de) 1971-11-22 1973-12-13 Vorrichtung zum Schneiden von sprödem Material mit HiUe eines Schneiddrahtes
FR7345266A FR2254947A5 (en) 1971-11-22 1973-12-18 Machine for cutting brittle materials - has drive motor with spool of new wire fixed to its shaft

Publications (1)

Publication Number Publication Date
HK51178A true HK51178A (en) 1978-09-15

Family

ID=41581168

Family Applications (1)

Application Number Title Priority Date Filing Date
HK511/78A HK51178A (en) 1971-11-22 1978-09-07 Machine and method for cutting brittle materials

Country Status (7)

Country Link
US (1) US3831576A (de)
DE (1) DE2362023C3 (de)
FR (1) FR2254947A5 (de)
GB (1) GB1397676A (de)
HK (1) HK51178A (de)
MY (1) MY8400373A (de)
NL (1) NL171031C (de)

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FR2234753A5 (de) * 1973-06-25 1975-01-17 Labo Electronique Physique
JPS6112373B2 (de) * 1974-09-04 1986-04-08 Hitachi Ltd
US4160439A (en) * 1975-11-07 1979-07-10 Sotarem S.A. Cutting-off machine for hard bodies
GB2000055B (en) * 1977-06-14 1982-03-03 Inoue Japax Research Incorporated Method of and apparatus for shaping workpieces
US4193852A (en) * 1977-06-14 1980-03-18 Inoue-Japax Research Incorporated Method and apparatus for electrical machining with a multi-guided travelling electrode
US4134384A (en) * 1977-09-16 1979-01-16 Motorola, Inc. Wire saw with rotatable guide sleeve
US4393450A (en) * 1980-08-11 1983-07-12 Trustees Of Dartmouth College Three-dimensional model-making system
DE3209164C2 (de) * 1982-03-13 1983-12-22 Messner, Caspar O.H., Prof.Dr.sc.techn., Zürich Drahtsäge
DE3804873A1 (de) * 1988-02-17 1989-08-31 Mueller Georg Nuernberg Verfahren und vorrichtung zum zerteilen von halbleiter-barren in halbleiter-ronden mit zumindest einer planen oberflaeche
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
JP2516717B2 (ja) * 1991-11-29 1996-07-24 信越半導体株式会社 ワイヤソ―及びその切断方法
DE19510625A1 (de) * 1995-03-23 1996-09-26 Wacker Siltronic Halbleitermat Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück
JP3427956B2 (ja) * 1995-04-14 2003-07-22 信越半導体株式会社 ワイヤーソー装置
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
JP3107143B2 (ja) * 1995-07-14 2000-11-06 株式会社東京精密 ワイヤソーのワイヤトラバース装置
JPH0985737A (ja) * 1995-09-22 1997-03-31 Toray Eng Co Ltd ワイヤ式切断装置
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
MY120514A (en) * 1996-03-26 2005-11-30 Shinetsu Handotai Kk Wire saw and method of slicing a cylindrical workpiece
JPH09290358A (ja) * 1996-04-25 1997-11-11 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法および半導体インゴットの面 取り加工装置
EP0803336B1 (de) * 1996-04-27 2003-07-02 Nippei Toyama Corporation Drahtsäge und Abschneideverfahren
CH690907A5 (fr) * 1996-05-23 2001-02-28 Hct Shaping Systems Sa Dispositif de sciage par fil
DE19642908A1 (de) * 1996-10-17 1998-04-23 Wacker Siltronic Halbleitermat Sägesuspension und Verfahren zum Abtrennen von Scheiben von einem Kristall
JP3810170B2 (ja) * 1997-01-29 2006-08-16 信越半導体株式会社 ワイヤーソーによるワークの切断方法およびワイヤーソー
DE19717379A1 (de) * 1997-04-24 1998-10-29 Wacker Siltronic Halbleitermat Drahtsäge und Montagestation für eine Drahtführungsrolle einer Drahtsäge sowie Verfahren zum Auswechseln einer Drahtführungsrolle
JP4049900B2 (ja) * 1998-08-20 2008-02-20 株式会社スーパーシリコン研究所 ワイヤソー切断装置
US6357433B1 (en) 2000-06-01 2002-03-19 Motorola, Inc. Machine for cutting brittle materials
KR20070004073A (ko) * 2004-03-30 2007-01-05 솔라익스 인코퍼레이티드 초박형 실리콘 웨이퍼 절단방법 및 장치
CN101284402B (zh) * 2008-05-30 2011-08-17 大连连城数控机器股份有限公司 多线切割机
JP5540072B2 (ja) * 2009-04-01 2014-07-02 キャボット マイクロエレクトロニクス コーポレイション 自浄式ワイヤソー装置および方法
WO2010125085A1 (en) 2009-04-29 2010-11-04 Nv Bekaert Sa A sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder
CN103180236B (zh) 2010-05-04 2015-07-08 贝卡尔特公司 带有可移除保护涂层的固定磨料锯线
EP2643118B1 (de) 2010-11-22 2017-05-17 Bekaert Binjiang Steel Cord Co., Ltd. Strukturierter sägedraht
CN104210040B (zh) * 2014-07-03 2016-03-16 开封恒锐新金刚石制品有限公司 树脂金刚线用钢线的预处理清洗方法及设备
CN104493982A (zh) * 2014-12-30 2015-04-08 南京铭品机械制造有限公司 一种数控丝锯加工机
CN105082380B (zh) * 2015-09-09 2016-09-07 江西赛维Ldk太阳能高科技有限公司 硅片切割后的取出方法
CN105480667A (zh) * 2016-01-26 2016-04-13 赵晓波 一种皮带式上下胶辊结构装置
US10882126B2 (en) * 2017-01-13 2021-01-05 ESCO Group, Inc. Take-up and payoff system for vertical profiling cutting saw (VPX)
KR102037745B1 (ko) 2017-12-14 2019-10-29 에스케이실트론 주식회사 잉곳 클램프 및 그를 구비한 잉곳 절단용 와이어 쏘잉 장치
CN110948046B (zh) * 2019-11-14 2021-08-24 乌鲁木齐市亚欧稀有金属有限责任公司 可调间距式锂锭切割装置

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US1812942A (en) * 1929-02-09 1931-07-07 Atlas Mfg Company Process of cleaning power meat saws
DE1138353B (de) * 1953-02-18 1962-10-18 Siemens Ag Vorrichtung zum Zerteilen von Kristallen, insbesondere zum Zerschneiden von Halbleiterkristallen
US2780038A (en) * 1954-09-08 1957-02-05 Glaceries Sambre Sa Glass grinding and polishing method and apparatus
GB771622A (en) * 1954-12-08 1957-04-03 British Thomson Houston Co Ltd Improved apparatus for cutting crystal
US2831476A (en) * 1957-04-09 1958-04-22 Henry A Wilson Crystal cutting saw
GB863878A (en) * 1957-10-25 1961-03-29 British Thomson Houston Co Ltd Improvements in apparatus for slicing metallic and other bodies
CH349533A (fr) * 1958-07-14 1960-10-15 Miniati Louis Installation pour le sciage de blocs de pierre
US2994314A (en) * 1958-08-22 1961-08-01 Ty Sa Man Machine Company Stone cutting apparatus
FR1282144A (fr) * 1960-12-07 1962-01-19 Electronique & Automatisme Sa Machine perfectionnée pour le sciage par rodage d'échantillons en matériaux fragiles, notamment cristallins
FR1291784A (fr) * 1961-03-18 1962-04-27 Emile Cebe Ets Dispositif régulateur de l'avance du fil, pour machine à scier la pierre ou les matériaux similaires
US3435815A (en) * 1966-07-15 1969-04-01 Micro Tech Mfg Inc Wafer dicer
FR1512501A (fr) * 1966-12-27 1968-02-09 Electronique & Automatisme Sa Perfectionnements apportés aux machines à scier des éléments en matériaux fragiles, notamment cristallins
FR1591125A (de) * 1968-10-17 1970-04-27
CH500749A (it) * 1969-09-03 1970-12-31 D Agostini Marcello Dispositivo automatico di separazione dei fanghi e di alimentazione di acqua e abrasivo negli impianti a filo e a telaio per il taglio di granito, marmo e pietra
US3750847A (en) * 1972-05-03 1973-08-07 Master Chemical Corp Method of supplying an aqueous cutting fluid to machine tools

Also Published As

Publication number Publication date
NL171031B (nl) 1982-09-01
NL7317041A (en) 1975-06-16
FR2254947A5 (en) 1975-07-11
DE2362023C3 (de) 1979-01-04
US3831576A (en) 1974-08-27
GB1397676A (en) 1975-06-18
DE2362023B2 (de) 1978-05-03
NL171031C (nl) 1983-02-01
MY8400373A (en) 1984-12-31
DE2362023A1 (de) 1975-06-26

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