HK47293A - Polyamides with hexafluoroisopropylidene groups,positively acting photosensitive compositions,and recording materials using them - Google Patents
Polyamides with hexafluoroisopropylidene groups,positively acting photosensitive compositions,and recording materials using themInfo
- Publication number
- HK47293A HK47293A HK472/93A HK47293A HK47293A HK 47293 A HK47293 A HK 47293A HK 472/93 A HK472/93 A HK 472/93A HK 47293 A HK47293 A HK 47293A HK 47293 A HK47293 A HK 47293A
- Authority
- HK
- Hong Kong
- Prior art keywords
- positively acting
- photosensitive compositions
- polyamides
- recording materials
- acting photosensitive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Polyamides (AREA)
- Photoreceptors In Electrophotography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Abstract
A polyamide which is suitable as binder for positively acting photosensitive compositions and corresponds to the formula <IMAGE> The positively acting photosensitive compositions made with this binder have a high photosensitivity, a good solubility in the solvents used to produce the photoresist compositions, and a good adhesive strength on the substrate material. The image resolution is very high even after storing the photosensitive composition.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US91534286A | 1986-10-02 | 1986-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK47293A true HK47293A (en) | 1993-05-21 |
Family
ID=25435594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK472/93A HK47293A (en) | 1986-10-02 | 1993-05-13 | Polyamides with hexafluoroisopropylidene groups,positively acting photosensitive compositions,and recording materials using them |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0264678B1 (en) |
JP (2) | JPH0660140B2 (en) |
KR (1) | KR970007022B1 (en) |
AT (1) | ATE67611T1 (en) |
DE (1) | DE3773110D1 (en) |
HK (1) | HK47293A (en) |
SG (1) | SG18493G (en) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0291779B1 (en) * | 1987-05-18 | 1994-07-27 | Siemens Aktiengesellschaft | Heat-resistant positive resist, and process for the production of heat-resistant resist patterns |
US5037720A (en) * | 1987-07-21 | 1991-08-06 | Hoechst Celanese Corporation | Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use |
US4822868A (en) * | 1987-11-24 | 1989-04-18 | Hoechst Celanese Corporation | Polycarbonamide of bis(2-(4-carboxyphenyl)-hexafluoroisopropyl)diphenyl ether |
EP0378156A3 (en) * | 1989-01-09 | 1992-02-26 | Nitto Denko Corporation | Positively photosensitive polyimide composition |
CA2010770A1 (en) * | 1989-03-09 | 1990-09-09 | Dinesh N. Khanna | Bis-n,n' nitro or amino benzoyl aminophenols |
US4962181A (en) * | 1989-05-08 | 1990-10-09 | Hoechst Celanese Corp. | Polyamide polymer having 12-F fluorine-containing linking groups |
JP2778116B2 (en) * | 1989-06-07 | 1998-07-23 | 大日本インキ化学工業株式会社 | Photosensitive composition |
EP0459395B1 (en) * | 1990-05-29 | 1999-08-18 | Sumitomo Bakelite Company Limited | Positive photo-sensitive resin composition |
US5206117A (en) * | 1991-08-14 | 1993-04-27 | Labadie Jeffrey W | Photosensitive polyamic alkyl ester composition and process for its use |
DE59600371D1 (en) * | 1995-03-23 | 1998-09-03 | Siemens Ag | Process for the preparation of polybenzoxazole precursors and corresponding resist solutions |
EP0750003B1 (en) * | 1995-06-19 | 2002-08-14 | Infineon Technologies AG | Process for the preparation of poly-o-hydroxyamides |
DE59602852D1 (en) * | 1995-06-19 | 1999-09-30 | Siemens Ag | Process for the preparation of poly-o-hydroxyamides |
DE59606492D1 (en) * | 1995-08-31 | 2001-04-05 | Infineon Technologies Ag | Production of poly-o-hydroxyamides and poly-o-mercaptoamides |
DE59607034D1 (en) * | 1995-08-31 | 2001-07-12 | Infineon Technologies Ag | Process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides |
EP0761719B1 (en) * | 1995-08-31 | 2001-03-28 | Infineon Technologies AG | Process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides |
DE59606486D1 (en) * | 1995-08-31 | 2001-04-05 | Infineon Technologies Ag | Production of poly-o-hydroxyamides and poly-o-mercaptoamides |
DE59606488D1 (en) * | 1995-08-31 | 2001-04-05 | Infineon Technologies Ag | Process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides |
DE59606489D1 (en) * | 1995-08-31 | 2001-04-05 | Infineon Technologies Ag | Process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides |
TW434807B (en) * | 1997-09-18 | 2001-05-16 | Siemens Ag | The production of structurized protecting and isolating layers |
EP0905121B1 (en) | 1997-09-24 | 2002-07-03 | Infineon Technologies AG | o-nitro(thio)phenol compounds and their preparation |
EP0918050B1 (en) * | 1997-09-24 | 2001-12-12 | Infineon Technologies AG | Bis-o-amino(thio)phenols and their preparation |
EP0905170B1 (en) * | 1997-09-24 | 2013-10-30 | Qimonda AG | Polybenzoxazoles and polybenzothiazoles precursors |
EP0905124B1 (en) * | 1997-09-24 | 2001-12-12 | Infineon Technologies AG | o-amino(thio)phenol-carboxylic acids and their preparation |
EP0905169B8 (en) * | 1997-09-24 | 2008-07-16 | Infineon Technologies AG | Precursors of polybenzoxazoles and polybenzothiazoles |
EP0905123B1 (en) | 1997-09-24 | 2001-12-12 | Infineon Technologies AG | o-amino(thio)phenol-carboxylic acids and their preparation |
EP0906903B1 (en) * | 1997-09-24 | 2001-12-12 | Infineon Technologies AG | Bis-o-amino(thio)phenols and their preparartion |
KR20010071149A (en) | 1998-04-15 | 2001-07-28 | 야마모토 카즈모토 | Positive Resist Composition |
JP2000128984A (en) * | 1998-10-28 | 2000-05-09 | Sumitomo Bakelite Co Ltd | Polybenzoxazole precursor and resin |
JP4518627B2 (en) * | 2000-03-14 | 2010-08-04 | 旭化成イーマテリアルズ株式会社 | Hydroxy polyamide |
EP1138804A3 (en) | 2000-03-27 | 2003-06-25 | Infineon Technologies AG | Component with at least two contiguous insulating layers and manufacturing method therefor |
JP4798851B2 (en) * | 2001-01-23 | 2011-10-19 | 旭化成イーマテリアルズ株式会社 | Alkoxysilane compound and composition thereof |
DE10125372B4 (en) | 2001-05-23 | 2007-09-13 | Infineon Technologies Ag | Mixture for use as an antireflective layer, substrate with an antireflection layer and method for producing an antireflection layer |
DE10145471A1 (en) | 2001-09-14 | 2003-04-17 | Infineon Technologies Ag | A photosensitive formulation including a poly-o-hydroxyamide with free OH groups, a solvent inhibitor with polar groups and blocked with acid labile groups useful in the electronic and microelectronic industries |
DE10145469B4 (en) | 2001-09-14 | 2006-07-06 | Infineon Technologies Ag | Poly-o-hydroxyamide and process for its further processing to polybenzoxazole |
US7282323B2 (en) | 2002-07-11 | 2007-10-16 | Asahi Kasei Emd Corporation | Highly heat-resistant, negative-type photosensitive resin composition |
DE10238024B4 (en) * | 2002-08-20 | 2007-03-08 | Infineon Technologies Ag | Method for integrating air as a dielectric in semiconductor devices |
JP2006227063A (en) * | 2005-02-15 | 2006-08-31 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for manufacturing pattern, and electronic component |
WO2007049524A1 (en) | 2005-10-26 | 2007-05-03 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
CN101405655B (en) | 2006-03-16 | 2013-02-06 | 旭硝子株式会社 | Negative-type photosensitive fluorinated aromatic resin composition |
WO2008020573A1 (en) | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
US9188860B2 (en) | 2007-09-06 | 2015-11-17 | Toray Industries, Inc. | Method for producing polyamide and resin composition |
KR100914064B1 (en) | 2008-03-19 | 2009-08-28 | 제일모직주식회사 | Positive type photosensitive resin composition |
KR101023089B1 (en) | 2008-09-29 | 2011-03-24 | 제일모직주식회사 | Positive type photosensitive resin composition |
TWI459141B (en) | 2008-10-20 | 2014-11-01 | Cheil Ind Inc | Positive photosensitive resin composition |
US8536299B2 (en) | 2008-12-08 | 2013-09-17 | University Of Dayton | Rigid-rod copolymer compositions and the polymeric fibers fabricated from those compositions for enhanced flame resistance |
JP5577624B2 (en) * | 2009-05-22 | 2014-08-27 | 日立化成デュポンマイクロシステムズ株式会社 | Process for producing poly-o-hydroxyamide |
KR101333698B1 (en) | 2009-11-10 | 2013-11-27 | 제일모직주식회사 | Positive photosensitive resin composition |
KR101333704B1 (en) | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | Positive type photosensitive resin composition |
WO2012008736A2 (en) * | 2010-07-14 | 2012-01-19 | 주식회사 엘지화학 | Positive-type photosensitive resin composition and black bank of an organic light-emitting device including same |
KR20120066923A (en) | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | Novel phenol compounds and positive photosensitive resin composition including the same |
KR101423539B1 (en) | 2010-12-20 | 2014-07-25 | 삼성전자 주식회사 | Positive type photosensitive resin composition |
KR101400187B1 (en) | 2010-12-30 | 2014-05-27 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer |
KR101400192B1 (en) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer |
KR101400186B1 (en) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer |
KR101423176B1 (en) | 2011-11-29 | 2014-07-25 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
KR101413076B1 (en) | 2011-12-23 | 2014-06-30 | 제일모직 주식회사 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
KR101432603B1 (en) | 2011-12-29 | 2014-08-21 | 제일모직주식회사 | Photosensitive novolak resin, positive photosensitive resin composition including same, photosensitive resin layer prepared by using the same, and semiconductor device including the photosensitive resin layer |
KR101423177B1 (en) | 2011-12-30 | 2014-07-29 | 제일모직 주식회사 | Positive type photosensitive resin composition |
KR20140086724A (en) | 2012-12-28 | 2014-07-08 | 제일모직주식회사 | Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the same |
KR101636861B1 (en) | 2012-12-28 | 2016-07-06 | 제일모직 주식회사 | Photosensitive resin composition for insulating film of display device, insulating film using the same, and display device using the same |
KR101696963B1 (en) * | 2013-09-30 | 2017-01-16 | 주식회사 엘지화학 | Photosensitive resin composition |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3328352A (en) * | 1963-06-17 | 1967-06-27 | Du Pont | Fluorine containing aromatic polycarbonamides |
US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
JPH0660140A (en) * | 1992-08-06 | 1994-03-04 | Mitsubishi Electric Corp | Semiconductor design verification device |
-
1987
- 1987-10-01 DE DE8787114324T patent/DE3773110D1/en not_active Expired - Lifetime
- 1987-10-01 AT AT87114324T patent/ATE67611T1/en not_active IP Right Cessation
- 1987-10-01 EP EP87114324A patent/EP0264678B1/en not_active Expired - Lifetime
- 1987-10-02 KR KR1019870011037A patent/KR970007022B1/en not_active IP Right Cessation
- 1987-10-02 JP JP62248239A patent/JPH0660140B2/en not_active Expired - Lifetime
-
1990
- 1990-06-08 JP JP2148862A patent/JP2566664B2/en not_active Expired - Lifetime
-
1993
- 1993-02-19 SG SG184/93A patent/SG18493G/en unknown
- 1993-05-13 HK HK472/93A patent/HK47293A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970007022B1 (en) | 1997-05-02 |
JP2566664B2 (en) | 1996-12-25 |
JPS6396162A (en) | 1988-04-27 |
DE3773110D1 (en) | 1991-10-24 |
EP0264678A1 (en) | 1988-04-27 |
ATE67611T1 (en) | 1991-10-15 |
EP0264678B1 (en) | 1991-09-18 |
KR880005174A (en) | 1988-06-28 |
JPH0320743A (en) | 1991-01-29 |
JPH0660140B2 (en) | 1994-08-10 |
SG18493G (en) | 1993-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
AS | Change of ownership |
Owner name: AZ ELECTRONIC MATERIALS (JAPAN) K.K. Free format text: FORMER OWNER(S): CLARIANT FINANCE (BVI) LIMITED |
|
CHPA | Change of a particular in the register (except of change of ownership) | ||
PE | Patent expired |
Effective date: 20070930 |