JPS5518410A - Hot-melt road coating material - Google Patents

Hot-melt road coating material

Info

Publication number
JPS5518410A
JPS5518410A JP9045378A JP9045378A JPS5518410A JP S5518410 A JPS5518410 A JP S5518410A JP 9045378 A JP9045378 A JP 9045378A JP 9045378 A JP9045378 A JP 9045378A JP S5518410 A JPS5518410 A JP S5518410A
Authority
JP
Japan
Prior art keywords
aggregate
coating material
resin
parts
hydrocarbon resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9045378A
Other languages
Japanese (ja)
Other versions
JPS6120592B2 (en
Inventor
Kimiya Mizui
Sadao Fukuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP9045378A priority Critical patent/JPS5518410A/en
Publication of JPS5518410A publication Critical patent/JPS5518410A/en
Publication of JPS6120592B2 publication Critical patent/JPS6120592B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

PURPOSE: The title coating material having reduced sedimentation of an aggregate, comprising a binder resin, a specific amount of a compound having one or more epoxy groups, a pigment, and the aggregate.
CONSTITUTION: (A) 100 parts by wt. of a binder resin, e.g. a hydrocarbon resin, which has a number-average molecular weight of 500W3,000, and is a solid at normal temperatures, is incorporated with (B) 0.01W20 parts by wt. of an epoxy compound having one or more epoxy groups in the molecule on the average and (C) 200W700 parts by wt. of a pigment and an aggregate, and heated in a vessel. The mixture is then kneaded to give a coating material. The hydrocarbon resin lowers the fluidity in melting and the coating performance as it is when incorporated with such a large amount of the aggregate. Thus, a resin having carboxyl groups or ester linkages obtained by reacting an alcohol with the carboxyl group-modified hydrocarbon resin is preferably used.
COPYRIGHT: (C)1980,JPO&Japio
JP9045378A 1978-07-26 1978-07-26 Hot-melt road coating material Granted JPS5518410A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9045378A JPS5518410A (en) 1978-07-26 1978-07-26 Hot-melt road coating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9045378A JPS5518410A (en) 1978-07-26 1978-07-26 Hot-melt road coating material

Publications (2)

Publication Number Publication Date
JPS5518410A true JPS5518410A (en) 1980-02-08
JPS6120592B2 JPS6120592B2 (en) 1986-05-22

Family

ID=13999030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9045378A Granted JPS5518410A (en) 1978-07-26 1978-07-26 Hot-melt road coating material

Country Status (1)

Country Link
JP (1) JPS5518410A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356618A (en) * 2001-05-30 2002-12-13 Nippon Oil Corp Binder composition for pavement and its manufacturing method
JP2011105779A (en) * 2009-11-12 2011-06-02 Shin-Etsu Chemical Co Ltd Adhesive composition, adhesion sheet, dicing-die attachment film, and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356618A (en) * 2001-05-30 2002-12-13 Nippon Oil Corp Binder composition for pavement and its manufacturing method
JP4582956B2 (en) * 2001-05-30 2010-11-17 Jx日鉱日石エネルギー株式会社 Paving binder composition and method for producing the same
JP2011105779A (en) * 2009-11-12 2011-06-02 Shin-Etsu Chemical Co Ltd Adhesive composition, adhesion sheet, dicing-die attachment film, and semiconductor device

Also Published As

Publication number Publication date
JPS6120592B2 (en) 1986-05-22

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