HK140196A - Method for fabricating electronic devices - Google Patents

Method for fabricating electronic devices

Info

Publication number
HK140196A
HK140196A HK140196A HK140196A HK140196A HK 140196 A HK140196 A HK 140196A HK 140196 A HK140196 A HK 140196A HK 140196 A HK140196 A HK 140196A HK 140196 A HK140196 A HK 140196A
Authority
HK
Hong Kong
Prior art keywords
electronic devices
fabricating electronic
fabricating
devices
electronic
Prior art date
Application number
HK140196A
Other languages
English (en)
Inventor
Brent J Blumenstock
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Publication of HK140196A publication Critical patent/HK140196A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK140196A 1989-03-22 1996-07-25 Method for fabricating electronic devices HK140196A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/327,463 US4908935A (en) 1989-03-22 1989-03-22 Method for fabricating electronic devices

Publications (1)

Publication Number Publication Date
HK140196A true HK140196A (en) 1996-08-02

Family

ID=23276649

Family Applications (1)

Application Number Title Priority Date Filing Date
HK140196A HK140196A (en) 1989-03-22 1996-07-25 Method for fabricating electronic devices

Country Status (6)

Country Link
US (1) US4908935A (xx)
EP (1) EP0389170B1 (xx)
JP (1) JPH02280345A (xx)
DE (1) DE69025221T2 (xx)
ES (1) ES2082823T3 (xx)
HK (1) HK140196A (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777500B2 (ja) * 1992-03-24 1998-07-16 株式会社日立製作所 半導体装置の保護層の形成方法
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5644839A (en) * 1994-06-10 1997-07-08 Xetel Corporation Surface mountable substrate edge terminal
DE19541976A1 (de) * 1995-11-10 1997-05-15 Ego Elektro Blanc & Fischer Elektrische Schaltung
US6232153B1 (en) * 1998-06-04 2001-05-15 Ramtron International Corporation Plastic package assembly method for a ferroelectric-based integrated circuit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899305A (en) * 1973-07-23 1975-08-12 Capsonic Group Inc Insert frame for insert molding
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
US4271588A (en) * 1977-12-12 1981-06-09 Motorola, Inc. Process of manufacturing a encapsulated hybrid circuit assembly
US4396796A (en) * 1980-10-30 1983-08-02 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
WO1984001922A1 (en) * 1982-11-17 1984-05-24 Max Jones Clip for paper and like material
US4508758A (en) * 1982-12-27 1985-04-02 At&T Technologies, Inc. Encapsulated electronic circuit
US4506416A (en) * 1983-02-09 1985-03-26 King Jim Co., Ltd. Paper clip
US4552818A (en) * 1984-05-10 1985-11-12 At&T Technologies, Inc. Silicone encapsulant containing porphyrin
DE3623766C1 (xx) * 1986-07-15 1987-06-11 Kurt 7307 Aichwald De Lorber

Also Published As

Publication number Publication date
DE69025221T2 (de) 1996-06-20
EP0389170A3 (en) 1992-02-26
DE69025221D1 (de) 1996-03-21
JPH02280345A (ja) 1990-11-16
ES2082823T3 (es) 1996-04-01
US4908935A (en) 1990-03-20
EP0389170A2 (en) 1990-09-26
JPH0584056B2 (xx) 1993-11-30
EP0389170B1 (en) 1996-02-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)