HK1253008A1 - 用於將利用uv輻射輻照的液體介質施加到基板上的裝置 - Google Patents
用於將利用uv輻射輻照的液體介質施加到基板上的裝置Info
- Publication number
- HK1253008A1 HK1253008A1 HK18112374.1A HK18112374A HK1253008A1 HK 1253008 A1 HK1253008 A1 HK 1253008A1 HK 18112374 A HK18112374 A HK 18112374A HK 1253008 A1 HK1253008 A1 HK 1253008A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- charged
- radiation
- applying
- substrate
- liquid medium
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Physical Water Treatments (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015011229.5A DE102015011229B4 (de) | 2015-08-27 | 2015-08-27 | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1253008A1 true HK1253008A1 (zh) | 2019-06-06 |
Family
ID=56889043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18112374.1A HK1253008A1 (zh) | 2015-08-27 | 2018-09-27 | 用於將利用uv輻射輻照的液體介質施加到基板上的裝置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US11090693B2 (zh) |
EP (1) | EP3341958B8 (zh) |
JP (1) | JP6676749B2 (zh) |
KR (1) | KR102103739B1 (zh) |
CN (2) | CN114653673A (zh) |
DE (1) | DE102015011229B4 (zh) |
HK (1) | HK1253008A1 (zh) |
RU (1) | RU2680112C1 (zh) |
TW (1) | TWI716437B (zh) |
WO (1) | WO2017032806A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017203351B4 (de) * | 2017-03-01 | 2021-08-05 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
US20230157799A1 (en) | 2019-06-30 | 2023-05-25 | Perimetrics, Llc | Determination of structural characteristics of an object |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04162516A (ja) * | 1990-10-25 | 1992-06-08 | Fujitsu Ltd | 光励起プロセス装置 |
TW252211B (zh) * | 1993-04-12 | 1995-07-21 | Cauldron Ltd Parthership | |
US5789755A (en) * | 1996-08-28 | 1998-08-04 | New Star Lasers, Inc. | Method and apparatus for removal of material utilizing near-blackbody radiator means |
JP4088810B2 (ja) * | 1998-09-01 | 2008-05-21 | リアライズ・アドバンストテクノロジ株式会社 | 基板洗浄装置及び基板洗浄方法 |
EP1098153B1 (de) * | 1999-11-05 | 2003-07-23 | Dr. Hönle AG | UV-Bestrahlungsvorrichtung |
JP4054159B2 (ja) * | 2000-03-08 | 2008-02-27 | 東京エレクトロン株式会社 | 基板処理方法及びその装置 |
JP2001300451A (ja) * | 2000-04-25 | 2001-10-30 | Hoya Schott Kk | 紫外光照射装置 |
RU2195046C2 (ru) * | 2000-06-15 | 2002-12-20 | Акционерное общество открытого типа "НИИ молекулярной электроники и завод "Микрон" | Способ очистки поверхности |
DE10130999A1 (de) * | 2000-06-29 | 2002-04-18 | D M S Co | Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben |
TWI251506B (en) | 2000-11-01 | 2006-03-21 | Shinetsu Eng Co Ltd | Excimer UV photo reactor |
JP2002298790A (ja) * | 2001-03-29 | 2002-10-11 | Shinetsu Engineering Kk | エキシマ照明装置 |
JP2003159571A (ja) * | 2001-11-27 | 2003-06-03 | Ushio Inc | 紫外線照射装置 |
JP3776092B2 (ja) * | 2003-03-25 | 2006-05-17 | 株式会社ルネサステクノロジ | エッチング装置、エッチング方法および半導体装置の製造方法 |
US7909595B2 (en) * | 2006-03-17 | 2011-03-22 | Applied Materials, Inc. | Apparatus and method for exposing a substrate to UV radiation using a reflector having both elliptical and parabolic reflective sections |
JP2008041998A (ja) * | 2006-08-08 | 2008-02-21 | Ushio Inc | 基板乾燥装置及び基板乾燥方法 |
JP4905049B2 (ja) * | 2006-10-17 | 2012-03-28 | 株式会社Gsユアサ | 紫外線照射装置及びそれの調整方法 |
JP2008108997A (ja) * | 2006-10-27 | 2008-05-08 | Shibuya Kogyo Co Ltd | 洗浄装置 |
DE102009058962B4 (de) | 2009-11-03 | 2012-12-27 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Verfahren und Vorrichtung zum Behandeln von Substraten |
JP2012049305A (ja) * | 2010-08-26 | 2012-03-08 | Hitachi High-Technologies Corp | 真空紫外光処理装置 |
CN103229277A (zh) * | 2010-11-30 | 2013-07-31 | 应用材料公司 | 用于在uv腔室中调节晶圆处理轮廓的方法及装置 |
JP5348156B2 (ja) | 2011-03-01 | 2013-11-20 | ウシオ電機株式会社 | 光照射装置 |
US9287154B2 (en) * | 2012-06-01 | 2016-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | UV curing system for semiconductors |
JP2014011256A (ja) * | 2012-06-28 | 2014-01-20 | Dainippon Screen Mfg Co Ltd | 熱処理方法および熱処理装置 |
TW201534409A (zh) * | 2013-11-22 | 2015-09-16 | Nomura Micro Science Kk | 紫外線穿透性基板的洗淨裝置及洗淨方法 |
DE102015011228B4 (de) * | 2015-08-27 | 2017-06-14 | Süss Microtec Photomask Equipment Gmbh & Co. Kg | Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat |
-
2015
- 2015-08-27 DE DE102015011229.5A patent/DE102015011229B4/de active Active
-
2016
- 2016-08-24 JP JP2018510738A patent/JP6676749B2/ja active Active
- 2016-08-24 CN CN202210317955.4A patent/CN114653673A/zh active Pending
- 2016-08-24 EP EP16762983.1A patent/EP3341958B8/de active Active
- 2016-08-24 CN CN201680049786.3A patent/CN108352340B/zh active Active
- 2016-08-24 KR KR1020187008502A patent/KR102103739B1/ko active IP Right Grant
- 2016-08-24 RU RU2018110426A patent/RU2680112C1/ru active
- 2016-08-24 US US15/751,194 patent/US11090693B2/en active Active
- 2016-08-24 WO PCT/EP2016/069989 patent/WO2017032806A1/de active Application Filing
- 2016-08-26 TW TW105127457A patent/TWI716437B/zh active
-
2018
- 2018-09-27 HK HK18112374.1A patent/HK1253008A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW201724228A (zh) | 2017-07-01 |
DE102015011229B4 (de) | 2020-07-23 |
WO2017032806A1 (de) | 2017-03-02 |
KR102103739B1 (ko) | 2020-04-23 |
DE102015011229A1 (de) | 2017-03-02 |
US20180221919A1 (en) | 2018-08-09 |
EP3341958B8 (de) | 2023-03-01 |
JP6676749B2 (ja) | 2020-04-08 |
EP3341958B1 (de) | 2022-06-15 |
JP2018528469A (ja) | 2018-09-27 |
KR20180048792A (ko) | 2018-05-10 |
CN114653673A (zh) | 2022-06-24 |
CN108352340B (zh) | 2022-03-29 |
EP3341958A1 (de) | 2018-07-04 |
US11090693B2 (en) | 2021-08-17 |
CN108352340A (zh) | 2018-07-31 |
TWI716437B (zh) | 2021-01-21 |
RU2680112C1 (ru) | 2019-02-15 |
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