HK1251356A1 - 連接材料 - Google Patents

連接材料

Info

Publication number
HK1251356A1
HK1251356A1 HK18110689.5A HK18110689A HK1251356A1 HK 1251356 A1 HK1251356 A1 HK 1251356A1 HK 18110689 A HK18110689 A HK 18110689A HK 1251356 A1 HK1251356 A1 HK 1251356A1
Authority
HK
Hong Kong
Prior art keywords
connection material
connection
Prior art date
Application number
HK18110689.5A
Other languages
English (en)
Inventor
Tatsuro Fukaya
Tomoyuki Ishimatsu
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1251356A1 publication Critical patent/HK1251356A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Non-Insulated Conductors (AREA)
HK18110689.5A 2015-09-18 2018-08-21 連接材料 HK1251356A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015185238A JP2017059471A (ja) 2015-09-18 2015-09-18 接続材料
PCT/JP2016/077197 WO2017047671A1 (ja) 2015-09-18 2016-09-14 接続材料

Publications (1)

Publication Number Publication Date
HK1251356A1 true HK1251356A1 (zh) 2019-01-25

Family

ID=58288944

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18110689.5A HK1251356A1 (zh) 2015-09-18 2018-08-21 連接材料

Country Status (5)

Country Link
JP (1) JP2017059471A (zh)
KR (3) KR20180036770A (zh)
CN (2) CN107925175A (zh)
HK (1) HK1251356A1 (zh)
WO (1) WO2017047671A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114068067A (zh) * 2017-09-20 2022-02-18 积水化学工业株式会社 含金属粒子、连接材料、连接结构体及其制造方法、导通检查用部件以及导通检查装置
CN113614852B (zh) * 2019-03-19 2024-07-09 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
JP2011175846A (ja) * 2010-02-24 2011-09-08 Hitachi Chem Co Ltd 回路部材接続用接着フィルム、回路部材接続構造体及び回路部材接続構造体の製造方法
JP5310750B2 (ja) * 2011-01-19 2013-10-09 デクセリアルズ株式会社 異方性導電フィルム
JP5529901B2 (ja) 2012-01-10 2014-06-25 積水化学工業株式会社 導電性粒子及び異方性導電材料
KR102095823B1 (ko) 2012-10-02 2020-04-01 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6212366B2 (ja) * 2013-08-09 2017-10-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
CN113410671A (zh) 2021-09-17
WO2017047671A1 (ja) 2017-03-23
KR20180036770A (ko) 2018-04-09
KR20200080337A (ko) 2020-07-06
KR20230013642A (ko) 2023-01-26
JP2017059471A (ja) 2017-03-23
KR102707315B1 (ko) 2024-09-19
CN107925175A (zh) 2018-04-17

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